• 한국통신학회논문지
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• 제27권4C호
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• pp.388-397
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• 2002

본 논문에서는 고성능 내장형 프로세서에서 멀티미디어 성능을 효과적으로 향상시킬 수 있는 SIMD-DSP/FPU를 설계하였다. 하드웨어 증가를 최소화하기 위해 기존 연산기의 분할 구조를 제시하였고 면적이 작은 연산기를 제안하였다. 연산기의 공유를 통해 FPU의 하드웨어 면적을 크게 줄였다. 제안된 구조는 HDL로 모델링되고 0.35 $\mu\textrm{m}$ 표준 셀 공정으로 합성되어, 약 십만 등가 게이트의 면적을 갖는 것으로 보고되었으며 최악조건에서 코어 주파수인 50MHz 이상으로 동작하는 것이 예상된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.342-345
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• 2002

As the size of chip components and module decreases, new patteming method for fine line and geometry is needed. So far, in LTCC(Low Temperature Cofired Ceramic) process, screen printing method has been used generally. But screen printing method has some disadvantages as follows. First, the geometry including line, vias, etc. smaller than $100{\mu}m$ can't be evaluated easily. Second, the patterned dimension is different from designed value, which makes distortion in charactersitics of not only chip components but also modules. Thick film lithography has advantages of thick film screen printing process, low cost and thin film process, fine line feasibility. Using this method, the line with $30{\mu}m$ width and the geometry with expected dimension can be evaluated. In this study, the fine line with $35{\mu}m$ line/space is formed and the embedded capacitor with very small tolerance is developed using thick film lithography.

• JSTS:Journal of Semiconductor Technology and Science
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• 제11권3호
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• pp.207-220
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• 2011

Coarse-grained reconfigurable architecture (CGRA) based embedded systems aims to achieve high system performance with sufficient flexibility to map a variety of applications. However, the CGRA has been considered as prohibitive one due to its significant area/power overhead and performance bottleneck. In this work, I propose reconfigurable multi-array architecture to reduce power/area and enhance performance in configurable embedded systems. The CGRA-based embedded systems that consist of hierarchical configurable computing arrays with varying size and communication speed were examined for multimedia and other applications. Experimental results show that the proposed approach reduces on-chip area by 22%, execution time by up to 72% and reduces power consumption by up to 55% when compared with the conventional CGRA-based architectures.

• 유체기계공업학회:학술대회논문집
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• 유체기계공업학회 2003년도 유체기계 연구개발 발표회 논문집
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• pp.535-540
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• 2003

In this Paper, a LON based distributed control system for HVAC is described. We developed multi-protocol converter based on SoC, Neuron Chip, embedded Linux. It utilizes the network environment and therefore requires an appropriate operating system for handling protocols and an advanced development environment. The open source licensing, reliability, and broad hardware support are key reasons for use of embedded Linux in embedded industry. The multi-prootocol converter integrates LonWorks devices to a client with Java applet. The system consists of three-tier architecture, such as clients, multi-protocol converter, and LonWorks devices. The experiment result show that multi-protocol converter using embedded Linux is a flexible and effective way to build a Web-based monitoring and control system.

• IEIE Transactions on Smart Processing and Computing
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• 제4권2호
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• pp.65-70
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• 2015

In this paper, we describe the world's first real-time ray-tracing chip architecture. Ray-tracing technology generates high-quality 3D graphics images better than current rasterization technology by providing four essential light effects: shadow, reflection, refraction and transmission. The real-time ray-tracing chip named RayChip includes a real-time ray-tracing graphics processing unit and an accelerating tree-building unit. An ARM Ltd. central processing unit (CPU) and other peripherals are also included to support all processes of 3D graphics applications. Using the accelerating tree-building unit named RayTree to minimize the CPU load, the chip uses a low-end CPU and decreases both silicon area and power consumption. The evaluation results with RayChip show appropriate performance to support real-time ray tracing in high-definition (HD) resolution, while the rendered images are scaled to full HD resolution. The chip also integrates the Linux operating system and the familiar OpenGL for Embedded Systems application programming interface for easy application development.

