• Title/Summary/Keyword: Electrostatic damage

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Dependence of Stress-Induced Leakage Current on Low Temperature Polycrystalline Silicon TFTs

  • Chen, Chih-Chiang;Chang, Jiun-Jye;Chuang, Ching-Sang;Wu, Yung-Fu;Sheu, Chai-Yuan
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.622-625
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    • 2003
  • The dependence of stress-induced leakage current on LTPS TFTs was characterized in this study. The impacts of poly-Si crystallization, gate insulator, impurity activation, hydrogenation process and electrostatic discharge damage were investigated. It was observed more TFTs instable characteristic under those process-assisted processes. According to the LTPS roadmap, smaller geometric and low temperature process were the future trend and the stress-induced leakage current should be worthy of remark.

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High-performance InGaN/GaN-based Light-emitting Diodes Using Advanced Technical Approaches

  • Jang, Ja-Soon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.108-108
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    • 2012
  • High-performance GaN-based light emitting diodes (LEDs) with high efficiency and excellent reliability have been of technological importance forapplications in full color display, automotive lighting, and solid state lighting. To realize high-performance and excellent-reliability LEDs, various technologies such as surface texturing, transparent conducting oxide, surface Plasmon, highly p-conduction layer, current blocking layer, photon-enhanced layer, and nanostructures have been extensively investigated. Among them, advanced core technologies based on how to suppress surface leakage and current crowding, how to enhance current injection efficiency and output power, and how to resist electrostatic damage will be displayed and discussed using our reported and preliminary results. New approaches like integrated LEDs will be also introduced and discussed.

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Effect of Relative Humidity, Disk Acceleration, and Rest Time on Tribocharge Build-up at a Slider-Disk Interface of HDD (HDD에서 상대습도, 디스크 가속도, 정지시간이 슬라이더-디스크 인터페이스의 마찰대전 발생에 미치는 영향)

  • Hwang J.;Lee D.Y.;Lee J.;Choa S.H.
    • Tribology and Lubricants
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    • v.22 no.2
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    • pp.59-65
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    • 2006
  • In hard disk drives as the head to disk spacing continues to decrease to facilitate recording densities, slider disk interactions have become much more severe due to direct contact of head and disk surfaces in both start/stop and flying cases. The slider disk interaction in CSS (contact-start-stop) mode is an important source of particle generation and tribocharge build-up. The tribocharge build-up in the slider disk interface can cause ESD (electrostatic discharge) damage. In turn, ESD can cause severe melting damage to MR or GMR heads. The spindle speed of typical hard disk drives has increased in recent years from 5400 rpm to 15000 rpm and even higher speeds are anticipated in the near future. And the increasing disk velocity leads to increasing disk acceleration and this might affect the tribocharging phenomena of the slider/disk interface. We investigated the tribocurrent/voltage build-up generated in HDD, operating at increasing disk accelerations. In addition, we examined the effects with relative humidity conditions and rest time. We found that the tribocurrent/voltage was generated during pico-slider/disk interaction and its level was about $3\sim16pA$ and $0.1\sim0.3V$, respectively. Tribocurrent/voltage build-up was reduced with increasing disk acceleration. Higher humidity conditions $(75\sim80%)$ produced lower levels tribovoltage/current. Therefore, a higher tribocharge is expected at a lower disk acceleration and lower relative humidity condition. Rest time affected the charge build-up at the slider-disk interface. The degree of tribocharge build-up increased with increasing rest time.

The Study of the Harmonic Currents Effects on the Transformer Vibration (고조파 전류가 변압기 진동에 미치는 영향에 관한 연구)

  • Kim, Su-Yeol;Kim, Yeon-Whan;Kim, Jang-Mok;Lim, Ik-Hun;Lee, Hyun
    • Journal of the Korean Society of Safety
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    • v.15 no.1
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    • pp.106-111
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    • 2000
  • EP(Electrostatic Precipitator) has been used to keep the natural environment from fly-ash in the industrial fields and operated in intermittent PEC(Pulse Energized Control) mode to improve dust-collecting efficiency. Intermittent PEC mode induces low-frequency harmonic currents into power system, therefore EP transformer vibrates. This continuous transformer vibration developes transformer abnormal audio-noise and if it is too much or operates in the region of natural frequency, transformer will be damaged in the end. EP interruption caused by transformer damage results in power generation stopped, power quality down and economic loss. Therefore, this paper explains harmonic currents and transformer vibration-core vibration, winding vibration, and proposes the measures of suppressing the vibration with EP operated in intermittent PEC mode. And this results is proposed to be used for future EP transformer design or EP control method to operate EP-concerned equipment safely keeping from system faults caused by transformer vibration.

