• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제53권4호
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• pp.225-230
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• 2004

An electromagnetic actuator has been designed and fabricated for Probe-based data storage applications. The actuator consists of permanent magnets(SmCo) housing and a media Platform which is connected to the Si frame by four couples of Si leaf springs. In order to generate electromagnetic force, Cu coils were electroplated under the media platform. The magnetic field distribution was calculated with 3D Finite Element Method of Maxwell 3D program. The field strength felt by Cu coils was estimated to be about 0.33T when the distance between the media platform and permanent magnets is $200\mu\textrm{m}$. The static and dynamic motions of the actuator were analyzed by FEM method with ANSYS 5.3. The measured displacements of the actuator were about $\pm$$92\mu\textrm{m}$ for input current of $\pm$40㎃ and the resonance frequency was 100Hz. The proposed electromagnetic actuator can be utilized for media driver of probe-based data storage system.

• 에너지공학
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• 제23권2호
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• pp.21-27
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• 2014

수직평판의 거칠기에 따른 자연대류 열전달의 변화를 실험적으로 측정하였다. 열전달 실험을 대신하여 유사성에 기초한 물질전달로 모사하여 실험을 수행하였다. 또한 국부적인 열전달률을 알기위해 Piecewise electrode를 채택하였다. Pr수는 2,014 그리고 높이(L)는 0.154m로 고정하고 매끈한 수직평판에 대해 실험을 수행한 결과 Le Fevre의 수직평판 상관식과 거의 일치하였다. 거칠기 정도를 $0.5R_z{\mu}m{\sim}14.1R_z{\mu}m$로 변화시켰을 때 $Nu_L$수는 거칠기 정도가 커지면서 증가하는 경향을 나타내었다. 실험결과는 간단한 상관식으로 정리하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.219-225
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• 2002

This paper presents a novel "bumpless flip chip package"for cost! performance driven devices. Using the conventional electroplating and etching processes, this package enables the production of fine pitch BGA up to 256 I/O with single layer routing. An array of circuitry down to $25-50{\mu}{\textrm}{m}$ line/space is fabricated to fan-in and fan-out of the bond pads without using bumps or substrate. Various types of joint methods can be applied to connect the fine trace and the bond pad directly. The resin-filled terminal provides excellent compliancy between package and the assembled board. More interestingly, the thin film routing is similar to wafer level packaging whereas the fan-out feature enables high lead count devices to be accommodated in the BGA format. Details of the design concepts and processing technology for this novel package are discussed. Trade offs to meet various cost or performance goals for selected applications are suggested. Finally, the importance of design integration early in the technology development cycle with die-level and system-level design teams is highlighted as critical to an optimal design for performance and cost.

• 한국산업보건학회지
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• 제10권1호
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• pp.179-207
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• 2000

Hazardous organic solvents management as prescribed by presidential decree in Korea is reviewed. The status of import, manufacture, and circulation of organic solvents was investigated. Problems inherent in the management of organic solvents in the electroplating, metal degreasing, and dry cleaning industries were discussed. The chemical substance management system in Korea was compared to those of foreign organizations. A walk-through check list was developed and then used to assess the actual conditions and potential hazards of chemical substances in these industries. The questionnaire could be used to develop a chemical management system and protect workers from hazardous substances. Based on the results of the site survey, MSDSs were not integrated appropriately into the workers education and were not readily accessible to employees. In the case of the dry cleaning industry, the new dry cleaning solvent used as a substitute includes a lot of potentially hazardous organic solvents. This research is preliminary. It is recommended that a national survey be performed to better identify the current situation. Because chemical substances are regulated by thirteen laws in seven executive branches, management systems often overlap, resulting in ineffective control. Using the above results, a model for managing chemical substances was developed. This will more efficiently provide MSDS information to workers covered by the presidential decree and allow the construction of a management system database for better cooperation with the executive branches in Korea.

