• 한국자기학회지
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• 제24권6호
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• pp.186-190
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• 2014

뫼스바우어 선원 $^{57}Co/Cu$의 제조조건을 도출하기 위하여, 금속 분말 코발트(Co)를 황산에 용해시킨 후 $H_3BO_3$, KOH와 NaCl을 첨가하여 Sulfamate 도금용액을 제조 후 Cu plate 기판에 도금하였다. 도금두께는 $4{\mu}m$로 일정하게 유지하였다. 전류밀도를 $2mA/cm^2$와 $30mA/cm^2$로 유지하면서 pH에 변화를 준 결과 pH가 4 이상으로 증가하면 hcp 결정의 Co 금속 이외의 2차상이 생성되었다. pH가 증가할수록 Co 후막 표면이 거칠어 졌으며 균열된 표면형상을 관찰하였다. pH가 5까지 증가할 경우 평균입도는 54 nmfh 증가함을 확인하였다. 열처리조건을 변화시키면서 Co가 Cu기지 내에 구속되는 온도가 $900^{\circ}C$에서 2 h임을 확인하였다. 열처리는 진공 후 Ar 분위기(1.5 l/min)를 유지하면서 수행하였다.

• 한국표면공학회지
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• 제43권6호
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• pp.289-296
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• 2010

The effect of organic additives, thiourea (TU), on the copper electroplated layer of large rectangular size was investigated through physical and various electrochemical techniques. It was found that TU had strong adsorption characteristics on the Ni substrate and affected the initial electroplating process by inducing surface reaction instead of mass transfer in the bulk solution. TU additives had its critical micelle concentration at 200 ppm in copper sulphate solution and showed abrupt change in morphological and electrochemical impedance spectroscopic results around this concentration, which could be related with the destruction of adsorption structure of TU-Cu(I) complex formed at the Ni substrate surface. By conducting a commercial electroplating simulation, when TU additives was included at cmc in the plating solution, it acted as a depolarizer for copper electrodeposition and was effective to reduce the unevenness of copper deposits between centre and edge region at high current densities of 10 ASD.

• 전기학회논문지
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• 제67권12호
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• pp.1626-1632
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• 2018

In this paper, we describe the fabrication and characterization of a hydrogen peroxide ($H_2O_2$) sensor based on palladium and copper (PdCu) electroplated laser induced graphene (LIG) electrodes. $CO_2$ laser was used to form LIG electrodes on a PI film. This fabrication method allows simple control of the LIG electrode size and shape. The PdCu was electrochemically deposited on the LIG electrodes to improve the electrocatalytic reaction with $H_2O_2$. The electrochemical performance of this sensor was evaluated in terms of selectivity, sensitivity, and linearity. The physical characterization of this sensor was conducted using scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS), which confirmed that PdCu was formed on the laser induced graphene electrode. In order to increase the sensor sensitivity, the Pd:Cu ratio of the electroplated PdCu was varied to five different values and the condition of highest amperometric current at an identical of $H_2O_2$ concentration was chosen among them. The resulting amperometric current was highest when the ratio of Pd:Cu was 7:3 and this Pd;Cu ratio was employed in the sensor fabrication. The fabricated PdCu/LIG electrode based $H_2O_2$ sensor exhibited a sensitivity of $139.4{\mu}A/mM{\cdot}cm^2$, a broad linear range between 0 mM and 16 mM of $H_2O_2$ concentrations at applied potential of -0.15 V, and high reproducibility (RSD = 2.6%). The selectivity of the fabricated sensors was also evaluated by applying ascorbic acid, glucose, and lactose separately onto the sensor in order to see if the sensor ourput is affected by one of them and the sensor output was not affected. In conclusion, the proposed PdCu/LIG electrode based $H_2O_2$ sensor seems to be suitable $H_2O_2$ sensor in various applications.

• 한국재료학회지
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• 제30권4호
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• pp.160-168
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• 2020

The current density in copper electroplating is directly related with the productivity; then, to increase the productivity, an increase in current density is required. This study is based on an analysis of changes in surface characteristics and mechanical properties by applying the addition of Alcian Blue (AB, C₅₆H₆₈Cl₄CuN₁₆S₄). The amount of Alcian Blue in the electrolytes is changed from 0 to 100 ppm. When Alcian Blue is added at 20 ppm, a seed layer is formed homogeneously on the surface at the initial stage of nucleation. However, crystals electroplated in electrolytes with more than 40 ppm of Alcian Blue are observed to have growth in the vertical direction on the surface and the shapes are like pyramids. This tendency of initial nucleation formation causes protrusions when the thickness of copper foil is 12 ㎛. Thereafter, a lot of extrusions are observed on the group of 100 ppm Alcian Blue. Tensile strength of groups with added Alcian Blue increased by more than 140% compare to no-addition group, but elongation is reduced. These results are due to the decrease of crystal size and changes of prior crystal growth plane from (111) and (200) to (220) due to Alcian Blue.