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An Analysis of Damage Mechanism of Semiconductor Devices by ESD Using Field-induced Charged Device Model (유도대전소자모델(FCDM)을 이용한 ESD에 의한 반도체소자의 손상 메커니즘 해석)

  • 김두현;김상렬
    • Journal of the Korean Society of Safety
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    • v.16 no.2
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    • pp.57-62
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    • 2001
  • In order to analyze the mechanism of semiconductor device damages by ESD, this paper adopts a new charged-device model(CDM), field-induced charged nudel(FCDM), simulator that is suitable for rapid routine testing of semiconductor devices and provides a fast and inexpensive test that faithfully represents ESD hazards in plants. The high voltage applied to the device under test is raised by the fie]d of non-contacting electrodes in the FCDM simulator. which avoids premature device stressing and permits a faster test cycle. Discharge current md time are measured and calculated The FCDM simulator places the device at a huh voltage without transferring charge to it, by using a non-contacting electrode. The only charge transfer in the FCMD simulator happens during the discharge. This paper examine the field charging mechanism, measure device thresholds, and analyze failure modes. The FCDM simulator provides a Int and inexpensive test that faithfully represents factory ESD hazards. The damaged devices obtained in the simulator are analyzed and evaluated by SEM Also the results in this paper can be used for to prevent semiconductor devices from ESD hazards.

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Thin Film Passivation of Organic Light Emitting Diodes by Catalyzer Enhanced Chemical Vapor Deposition (CECVD) (촉매반응 화학기상증착법을 이용한 유기발광소자의 박막 봉지)

  • Kim, Han-Ki;Moon, J.M.;Bae, J.H.;Jeong, S.W.;Kim, M.S.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.71-72
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    • 2006
  • We report on plasma damage free chemical vapor deposition technique for the thin film passivation of organic light emitting diodes (OLEDs), organic thin film transistor (OTFT) and flexible displays using catalyzer enhanced chemical vapor deposition (CECVD). Specially designed CECVD system has a ladder-shaped tungsten catalyzer and movable electrostatic chuck for low temperature deposition process. The top emitting OLED with thin film $SiN_x$ passivation layer shows electrical and optical characteristics comparable to those of the OLED with glass encapsulation. This indicates that the CECVD technique is a promising candidate to grow high-quality thin film passivation layer on OLED, OTFT, and flexible displays.

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The Study of Comparison on Rapping Force on Generation of Corona Discharge Electrode of Electrostatic Precipitator (전기집진장치의 코로나 전류 발생 전극 제작에 따른 추타력 비교에 관한 연구)

  • Lee, Kang-Wuk;Park, Jeong-Ho;Jang, Seong-Ho;Lim, Woo-Taik;Suh, Jeong-Min
    • Journal of Environmental Science International
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    • v.26 no.2
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    • pp.231-238
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    • 2017
  • Rapid industrial development has led to a serious problem of pollution in the industrial sector. With the increasing social need for environmental protection, research on air pollution prevention equipment for reducing pollutants in industrial processes is actively being undertaken. The deterioration of existent, installed facilities, their increased emission rates, and the strengthening of the effluent quality standards make complying with permissible emission standards difficult. In fact, installing new electric precipitators or complementing existent facilities is inevitable. The expansion and complementation of the installed electrical precipitators have led to improvements in dust collection efficiency, shorter working times, and lower costs. Because of its easy installation and simple manufacturing process, the production method with the discharge electrode of an electric precipitator is widely used. The following conclusions were reached by classifying discharge electrodes into four types based on the production method and mutually comparing them by their dust collection efficiency. None of the four types used in this study were damaged by impact. However, we were able to confirm some strain from the compression sites of both type A and type B. Both type B and type C are expected to have greater dust collection efficiencies than the other models due to their large vibration transmissibility. Moreover, the high vibrational energy is expected to cause rapping damage during its operation. Particularly, in the case of type B, some of the strain was found at the end of the compression site. The coupling schemes of both type C and type D are out of vibration transmissibility. On the other hand, the ability to maintain straightness and solidity of the side is regarded as outstanding and stable. Type D has outstanding on-site workability, considering the presence of locking, structural stability, and work conditions. From these experiments, we determined that type C is the most ideal connection method of discharge electrode, considering its construction period of renovation. Type C is inferior to type D with regard to on-site workability. However, type C has outstanding dedusting transmission with regard to the straightness, solidity maintenance, and vibration of shearing stress.