• 한국자기학회지
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• 제8권4호
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• pp.241-248
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• 1998

본 연구에서는 micro magnetic device의 제작과 특성 분석을 위하여 고주파수 대역에서 사용가능한 자성체의 개발과 meander형 마이크로 코일의 가공 기술 확립에 그 목적을 두었다. 자성체로서는 DC magnetron reactive sputtering system에 의해 제조된 초 미세결정구조를 갖는 FeTaC, FeTaN막을 사용하였으며, 그 자기적 특성은 다음과 같다. Bs:13~17kG, Hc:0.1~0.2Oe, $\mu$':2000~4000. 전기 도금법에 의해 제작된 Cu코일은 2$\mu$$\Omega$-cm의 비저항을 나타내었으며, 공심형 5turn 언덕터의 경우에는 50nH의 인덕턴스와 700MHz의 공진 주파수 그리고 200MHz에서 30의 성능 지수를 보였다. 또한 meandergudxo의 폐자로 인덕터에서 인덕턴스는 150nH, 공진 주파수는 100MHz, 그리고 성능지수는 10~30 MHz에서 4의 값을 나타내었다.

• 에너지공학
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• 제23권2호
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• pp.13-20
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• 2014

헬리컬 코일이 덕트 내부에 있을 때, 기울기에 따른 자연대류 열전달을 실험적으로 측정하였다. 고부력 조건을 구현하기 위하여 유사성에 기초하여 열전달 실험을 대신하여 물질전달 실험을 수행하였다. RaD 수 $4.55{\times}10^6$에서, 턴(Turn) 수를 1~10, P/D를 1.3~5, 헬리컬 코일의 기울기를 $0^{\circ}{\sim}90^{\circ}$까지 변화시켰다. 헬리컬 코일의 턴 수가 1일 때, 측정된 $Nu_D$ 수는 McAdams의 수평관 자연대류 열전달 상관식과 거의 일치하였다. 기울어진 덕트 내 헬리컬 코일의 자연대류 열전달은 피치, 턴 수, 덕트 높이에 따라 복합적으로 변화하였고 이는 속도 효과, 굴뚝 효과, 예열 효과로 분석되었다. 본 연구의 결과는 Compact heat exchanger에서의 자연대류 열전달에 대한 현상학적 분석에 기여한다.

• 한국재료학회지
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• 제26권12호
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• pp.714-720
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• 2016

We performed this study to understand the effect of a single-crystalline anode on the mechanical properties of as-deposited films during electrochemical deposition. We used a (111) single- crystalline Cu plate as an anode, and Si substrates with Cr/Au conductive seed layers were prepared for the cathode. Electrodeposition was performed with a standard 3-electrode system in copper sulfate electrolyte. Interestingly, the grain boundaries of the as-deposited Cu thin films using single-crystalline Cu anode were not distinct; this is in contrast to the easily recognizable grain boundaries of the Cu thin films that were formed using a poly-crystalline Cu anode. Tensile testing was performed to obtain the mechanical properties of the Cu thin films. Ultimate tensile strength and elongation to failure of the Cu thin films fabricated using the (111) single-crystalline Cu anode were found to have increased by approximately 52 % and 37 %, respectively, compared with those values of the Cu thin films fabricated using apoly-crystalline Cu anode. We applied ultrasonic irradiation during electrodeposition to disturb the uniform stream; we then observed no single-crystalline anode effect. Consequently, it is presumed that the single-crystalline Cu anode can induce a directional/uniform stream of ions in the electrolyte that can create films with smeared grain boundaries, which boundaries strongly affect the mechanical properties of the electrodeposited Cu films.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.259-259
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• 2008

