• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2017.05a
• /
• pp.123.1-123.1
• /
• 2017

Hybrid solar cells have intensively studied in recent years due to their advantages such as cost effectiveness and possibility of applications in flexible and transparent devices. It is critical to fabricate individual layer composed of organic and inorganic materials in the hybrid solar cell at low cost. Therefore, it is required to manufacture cheaply and enhance the photon-to-electricity conversion efficiency of each layer in the flexible solar cell industry. In this research, we fabricated pure Cu metal mesh electrode prepared by using electroplating and/or electroless plating on the Ni mold which was manufacture through photolithography, electroforming, and polishing process. Copper mesh was formed on the surface of nickel metal working master when pulsed electrolytic copper deposition were performed at various plating parameters such as plating time, current density, and so on. After electrodeposition at 2ASD for 5~30seconds, the line/pitch/thickness of copper mesh sheet was $1.8{\sim}2.0/298/0.5{\mu}m$.

• Advances in environmental research
• /
• v.3 no.4
• /
• pp.337-353
• /
• 2014

The determination of the effectiveness of the immobilization of blasting dust (waste generated in galvanic activities) in cement matrix, as well of mechanical, physical and microstructural properties of concrete paving blocks produced with partial replacement of cement was the objective of this work. The results showed that blasting dust has high percentage of silica in the composition and very fine particle size, characteristics that qualify it for replacement of cement in manufacturing concrete blocks. The replacement of Portland cement by up to 5% residues did not cause a significant loss in compressive strength nor increase in water absorption of the blocks. Chemical tests indicated that there is no problem of leaching or solubilization of contaminants to the environment during the useful life of the concrete blocks, since the solidification/stabilization process led to the immobilization of waste in the cement mass. Therefore, the use of blasting dust in the manufacture of concrete paving blocks is promising, thus being not only an alternative for proper disposal of such waste as well as a possibility of saving raw materials used in the construction industry.

• Laser Solutions
• /
• v.11 no.2
• /
• pp.26-32
• /
• 2008

Micro lens array (MLA) is widely used in information technology (IT) industry fields, for examples such as a projection display, an optical power regulator, a micro mass spectrometer and for medical appliances. Recently, MLA have been fabricated and developed by using a reflow method, micro etching, electroplating, micromachining and laser local heating. Laser local thermal-expansion (LLTE) technology demonstrates the formation of microdots on the surface of polymer substrate, in this paper. We have also investigated the new direct fabrication method of placing the MLA on the surface of a SU-8 photoresist layer. We have obtained the 3D shape of the micro lens processed by UV laser irradiation and have experimentally verified the optimal process conditions.

• Journal of Korean Society of Occupational and Environmental Hygiene
• /
• v.10 no.1
• /
• pp.179-207
• /
• 2000

Hazardous organic solvents management as prescribed by presidential decree in Korea is reviewed. The status of import, manufacture, and circulation of organic solvents was investigated. Problems inherent in the management of organic solvents in the electroplating, metal degreasing, and dry cleaning industries were discussed. The chemical substance management system in Korea was compared to those of foreign organizations. A walk-through check list was developed and then used to assess the actual conditions and potential hazards of chemical substances in these industries. The questionnaire could be used to develop a chemical management system and protect workers from hazardous substances. Based on the results of the site survey, MSDSs were not integrated appropriately into the workers education and were not readily accessible to employees. In the case of the dry cleaning industry, the new dry cleaning solvent used as a substitute includes a lot of potentially hazardous organic solvents. This research is preliminary. It is recommended that a national survey be performed to better identify the current situation. Because chemical substances are regulated by thirteen laws in seven executive branches, management systems often overlap, resulting in ineffective control. Using the above results, a model for managing chemical substances was developed. This will more efficiently provide MSDS information to workers covered by the presidential decree and allow the construction of a management system database for better cooperation with the executive branches in Korea.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.07a
• /
• pp.366-369
• /
• 2003

The vertical fountain plating system with the point contact has been used in semiconductor industry. But the plating shape in the opening of photoresist becomes gradated shape, because bubbles from the wafer surface are difficult to escape from the deep openings, vias. So, we designed the tilted electrode ring contact to get uniform bump height on all over the wafer and evaluated the film uniformity by SEM and $\alpha$-step. A photoresist was coated to a thickness of $60{\mu}m$ and vias were patterned by a contact aligner After via opening, solder layer was electroplated using the fountain plating system and the tilted electrode ring contact system. In $\alpha$-step measurement, film uniformities in the fountain plating system and the tilted electrode ring contact system were ${\pm}16%,\;{\pm}3.7%$ respectively. In this study, we could get high uniformity bumps by the tilted electrode ring contact system. So, tilted electrode ring contact system is expected to improve workability and yield in module process.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2000.11a
• /
• pp.1-2
• /
• 2000

In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the onventional rotating barrel, vibrational barrel(vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components. The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed thatbthe average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value. Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components. However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. 2H20 + e $\rightarrow$M/TEX> 20H + H2.. Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure there by resulting to bad plating condition.