• 한국자기학회지
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• 제15권3호
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• pp.198-201
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• 2005

전기도금 방법으로 제작된 니켈과 니켈-구리 합금박막에 미치는 유기첨가제(organic additive)의 영향을 조사하였다. 유기첨가제를 가하여 도금하는 니켈 박막의 경우 순수한 전해액만을 이용하여 도금한 박막과는 다른 결정성을 갖는다 도금조건을 일정하게 한 후 니켈-구리의 합금 박막용 전해액에 유기첨가제를 가하면 구리와 니켈의 조성비율이 변화하는데 유기첨가제의 성분과 농도에 따라 니켈의 함유율이 $65\~95\%$ 영역에서 조절이 가능하다. 유기첨가제에 의한 이러한 물성의 변화는 자성의 변화를 유도하여 도금 박막의 자기저항의 증가와 감소에도 기여하는 것으로 나타났다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2014년도 추계학술대회 논문집
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• pp.122-122
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• 2014

본 연구에서는 micro-hardening을 통한 고강도 고연성 전해동박을 제조하기 위해 Sn, Co, Zn 등의 원소 첨가량, 전류밀도, 전해액 온도, 첨가제 제어 등의 공정조건 변화에 따른 전해동박층의 표면 형상, 조성 및 전기전도도를 평가하였고, 인장강도와 연신율을 평가하였다.

• Environmental Sciences Bulletin of The Korean Environmental Sciences Society
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• 제10권S_3호
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• pp.139-148
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• 2001

Heavy metals such as Cu, Ni, Cd, and Pb were chemically extract from the contaminated soils using the chelating agents, EDTA and DTPA. These chemical extraction have been focused on its applicability to a wide range of soils. Results of extractive efficiency for heavy metal follow the order : Cu-EDTA $\geq$ Ni-EDTA > Pb-EDTA > Cd-EDTA > Cu-DTPA> Pb-DTPA. This result is coincided with order of conditional formation constants(Kr) of metal-chelate agent. The second study involved the recovery of the metals and EDTA from complex solutions by an electromembrane process. The overall processes of regeneration, recovery, and reuse were evaluated. The electrochemical studies showed that copper could be chosen as an electrode to plate Cd, Cu, and Pb. At least 95% of 75 of EDTA and associated Cu or Pb could be recovered by the electromembrane process. Recovery of Cd by electodeposition was not possible with the copper electrode. The percent EDTA recovery is equal to the percentage of metal electroplated from the chelates.

• 한국재료학회지
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• 제19권3호
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• pp.151-155
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• 2009

Micro-scale copper bumps for build-up PCB were electroplated using a pulse-reverse method. The effects of the current density, pulse-reverse ratio and brightener concentration of the electroplating process were investigated and optimized for suitable performance. The electroplated micro-bumps were characterized using various analytical tools, including an optical microscope, a scanning electron microscope and an atomic force microscope. Surface analysis results showed that the electroplating uniformity was viable in a current density range of 1.4-3.0 A/$dm^2$ at a pulse-reverse ratio of 1. To investigate the brightener concentration on the electroplating properties, the current density value was fixed at 3.0 A/$dm^2$ as a dense microstructure was achieved at this current density. The brightener concentration was varied from 0.05 to 0.3 ml/L to study the effect of the concentration. The optimum concentration for micro-bump electroplating was found to be 0.05 ml/L based on the examination of the electroplating properties of the bump shape, roughness and grain size.

• 한국재료학회지
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• 제23권10호
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• pp.550-554
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• 2013

As continued scaling becomes increasingly difficult, 3D integration has emerged as a viable solution to achieve higher bandwidths and good power efficiency. 3D integration can be defined as a technology involving the stacking of multiple processed wafers containing integrated circuits on top of each other with vertical interconnects between the wafers. This type of 3D structure can improve performance levels, enable the integration of devices with incompatible process flows, and reduce form factors. Through silicon vias (TSVs), which directly connect stacked structures die-to-die, are an enabling technology for future 3D integrated systems. TSVs filled with copper using an electro-plating method are investigated in this study. DC and pulses are used as a current source for the electro-plating process as a means of via filling. A TiN barrier and Ru seed layers are deposited by plasma-enhanced atomic layer deposition (PEALD) with thicknesses of 10 and 30 nm, respectively. All samples electroplated by the DC current showed defects, even with additives. However, the samples electroplated by the pulse current showed defect-free super-filled via structures. The optimized condition for defect-free bottom-up super-filling was established by adjusting the additive concentrations in the basic plating solution of copper sulfate. The optimized concentrations of JGB and SPS were found to be 10 and 20 ppm, respectively.

• 대한기계학회논문집A
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• 제25권1호
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• pp.16-24
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• 2001

This paper presents an electromagnetic microactuator using the copper coil electroplated on the p+silicon diaphragm. The microactuator generates a vertical motion of the diaphragm using the radial direction, we propose a new actuator structure with twin magnets. The microactuator field in the radial direction, we propose a new actuator structure with twin magnets. The microactator shows a values of resonant frequency and quality factor in the ranges of 10.51${\pm}$0.22kHz and 46.6${\pm}$3.3, respectively. The twin magnet microactuator generates the maximum peak-to-peak amplitude of 4.4$\mu\textrm{m}$ for the AC rms current of 26.8mA, showing 2.4 times larger amplitude than the single magnet microactuator.