• 전기학회논문지
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• 제59권9호
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• pp.1615-1620
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• 2010

A thin film thermoelectric cooler for COB direct assembly was proposed and the COB cooler structure was modeled by electrical equivalent circuit by using SPICE model of thermoelectric devices. The embedded cooler attached between the die chip and metal plate can offer the possibility of thin film active cooling for the COB direct assembly. We proposed a driving method of TEC by using pulse width modulation technique. The optimum power to the TEC is simulated by using a SPICE model of thermoelectric device and passive components representing thermal resistance and capacitance. The measured and simulated results offer the possibility of thin film active cooling for the COB direct assembly.

• 음성과학
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• 제14권4호
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• pp.157-167
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• 2007

In this paper, we implemented a single-chip speech recognizer using the TMS320C2000 DSPs. For this implementation, we had developed very small-sized speaker-dependent recognition engine based on dynamic time warping, which is especially suited for embedded systems where the system resources are severely limited. We carried out some optimizations including speed optimization by programming time-critical functions in assembly language, and code size optimization and effective memory allocation. For the TMS320F2801 DSP which has 12Kbyte SRAM and 32Kbyte flash ROM, the recognizer developed can recognize 10 commands. For the TMS320F2808 DSP which has 36Kbyte SRAM and 128Kbyte flash ROM, it has additional capability of outputting the speech sound corresponding to the recognition result. The speech sounds for response, which are captured when the user trains commands, are encoded using ADPCM and saved on flash ROM. The single-chip recognizer needs few parts except for a DSP itself and an OP amp for amplifying microphone output and anti-aliasing. Therefore, this recognizer may play a similar role to dedicated speech recognition chips.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2008년도 춘계학술대회 논문집
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• pp.572-578
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• 2008

As the railway transportation is getting faster and its operation speed has increased rapidly, its signal control has been complicated. For real time signal processing it is very important to prohibit any critical error from causing the system to malfunction. Therefore, handling complicated signals effectively while maintaining fault-tolerance capability is highly expected in modern railway transportation industry. In this paper, we suggest an SoC (Sytem-on-Chip) design method to integrate these complicated signal controlling mechanism with fault tolerant capability in a single chip. We propose an SoC solution which contains a high performance 32-bit embedded processor, digital filters and a PWM unit inside a single chip to implement ATO's, ATC's, ATP's and ATS's digital signal-processing units. We achieve an enhanced reliability against the calculation error by adding fault tolerance features to ensure the stability of each module.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.249-250
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• 2008

In this paper, we propose the single polycrystalline silicon flash EEPROM IC with a new structure which does not need the high voltage switching circuit. The design of high voltage switching circuits which are needed for the data program and erase, has been an obstacle to develop the single-poly EEPROM. Therefore, we has proposed the new cell structure which uses the low voltage switching circuits and has designed the full chip. A new single-poly EEPROM cell is designed and the full chip including the control block, the analog block, row decoder block, and the datapath block is designed. And the each block is verified by using the computer simulation. In addition, the full chip layout is performed.

• 융합신호처리학회논문지
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• 제5권4호
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• pp.333-337
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• 2004

본 논문은 IEEE 802.11a 무선 LAN 규격을 OFDM을 적용한 5GHz 기저 대역의 송 수신부 모뎀을 설계하고 FPGA로 실현하였다. 고속 데이터 전송시 발생하는 심벌간 간섭(ISI)을 제거하기 위하여 Normalized LMS 알고리듬을 적용한 단일탬 등화기를 사용하여 제거하였고, 또한 반송파 주파수 옵셋 알고리듬을 이용하여 채널간 간섭(ICI)을 제거하였다. 송ㆍ수신기간의 전송은 에러없이 정확히 전송되어짐을 시뮬레이션을 통하여 입증하였으며, 또한 타이밍 시뮬레이션 결과 최대 동작주파수는 20.3MHz로 IEEE 802.11a 무선 LAN 방식의 동작속도를 만족하였다. 그리고 설계시 DSP와 EMB(Embedded Memory Block)블록을 사용하여 레지스터의 수를 상당히 줄일 수 있었다. 모뎀 설계는 VHDL를 이용하여 설계하고 Altera사의 Stratix EPIS25FC672 FPGA Chip을 사용하여 구현하였다.