• 한국입자에어로졸학회지
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• 제19권3호
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• pp.63-76
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• 2023

An electrostatic precipitator (ESP) has a low pressure drop and a high collection efficiency but its collection efficiency can be reduced due to dust accumulation on the collection plates during long-term operations. In order to maintain the initial dust collection efficiency, it is necessary to periodically clean the collection plates. The common cleaning methods are using physical impacts or water sprays. These cleaning methods can lead to damage to the collection plate or generate wastewater. Herein, we implemented an electrodynamic screen (EDS) for ESP cleaning and evaluated its surface cleaning performance of particles. The EDS is an electrostatic system that can electrostatically repel particles on surfaces, allowing it to clean the ESP without causing damage and wastewater generation. Our evaluation included the analysis of the effects of AC voltage characteristics, electrode configuration and environmental conditions on the cleaning performance of the EDS with the aim of achieving effective surface cleaning. It has been demonstrated that activating the EDS cleans up to 65% of the particles on the surface, which indicates about 94% of our target cleaning zone.

• 한국정보통신설비학회:학술대회논문집
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• 한국정보통신설비학회 2006년도 하계학술대회
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• pp.208-211
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• 2006

In this paper, a tunable image rejection filter using two varactors is developed for mobile convergence. The filter is fabricated on a 0.25um substrate. ESD Pad is embedded to prevent damage caused by electrostatic discharge(ESD). Bias voltages are at WCDMA(2.1GHz). WiBro(2.3GHz), and WLAN(2.45) are 0.5V, 0.95V and 1.8V respectively. And the image rejection rations are more than 28dB at each band and insertion losses are less than 2dB at each band.

• 한국안전학회지
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• 제20권3호
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• pp.42-46
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• 2005

The static electricity by thinner flow and discharge energy is investigated experimentally for the purpose of preventing the electrostatic discharge and damage. Test system for evaluating streaming electrification consists of a teflon pipe, a reservoir tank a pump, flowmeters and an electrometer. When dielectric liquid flows through a pipe from one vessel to another, the potential difference generated in the collecting vessel is due to the accumulation of charges. These charges result from the convection of a part of the electrical double layer existing in the tube at the contact between the liquid and the inner wall. When the fluid velocity increases, the electric current increases proportionally. The charging current and accumulated charges by streaming electrification at the thinner velocity of 40cm/s are measured a range of 5 nA and $0.27{\mu}C$ respectively. This amount of static discharge energy generated by streaming electrification is enough to ignite flammable solvent. Therefore surface electric potential should decrease by using electrostatic shielding and ground.

• 전자공학회논문지A
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• 제30A권12호
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• pp.88-97
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• 1993

Electrostatic Discharge(ESD) is one of the major reliability, issues for today's VLSI production. Since the gate oxide with a thickness of 100~300$\AA$ is vulnerable to several thousand volt of ESD surge, it is necessary to control the ESD events and design an efficient protection circuit. In this paper, physical mechanism of the catastrophic ESD damage is investigated by transient analysis based upon Human Body Model(HBM). Using two-dimensional electrothermal simulator, we study the failure mechanism of the output protection devices by ESD and discuss the design issues for the optimun protection network.

• 한국표면공학회지
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• 제55권6호
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• pp.353-362
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• 2022

Recently, transmittance of photomasks for ultra-violet (UV) region is getting more important, as the light source wavelength of an exposure process is shortened due to the demand for technologies about high integration and miniaturization of devices. Meanwhile, such problems can occur as damages or the reduction of yield of photomask as electrostatic damage (ESD) occurs in the weak parts due to the accumulation of static electricity and the electric charge on chromium metal layers which are light shielding layers, caused by the repeated contacts and the peeling off between the photomask and the substrate during the exposure process. Accordingly, there have been studies to improve transmittance and antistatic performance through various functional coatings on the photomask surface. In the present study, we manufactured antireflection films of Nb₂O₅, | SiO₂ structure and antistatic films of ITO designed on 100 × 100 × 3 mmt sodalime glass by DC magnetron sputtering system so that photomask can maintain high transmittance at I-line (365 nm). ITO thin film deposited using In/Sn (10 wt.%) on sodalime glass was optimized to be 10 nm-thick, 3.0 × 103 𝛺/☐ sheet resistance, and about 80% transmittance, which was relatively low transmittance because of the absorption properties of ITO thin film. High average transmittance of 91.45% was obtained from a double side antireflection and antistatic thin films structure of Nb₂O₅ 64 nm | SiO₂ 41 nm | sodalime glass | ITO 10 nm | Nb₂O₅ 64 nm | SiO₂ 41 nm.

