• 제목/요약/키워드: Electronic scrap

검색결과 36건 처리시간 0.016초

곰팡이균(Aspergillus niger)을 이용(利用)한 전자스크랩중 유가금속(有價金屬)의 미생물(微生物) 침출(浸出) 연구(硏究) (Bioleaching of valuable metals from electronic scrap using fungi(Aspergillus niger) as a microorganism)

  • 안재우;정진기;이재춘;김동진
    • 자원리싸이클링
    • /
    • 제14권5호
    • /
    • pp.24-31
    • /
    • 2005
  • 폐전자스크랩에서 유가금속을 회수하기 위하여 곰팡이균으로 Aspergillus niger를 이용한 Cu, Zn, Al, Co, Ni, Fe, Sn, Pb의 침출 거동을 조사하였다. Aspergillus niger는 전자스크랩의 존재 하에 배양이 가능하였고 신진대사 작용에 의해 유기산(구연산 및 옥살산)을 생성함으로써 폐전자스크랩에서 각 금속들을 침출시키는 것을 알 수 있었다. 예비실험으로 먼저 구연산 및 옥살산을 이용한 화학침출 실험으로부터 Cu, Zn, Al, Co, Fe, Sn, Pb의 침출거동을 조사하였다. Aspergillus niger를 이용한 미생물 침출 실험의 결과 전자스크랩의 농도가 50g/L인 경우 Cu 및 Co의 침출율은 95%이상이었고, Al, Zn, Pb 및 Sn의 경우는 15-35%의 침출율을 나타냈으며 Ni 및 Fe의 경우는 10%이하의 침출율을 보였다.

폐동(廢銅)슬래그를 활용(活用)한 폐전기전자(廢電氣電子) 스크랩으로부터 유가금속(有價金屬) 고온용융추출(高溫鎔融抽出) 공정(工程) 개발(開發) (A Novel Process for Extracting Valuable Metals from Waste Electric and Electronic Scrap Using Waste Copper Slag by a High temperature Melting Method)

  • 김병수;이재천;이광호
    • 자원리싸이클링
    • /
    • 제16권3호
    • /
    • pp.27-33
    • /
    • 2007
  • 구리, 주석 등의 유가금속을 다량 함유하고 있는 폐전기전자 스크랩으로부터 유가금속을 회수하는 것은 자원 재활용 측면에서 매우 중요하다. 본 연구에서는 폐동슬래그를 슬래그 형성제로 활용하여 폐전기전자 스크랩으로부터 유가금속을 추출하기 위한 새로운 공정이 제시되었다. 제안된 공정은 슬래그 형성제로 동 제련소에서 배출되는 폐동슬래그를 재활용한다는 장점이 있다. 각 실험에서는 일정한 비율로 혼합된 폐전기전자 스크랩과 폐동슬래그의 혼합시료를 보조 슬래그 형성제인 CaO와 함께 고온 용융되었다. 실험 결과 폐전기전자 스크랩에 함유된 구리와 주석이 Cu-Fe-Sn 합금상으로 각각 95% 이상, 85% 이상 추출되었다.

알루미늄 스크랩을 이용하여 제작한 접지 전극의 전압-전류 특성 (I-V characteristics of ground electrode fabricated using an aluminium scrap)

  • 이우선;정용호;박진성
    • E2M - 전기 전자와 첨단 소재
    • /
    • 제9권8호
    • /
    • pp.806-812
    • /
    • 1996
  • I-V characteristics of ground electrode fabricated using an aluminium scrap are presented. We fabricated several shapes of aluminium scraps and aluminium electrodes. The results show that the current of aluminium electrode increased linearly by the voltage increase. AC breakdown voltage of copper plate electrode was higher than that of aluminium electrode. AC breakdown current of aluminium electrode was higher than that of copper plate electrode. As applied voltage increased, grounding resistance of aluminum electrode decreased linearly.

  • PDF

Aspergillusniger를 이용한 전자스크랩의 미생물 침출 연구 (Bioleaching of electronic scrap using Aspergillus niger)

  • 안재우;정진기;이재천;김동진;안종관
    • 한국자원리싸이클링학회:학술대회논문집
    • /
    • 한국자원리싸이클링학회 2005년도 춘계임시총회 및 제25회 학술발표대회
    • /
    • pp.214-223
    • /
    • 2005
  • In order to recover valuable metals from fine-grained electronic waste, bioleaching of Cu, Zn, Al, Co, Ni, Sn and Pb were carried out using Aspergillus niger as a leaching microorganism in a shaking flask. Aspergillus niger was able to grow in tile presence of electronic scrap. The formation of organic acids(citric and oxalic acid) from Aspergillus niger caused the mobilization of metals from waste electronic scrap. In a preliminary study, in order to obtain the data on the leaching of Cu, Zn, Al, Co and Ni, the metal leaching behaviours were accomplished using Organic acid(Citric acid and Oxalic acid) instead of Aspergillus niger. At the electronic scrap concentration of 50g/L, Aspergillus niger were able to leach more than 95% of the available Cu, Co. But Al, Zn, Pband Sn were able to leach about 15-35%. Ni and Fe were detected in the leachate less than 10%.