Problems and Countermeasures in Installation of Down Conductor Systems (인하도선시스템 시설에서의 문제점과 대책)

  • 이복희;이동문;강성만;엄주홍;정동철;이승칠;안창환
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.16 no.4
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    • pp.38-45
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    • 2002
  • This paper describes the technical issues of the domestic standard and guideline for lightning protection systems in order to propose the countermeasures in damage of computer and electronic equipments due to lightning surges. The relationship between the current flow in the down conductor and the current flow in the steel conduit surrounding the down conductor was investigated as a function of the installation method of down conductors. Also the experiments were conducted to evaluate the influences of the skin effect on the down conductor systems. As a result, when the down conductor were bonded to the steel conduit, the down conductor and the steel conduit act as one conductor, so much mure lightning current flows in the steel conduit than in the copper down conductor because of the skin effect and choking effect. Therefore to reduce the adverse effects such as the electrostatic induction and side flashes caused by the potential rise of down conductors due to lightning currents, it is extremely effective to bond the down conductor to the steel conduit and steel frame of structures.

High Performance ESD/Surge Protection Capability of Bidirectional Flip Chip Transient Voltage Suppression Diodes

  • Pharkphoumy, Sakhone;Khurelbaatar, Zagarzusem;Janardhanam, Valliedu;Choi, Chel-Jong;Shim, Kyu-Hwan;Daoheung, Daoheung;Bouangeun, Bouangeun;Choi, Sang-Sik;Cho, Deok-Ho
    • Transactions on Electrical and Electronic Materials
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    • v.17 no.4
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    • pp.196-200
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    • 2016
  • We have developed new electrostatic discharge (ESD) protection devices with, bidirectional flip chip transient voltage suppression. The devices differ in their epitaxial (epi) layers, which were grown by reduced pressure chemical vapor deposition (RPCVD). Their ESD properties were characterized using current-voltage (I-V), capacitance-voltage (C-V) measurement, and ESD analysis, including IEC61000-4-2, surge, and transmission line pulse (TLP) methods. Two BD-FCTVS diodes consisting of either a thick (12 μm) or thin (6 μm), n-Si epi layer showed the same reverse voltage of 8 V, very small reverse current level, and symmetric I-V and C-V curves. The damage found near the corner of the metal pads indicates that the size and shape of the radius governs their failure modes. The BD-FCTVS device made with a thin n- epi layer showed better performance than that made with a thick one in terms of enhancement of the features of ESD robustness, reliability, and protection capability. Therefore, this works confirms that the optimization of device parameters in conjunction with the doping concentration and thickness of epi layers be used to achieve high performance ESD properties.

Assembly of Magnetic Nano-Fe3O4@GSH-Au NCs Core-Shell Microspheres for the Visualization of Latent Fingerprints

  • Huang, Rui;Tang, Tingting
    • Nano
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    • v.13 no.11
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    • pp.1850128.1-1850128.10
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    • 2018
  • Glutathione (GSH), the protective agent and reducing agent, has been widely used to prepare gold nanoclusters (GSH-Au NCs) with stable fluorescence properties and negative charge of the surface. Meanwhile, polyethyleneimine (PEI) was used as the modification agent to synthesize magnetic ferroferric oxide nanoparticles ($Fe_3O_4$) with fantastic dispersibility and positive charge of the surface. Based on the electrostatic adsorption force, magnetic nano-$Fe_3O_4@GSH-Au$ NCs core-shell microspheres composed of magnetic $Fe_3O_4$ nanoparticles modified by PEI as the core and GSH-Au NCs as the shell were assembled. The prepared $Fe_3O_4@GSH-Au$ NCs microspheres harbored a uniform size (88.6 nm), high magnetization (29.2 emu/g) and excellent fluorescence. Due to the coordination bond action between Au atom and sulfhydryl (-SH), amino ($-NH_2$), carboxyl (-COOH) in sweat, $Fe_3O_4@GSH-Au$ NCs could combine with latent fingerprints. In addition, $Fe_3O_4@GSH-Au$ NCs with good fluorescence and magnetism could detect fingerprints on various objects. Significantly, the powders were not easy to suspend in the air, which avoided the damage to the health of forensic experts and the fingerprints by only powder contacting. Above all, $Fe_3O_4@GSH-Au$ NCs was successfully applied to the latent fingerprint visualization, which has great potential in forensic science.