• 한국인터넷방송통신학회논문지
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• 제8권6호
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• pp.35-40
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• 2008

최근 사파이어기판 위에 성장한 갈륨나이트라이드 발광다이오드의 소자 제작 기술이 비약적으로 발전하였다. 하지만 이들 다이오드가 이미 상업적으로 활용되고 있다 할지라도 갈륨나이트라이드 발광다이오드에 있어서 다이오드를 구성하는 물질들과 소형화에 따른 정전기 방전에 의한 피해를 고려해야한다. 정전기방전(ESD)에 의한 피해는 발광소자의 신뢰성에 매우 큰 영향을 주는 파라미터중 하나이다. 본 연구에서는 대량생산 되는 발광다이오드의 생산공정에서 발생하는 정전기방전에 의한 피해와 이에 대한 대책을 논의하였다. 대부분의 ESD 문제는 장비의 적정한 사용과 공정 환경 개선을 통해서 제어되었다.

• 정보저장시스템학회:학술대회논문집
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• 정보저장시스템학회 2005년도 추계학술대회 논문집
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• pp.96-102
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• 2005

The tribocharge build-up in the slider disk interface can cause ESD (electrostatic discharge) damage. In turn, ESD can cause severe melting damage to MR or GMR heads. We investigated the tribovoltage/current build-up with smooth and textured disks in HDD, operating at increasing disk accelerations. We found that tribe-voltage/current were generated during pico-slider/disk interaction and those levels were about 0.1 ${\~}$ 0.3 V and 10 ${\~}$ 40 pA, respectively. Tribovoltage/current were abruptly increased and dissipated within the acceleration time in the case of textured disk but in the case of smooth disk tribovoltage was continuously increased until the end of uniform velocity region and the tribocurrent did not dissipate within the acceleration time. In the case of textured dist tribovoltage/current was reduced with increasing disk acceleration, but in the case of smooth disk it was increased.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1995년도 하계학술대회 논문집 C
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• pp.1419-1421
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• 1995

Nickel micro-structures are fabricated by electroless plating which shows better uniformity. Positive resist AZ4562 of 7 um thickness is patterned with minimum width of 2 um on poly-silicon as for sacrificial layer. The growth rate of Ni electroless plating is 10um/h both for the seed layer of Pt and TiW. TiW is found to be more practical than Pt, since it is very difficult to remove Pt with negligible damage to Ni structures.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 학술대회지
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• pp.455-459
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• 2004

Electrostatic discharge(ESD) is a serious reliability concern. It causes approximately most of all field failures of integrated circuits. Inevitably, future IC technologies will shrink the dimensions of interconnects, gate oxides, and junction depths, causing ICs to be increasingly susceptible to ESD-induced damage [1][2][3]. This thesis shows the optimization of the ESD protection circuit based on the tested results of MM (Machine Model) and HBM (Human Body Model), regardless of existing Reference in fully silicided 0.18 um CMOS process. His thesis found that, by the formation of silicide in a source and drain contact, the dimensions around the contact had a less influence on the ESD robustness and the channel width had a large influence on the ESD robustness [8].

• Applied Microscopy
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• 제45권4호
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• pp.208-213
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• 2015

Nanomanipulators installed in focused ion beam (FIB), which is used in the lift-out of lamella when preparing transmission electron microscopy specimens, have recently been employed for electrical resistance measurements, tensile and compression tests, and in situ reactions. During the pick-up process of a single nanowire (NW), there are crucial problems such as Pt, C and Ga contaminations, damage by ion beam, and adhesion force by electrostatic attraction and residual solvent. On the other hand, many empirical techniques should be considered for successful pick-up process, because NWs have the diverse size, shape, and angle on the growth substrate. The most important one in the in-situ precedence, therefore, is to select the optimum pick-up process of a single NW. Here we provide the advanced methodologies when manipulating NWs for in-situ mechanical and electrical measurements in FIB.