The LTCC (Low Temperature Co-fired Ceramic) technology meets the requirements for high quality microelectronic devices and microsystems application due to a very good electrical and mechanical properties, high reliability and stability as well as possibility of making integrated three dimensional microstructures. The wet process, which has been applied to the etching of the metallic thin film on the ceramic substrate, has multi process steps such as lithography and development and uses very toxic chemicals arising the environmental problems. The other side, Plasma technology like ion beam sputtering is clean process including surface cleaning and treatment, sputtering and etching of semiconductor devices, and environmental cleanup. In this study, metallic multilayer pattern was fabricated by the ion beam etching of Ti/Pd/Cu without the lithography. In the experiment, Alumina and LTCC were used as the substrate and Ti/Pd/Cu metallic multilayer was deposited by the DC-magnetron sputtering system. After the formation of Cu/Ni/Au multilayer pattern made by the photolithography and electroplating process, the Ti/Pd/Cu multilayer was dry-etched by using the low energy-high current ion-beam etching process. Because the electroplated Au layer was the masking barrier of the etching of Ti/Pd/Cu multilayer, the additional lithography was not necessary for the etching process. Xenon ion beam which having the high sputtering yield was irradiated and was used with various ion energy and current. The metallic pattern after the etching was optically examined and analyzed. The rate and phenomenon of the etching on each metallic layer were investigated with the diverse process condition such as ion-beam acceleration energy, current density, and etching time.

• 대한기계학회논문집A
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• 제29권10호
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• pp.1298-1306
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• 2005

In this paper, Part II, we realized the Serpentine Laminating Micromirer (SLM) which was proposed in the accompanying paper, Part I, by means of the injection molding process in mass production. In the SLM, the higher level of chaotic mixing can be achieved by combining two general chaotic mixing mechanisms of splitting/recombination and chaotic advection by the successive arrangement of 'F'-shape mixing units in two layers. Mold inserts for the injection molding process of the SLM were fabricated by SU-8 photolithography and nickel electroplating. The SLM was realized by injection molding of COC (cyclic olefin copolymer) with the fabricated mold inserts and thermal bonding of two injection molded COC substrates. To compare the mixing performance, a T-type micromixer was also fabricated. Mixing performances of micromixers were experimentally characterized in terms of an average mixing color intensity of a pH indicator, phenolphthalein. Experimental results show that the SLM has much better mixing performance than the I-type micromixer and chaotic mixing was successfully achieved from the SLM over the wide range of Reynolds number (Re). The chaotic micromixer, SLM proposed in this study, could be easily integrated in Micro-Total-Analysis- System , Lab-on-a-Chip and so on.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2001년도 추계학술발표회 초록집
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• pp.29-30
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• 2001

This paper presents some results of plasma nitriding on hard chromium deposit. The substrates were C45 steel and $30~50{\;}\mu\textrm{m}$ of chromium deposit by electroplating was formed. Plasma nitriding was carried out in a plasma nitriding system with $95NH_3{\;}+{\;}SCH_4$ atmosphere at the pressure about 600 Pa and different temperature from $450^{\circ}C{\;}to{\;}720^{\circ}C$ for various time. Optical microscopy and X-ray diffraction were used to evaluate the characteristics of surface nitride layer formed by nitrogen diffusion from plasma atmosphere inward iCr coating and interface carbide layer formed by carbon diffusion from substrate outward Cr coating. The microhardness was measured using microhareness tester at the load of 100 gf. Corrosion resistance was evaluated using the potentiodynamic measurement in 3.5% NaG solution. A saturated calomel electrode (SiCE) was used as the reference electrode. Fig.1 shows the typical microstructures of top surface and cross-section for nitrided and unnitrided samples. Aaer plasma nitriding a sandwich structure was formed consisting of surface nitride layer, center chromium layer and interface carbide layer. The thickness of nitride and carbide layers was increased with the increase of processing temperature and time. Hardness reached about 1000Hv after nitriding while 900Hv for unnitrided hard chromium deposit. X-ray diffraction indicated that surface nitrided layer was a mixture of $Cr_2N$ and CrN at low temperature and erN at high temperature (Fig.2). Anodic polarization curves showed that plasma nitriding can greatly improve the corrosion resistance of chromium e1ectrodeposit. After plasma nitriding, the corrosion potential moved to noble direction and passive current density was lower by 1 to 4 orders of magnitude compared with chromium deposit(Fig.3).