• 한국표면공학회지
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• 제8권2호
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• pp.1-6
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• 1975

A novel electroplating process is described and effects of anode lay-out thickness distribution and on platiting rate are discussed. Microphotograhic analysis indicates are compact and less "POROUS " than of barrel and rack. With this process production cost reduction and capacity increase could be achieved by a rate of 60% and 97% respectively, as compared to our present barrel plating process. This process disclose a number of beneficial processes such as color coding system on TO-92 package and development of a new tin bath formula.

• 대한기계학회논문집B
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• 제35권7호
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• pp.701-708
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• 2011

기울어진 평판에서 발생하는 자연대류 열전달현상을 $R_{a_L}$ $1.69{\times}10^{11}$과 $7.23{\times}10^{12}$에 대하여 실험적으로 연구하였다. 유사성을 이용하여 열전달실험을 물질전달 실험으로 대체하였고 물질전달계로 전기도금계를 사용하였다. 평판의 기울기는 상향수평에서 하향수평까지 $10^{\circ}$씩 변화시켰다. 하향평판에서는 수직 벽면에 대한 자연대류 열전달 상관식에서 g 대신 g $cos{\theta}$로 대체함으로써 열전달계수를 구할 수 있다는 기존의 이론과 일치하는 결과를 얻었다. 상향평판의 경우 경계층이 벽면을 따라 발달되는 경우와 벽면으로부터 박리되는 2가지 영역으로 구분되는데 박리에 따른 열전달 증가를 확인하였다. 아울러 도금패턴을 이용하여 박리지점을 시각화하였고 박리지점에 대한 분석이 수행되었다.

• 한국전기전자재료학회논문지
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• 제18권9호
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• pp.798-802
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• 2005

The plating shape in the opening of photoresist becomes gradated shape in the fountain plating system, because bubbles from the wafer surface are difficult to escape from the deep openings, vias. In this paper, the bubble flow from the wafer surface during plating process was studied and we designed the tilted electrode ring to get uniform bump height on all over the wafer and evaluated the film uniformity by SEM and $\alpha-step$. In a-step measurement, film uniformities in the fountain plating system and the tilted electrode ring contact system were $\pm16.6\%,\;\pm4\%$ respectively.

• 한국세라믹학회지
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• 제45권10호
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• pp.600-604
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• 2008

Although titanium-ceramic systems have gained substantial interests in dental prosthetic field, bonding problem between porcelain and titanium has not been solved. Main obstacle in titanium-porcelain bonding is excessive oxidation of titanium during porcelain firing. The effects of several coating materials on the bonding strength of titanium-porcelain system were investigated in this study. RF sputtering and electroplating of platinum significantly increased the bonding strength of porcelain-titanium specimen. However, coatings of Ni-Au, Ir, and ceramics(zirconia and hydroxyapatite) did not showed a significant effect on bonding strength. Platinum might be a promising material for the protective layer of excessive oxidation of titanium during porcelain firing, resulting in increase in the bonding strength.

• 한국산업보건학회지
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• 제3권1호
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• pp.110-126
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• 1993

Worker exposures to total chromium, hexavalent chromium (VI), sulfuric acid and alkaline dust at electroplating operations and worker exposures to trichloroethylene (TCE) and methyl chloroform (MCM) at degreasing operations in eleven small industrial plants were evaluated. Appropriate local exhaust ventilation systems for both operations were designed and recommended. Results of the study are summarized as follows ; 1. Out of 134 measurements for airborne hexavalent chromium concentrations, seven were exceeding the Korean occupational health standard of $50{\mu}g/m^3$ and 45 were exceeding the NIOSH standard of $1{\mu}g/m^3$. With an exception of one measurement, concentrations of total chromium were below the Korean standard of $500{\mu}g/m^3$. 2. Worker exposures to chromium were closely related to the existing control methods at the electroplating operations. Local exhaust systems, partial coverage of the tank surface, and antifoaming agents on liquid surface were adopted as control methods. 3. With an exception of one sample, airborne concentrations of sulfuric acid and alkaline dusts were below the applicable occupational heatlth standards. 4. Three plants indicated that airborne concentrations of TCE and MCM were exceeding the Korean standards. Other plants showed lower concentrations than the standards. It should be noted that generally, the activities and workloads on the day of surveys were less than normal. 5. Since the most existing ventilation systems did not satisfy the ACGIH criteria, the ventilation systems should be improved. Some examples for designing appropriate ventilation systems are presented.

