• Proceedings of the Korea Information Processing Society Conference
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• 2017.04a
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• pp.587-590
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• 2017

전원 무결성은 PCB의 구조적 공진이 노이즈와 직접적으로 관련이 되어있고, 구조 해석을 위하여 전자장 해석법을 이용하게 된다. 전원 무결성 과정은 PCB의 공진해석을 통해 공진 발생 위치 및 주요 선로의 임피던스 분석을 하고 Decoupling 캐패시터와 레이아웃 수정을 통해 목표한 임피던스 값보다 낮아지도록 수정과 해석을 반복하는 작업이다. 제안된 방법을 통하여 PCB 제작 이전에 전자파 성능을 예측하고 개선하여 설계비용을 절감하고 신뢰성을 향상 시킬 수 있을 것으로 판단된다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.110-110
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• 2005

• Journal of Electrical Engineering and Technology
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• v.7 no.4
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• pp.582-588
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• 2012

In this paper, a highly miniaturized and performed UWB bandpass filter has been newly designed and implemented by embedding all the passive elements into a multi-layered PCB substrate with high dielectric $SrTiO_3$ composite film for 3.1 - 4.75 GHz compact UWB system applications. The high dielectric composite film was utilized to increase the capacitance densities and quality factors of capacitors embedded into the PCB. In order to reduce the size of the filter and avoid parasitic EM coupling between the embedded filter circuit elements, it was designed by using a $3^{rd}$ order Chebyshev circuit topology and a capacitive coupled transformation technology. Independent transmission zeros were also applied for improving the attenuation of the filter at the desired stopbands. The measured insertion and return losses in the passband were better than 1.68 and 12 dB, with a minimum value of 0.78 dB. The transmission zeros of the measured response were occurred at 2.2 and 5.15 GHz resulting in excellent suppressions of 31 and 20 dB at WLAN bands of 2.4 and 5.15 GHz, respectively. The size of the fabricated bandpass filter was $2.9{\times}2.8{\times}0.55(H)mm^3$.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2021.05a
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• pp.532-534
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• 2021

Design and simulation results of 920 MHz band PCB pattern antenna and reflector embedded in marine buoy were shown in this paper. It was confirmed through simulation that radiation angle was varied from bottom of buoy to top of buoy during the buoy floating in the sea.

• Proceedings of the Korean Magnestics Society Conference
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• 2004.12a
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• pp.173-174
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• 2004

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.02a
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• pp.61-71
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• 2004

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.110-113
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• 2008

Embedded capacitor technology is one of the effective packing technologies for further miniaturization and higher performance of electric packaging system. In this paper, the embedded capacitors were simulated and fabricated in 8-layered printed circuit board employing standard PCB processes. The composites of barium titanante($BaTiO_3$) powder and epoxy resin were employed for the dielectric materials in embedded capacitors. Theoretical considerations regarding the embedded capacitors have been paid to understand the frequency dependent impedance behavior. Frequency dependent impedance of simulated and fabricated embedded capacitors was investigated. Fabricated embedded capacitors have lower self resonance frequency values than that of the simulated embedded capacitors due to the increased parasitic inductance values. Frequency dependent capacitances of fabricated embedded capacitors were well matched with those of simulated embedded capacitors from the 100MHz to 10GHz range. Quality factor of 20 was observed and simulated at 2GHz range in the 10 pF embedded capacitors. Temperature dependent capacitance of fabricated embedded capacitors was presented.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.02a
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• pp.77-85
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• 2006

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.178-182
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• 2003

This paper presents the embedded inductors in PCB (Printed Circuit Board) for PAM(Power Amplifier Module) of mobile terminations. The inductors are designed, simulated, and compared to conventional chip inductors. The Quality factor(Q) and self-resonance frequency(SRF) of the inductors are evaluated. The quality factors of the inductors are two times higher than those of the chip inductors, and the self-resonance frequency is 1.3 times higher than those of chip inductors at the inductance of 2.7 nH and 3.3 nH respectively.

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.4
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• pp.295-301
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• 2011

A triple-band transceiver module for 2.3/2.5/3.5 GHz mobile WiMAX, IEEE 802.16e, applications is introduced. The suggested transceiver module consists of RFIC, reconfigurable/multi-resonance MIMO antenna, embedded PCB, mobile WiMAX base band, memory and channel selection front-end module. The RFIC is fabricated in $0.13{\mu}m$ RF CMOS process and has 3.5 dB noise figure(NF) of receiver and 1 dBm maximum power of transmitter with 68-pin QFN package, $8{\times}8\;mm^2$ area. The area reduction of transceiver module is achieved by using embedded PCB which decreases area by 9% of the area of transceiver module with normal PCB. The developed triple-band mobile WiMAX transceiver module is tested by performing radio conformance test(RCT) and measuring carrier to interference plus noise ratio (CINR) and received signal strength indication (RSSI) in each 2.3/2.5/3.5 GHz frequency.