• Advances in nano research
• /
• v.12 no.5
• /
• pp.457-465
• /
• 2022

The potentials of Ni_xZn_1-xFe₂O₄ (x = 0.0, 0.2, 0.4, 0.6, 0.8 and 1.0) nanoadsorbents were investigated for removal of Cd and Cr from contaminated water from an electroplating industry in Himachal Pradesh, India. Optimal values were recorded under batch adsorption experiments performed to remove dissolved heavy metal ions from industrial wastewater. The specific surface area (SSA) of nanoadsorbents perceived to vary in a range 35.75-45.29 cm²/g and was calculated from the XRD data. The influence of two operating parameters, contact time and dopant (Ni) concentration was also investigated at pH ~7 with optimum dosage. Kinetic studies were conducted within a time range of 2-10 min with rapid adsorption of cadmium and chromium ions onto Ni_0.2Zn_0.8Fe₂O₄ nanoadsorbents. Pseudo-second-order kinetic model was observed to be well fitted with the adsorption data that confirmed the only existence of chemisorption throughout the adsorption process. The maximum adsorption efficiency values observed for Cd and Cr were 51.4 mg/g and 40.12 mg/g, respectively for different compositions of prepared series of nanoadsorbents. The removal percentage of Cd and Cr was found to vary in a range of 47.7%-95.25% and 21%-50% respectively. The prepared series of nanoferrite found to be suitable enough for adsorption of both heavy metal ions.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2018.06a
• /
• pp.102-102
• /
• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• Journal of Korean Society of Environmental Engineers
• /
• v.29 no.12
• /
• pp.1381-1389
• /
• 2007

Wastewater discharged by industrial activities of metal finishing and electroplating units is often contaminated by a variety of toxic or otherwise harmful substances which have a negative effects on the water environment. The treatment method of heavy metal-cyanide complexes wastewater by alkaline chlorination have already well-known($1^{st}$ Oxidation: pH 10, reaction time 30 min, ORP 350 mV, $2^{nd}$ Oxidation: ORP 650 mV). In this case, the efficiency for the removal of ferro/ferri cyanide by this general alkaline chlorination is very high as 99%. But the permissible limit of Korean waste-water discharge couldn't be satisfied. The initial concentration of cyanide was 374 mg/L(the Korean permissible limit of cyanide is 1.0 mg/L max.). So a particular focus was given to the treatment of heavy metal-cyanide complexes wastewater by $Zn^{+2}/Fe^{+2}$ ion and coprecipitation after alkaline chlorination. And we could meet the Korean permissible limit of cyanide(the final concentration of cyanide: 0.30 mg/L) by $Zn^{+2}/Fe^{+2}$ ion and coprecipitation(reaction time: 30 min, pH: 8.0, rpm: 240). The removal of Chromium ion by reduction(pH: 2.0 max, ORP: 250 mV) and the precipitation of metal hydroxide(pH: 9.5) is treated as 99% of removal efficiency. The removal of Copper and Nickel ion has been treated by $Na_2S$ coagulation-flocculation as 99% min of the efficiency(pH: $9.09\sim10.0$, dosage of $Na_2S:0.5\sim3.0$ mol). It is important to note that the removal of ferro/ferri cyanide of heavy metal-cyanide complexes wastewater should be employed by $Zn^{+2}/Fe^{+2}$ ion and coprecipitation as well as the alkaline chlorination for the Korean permissible limit of waste-water discharge.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.2
• /
• pp.67-72
• /
• 2012

In recent days, the wire width of IC is narrowed and the degree of integration of IC is increased to obtain the higher capacity of the devices in electronic industry. And then the surface quality of FCCL(Flexible Copper Clad Laminate) became increasingly important. Surface defects on FCCL are bump, scratch, dent and so on. In particular, bumps cause low reliability of the products. Even though there are bumps on the surface, if leveling characteristic of plating solution is good, it does not develop significant bump. In this study, the leveling characteristics of additives are investigated. The objective of study is to improve the leveling characteristic and reduce the surface step through additives and plating conditions. The additives in the electrodeposition bath are critical to obtain flat surface and free of defects. In order to form flat copper surface, accelerator, suppressor and leveler are added to the stock solution. The reason for the addition of leveler is planarization surface and inhibition of the formation of micro-bump. Levelers (SO(Safranin O), MV(Methylene Violet), AB(Alcian Blue), JGB(Janus Green B), DB(Diazine Black) and PVP(Polyvinyl Pyrrolidone) are used in copper plating solution to enhance the morphology of electroplated copper. In this study, the nucleation and growth behavior of copper with variation of additives are studied. The leveling characteristics are analyzed on artificially fabricated Ni bumps.