• 한국산업보건학회지
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• 제3권1호
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• pp.68-77
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• 1993

To evaluate efficiencies of the local exhaust systems installed in chromiun and nickel eletroplating tanks, specifications of each tank and general performances of the local exhaust systems were measured in 16 electroplating plants from July 3 to November 24, 1992. Airborne concentrations of total chromium, hexa-chromium and nickel were also measured, Most of the local exhaust systems installed in electroplating plants were inadequately designed. Average capture velocities of local exhaust systems in chromium and nickel tanks were 0.45 m/sec and 0.29 m/sec. Average slot velocities in chromium and nickel tanks were 7.30 m/sec and 2.87 m/sec repectively. Both average capture and solt velocities were in noncompliance with the standards recommened by American Conference of Governmental Industrial Hygienists (ACGIH) and National Institute for Occupational Safety and Health (NIOSH), Exhausted air volume was insufficient in all local exhaust systems surveyed. Worker exposure levels to total chromium, hexa-chromium and nickel were $43.0{\mu}g/m^3$, $1.7{\mu}g/m^3$ and $9.3{\mu}g/m^3$, which were below the Korean Standard and U.S. Occupational Health and Safety Administration (OHSA) Permissible Exposure Limit(REL). However, Worker exposure level to hexa-chromium exceeded the NIOSH Recommended Exposure Limit(REL) of $1{\mu}g/m^3$. As the result of Scheffee's multiple comparions, worker exposure levels to all metals were significantly different between two groups by the management state of existing local exhaust systems (p<0.05). However, Difference between a group with local exhaust systems which were poorly managed and another group without local exhaust system was satatistically non-significant.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2014년도 추계학술대회 논문집
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• pp.214-214
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• 2014

Computational analysis of aqueous solution stability of Fe-Cr-Ni system to find an electroplating condition of Fe-Cr-Ni layer. Aqueous sulfate solution with iron, chromium and nickel ions was selected by using a numerical S/W with which aqueous solution stability was analyzed. Several possible conditions to perform electro-forming of Fe-Cr-Ni were selected with thermo-dynamical data. The Fe-Cr-Ni system was electro-formed which composition and microstructure of the electroplated Fe-Cr-Ni significantly depended on the solution temperature and electro-potential. The final composition of Fe-3%Cr-48%Ni with less than $30{\mu}m$ thick was well electroplated.

• 소성∙가공
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• 제13권3호
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• pp.279-284
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• 2004

Electroforming is the highly specialized use of electrodeposition for the manufacture of metal parts and basically a specialized form of electroplating. So, we can apply electrochemical system analysis for electroforming process. Electrochemical systems are concerned with the interplay between electricity and chemistry, namely the measurements of electrical quantities, such as current density, potential, and charge, and their relationship to chemical parameters. This paper based on the basic equations of electrics and electrochemical kinetics, was employed for a theoretical explanation of the current density distribution on electroforming process. We calculated current density distribution and potential distribution on cathode. Also, calculated current density distribution of vertical direction. It was shown that current density is related with distance of between anode and cathode and mass transfer process.

• Journal of Welding and Joining
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• 제24권2호
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• pp.64-70
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• 2006

The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.

• 대한기계학회논문집B
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• 제26권4호
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• pp.524-530
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• 2002

Micro electric spark discharge device was fabricated on a FOTURAN glass wafer using MEMS processing technique and its performance of electron discharge and subsequent formation of ignition kernel were tested. Micro electric spark device is an essential subsystem of a power MEMS that has been under development in this laboratories. In a combustion chamber of sub millimeter scale depth, spark electrodes are formed by electroplating Ni on a base plate of FOTURAN glass wafer. Optimization of spark voltage and spark gap is crucial for stable ignition and endurance of the electrodes. Namely, wider spark gaps insures stable ignition but requires higher ignition voltage to overcome the spark barrier. Also, electron discharge across larger voltage tends to erode the electrodes limiting the endurance of the overall system. In the present study, the discharge characteristics of the proptotype ignition device was measured in terms of electric quantities such as voltage and currant with spark gap and end shape as parameters. Discharge voltage shows a little decrease in width of less than 50㎛ and increases with electrode gap size. Reliability test shows no severe damage over 10$\^$6/ times of discharge test resulting in satisfactory performance for application to proposed power MEMS devices.