  • PDF

솔더 스크랩의 재생을 위한 전처리 공정 (Pretreatment Process for the Reuse of Solder Scrap)

  • 정우광;김병수;이재천
    • 한국재료학회지
    • /
    • 제21권12호
    • /
    • pp.673-678
    • /
    • 2011
  • With an increased production of Printed Circuit Boards (PCBs) in electronic equipment, the consumption of solder alloys is growing globally. Recently, increasing importance of recycling solder scrap has been recognized. Generally, solder scrap contains many impurities such as plastics and other metals. Hazardous components must be eliminated for recycling solder scrap. The present work studied pretreatment for reuse of solder scrap alloys. An experiment was conducted to enhance the cleanliness of solder scrap melt and eliminate impurities, especially lead. Physical separation with sieving and magnetic force was made along with pyrometallurgical methods. A small decrease in lead concentration was found by high temperature treatment of solder scrap melt. The impurities were removed by filtration of the solder scrap melt, which resulted in improvement of the melt cleanliness. A very low concentration of lead was achieved by a zone melting treatment with repeated passage. This study reports on a pretreatment process for the reuse of solder scrap that is lead free.

Recovery of Gold from Electronic Scrap by Hydrometallurgical Process

  • Lee, Churl-Kyoung;Rhee, Kang-In;Sohn, Hun-Joon
    • 자원리싸이클링
    • /
    • 제6권3호
    • /
    • pp.36-40
    • /
    • 1997
  • A series of processes has been developed to recover the gold from electronic scrap containing about 200~600 ppm Au. First, mechanical beneficiation including shredding, crushing and screening was employed. Results showed that 99 percent of gold component leaves in the fraction of under 1mm of crushed scrap and its concentration was enriched to about 800 ppm without incineration. The crushed scrap was leached in 50% aqua regia solution and gold was completely dissolved at $60^{\circ}C$ withing 2 hours. Other valuable metals such as silver, copper, nickel and iron were also dissolved. The resulting solution was boiled to remove nitrous compounds in the leachate. Finally, a newly designed electrolyzer was tested to recover the gold metal. More than 99% of gold and silver were recovered within an hour by electrowinning process.

  • PDF

산화처리된 PCB 스크랩을 첨가한 Al2O3-SiO2-CaO 3성분계 슬래그의 점도 (Viscosity Change of Al2O3-SiO2-CaO Slag System with Used Electronic Scrap)

  • 권의혁;한신석;지재홍;한정환;유병돈;김병수;이재천
    • 한국재료학회지
    • /
    • 제13권4호
    • /
    • pp.239-245
    • /
    • 2003
  • In order to explore the possibility to extract precious metals from PCB(Printed Circuit Board) scrap by gravity separation, a high temperature melting process was adopted, from the recycling view point, to investigate the influence of viscosity on A1$_2$$O_3$-CaO$-SiO_2$ slag system composed of PCB scrap. For optimizing the pre-treatment process of PCB scrap, an experimental condition for the complete calcination and oxidation of organic materials in PCB scrap was established and a quantitative analysis of oxidized PCB scrap was also carrie out. It was found that 6 hours were enough for the complete oxidation of PCB scrap at 1273 K in an atmosphere condition. A slag, l5wt%$A1_2$$O_3$-45wt%CaO-40wt%SiO$_2$, was chosen as a basic slag composition which is determined based on the quantitative analysis of PCB scrap. Viscosities were measured in slag systems both made from pure fluxes and from PCB scrap with additional fluxes. Slag viscosities composed of pure fluxes were measured to be 5.29 poise and 30.52 poise at temperatures of 1773 and 1573 K, whereas that of PCB scrap with additional fluxes were 3.37 poise and 69.89 poise, respectively.

Fe-Si 전기강판 폐스크랩을 이용한 연자성 분말 및 테이프 제조기술 (Manufacturing Technology for Tape Casting and Soft Magnetic Powder Using by Recycling Scrap of Fe-Si Electrical Sheet)

  • 홍원식;김상현;박지연;오철민;이우성;김승겸;한상조;심금택;김휘준
    • 마이크로전자및패키징학회지
    • /
    • 제23권2호
    • /
    • pp.11-18
    • /
    • 2016
  • This study focused on examining the possibility for recycling of Fe-Si electric sheet. We manufactured Fe-6.5Si mother alloy using by Fe-Si electric sheet scrap for transformer core materials. And then, soft magnetic alloy powder which diameter and shape were $45{\sim}150{\mu}m$ and sphere type was prepared by gas atomization process. As we compared to commercial Fe-6.5Si powder, its diameter distribution and microstructure of recycled powder was a similar. To investigate the possibility of reusing the soft magnetic composite sheet for electronics, recycled powder was treated to have a high aspect ratio (AR), and we finally obtained the 65~66 AR and $2.3{\mu}m$ thickness powder. To release the residual stress of powder, heat treatment was conducted under $300{\sim}400^{\circ}C$, $N_2$ gas. And then, soft magnetic sheet was made by tape casting process using by those powders. After the density and permeability of tape was measured, and we confirmed that the recycled Fe-Si electric sheet scrap was possible to reuse the soft magnetic materials of electronics.

Fe-Si 전기강판 폐스크랩을 이용한 3원계 Fe-9.8Si-6.0Al 합금의 연자성 특성 (Soft Magnetic Property of Ternary Fe-9.8Si-6.0Al Alloy Using by Recycling Fe-Si Electrical Steel Sheet Scrap)

  • 홍원식;양형우;박지연;오철민;이우성;김승겸;한상조;심금택;김휘준
    • 마이크로전자및패키징학회지
    • /
    • 제24권1호
    • /
    • pp.1-8
    • /
    • 2017
  • Fe-9.8Si-6.0Al mother alloy was manufactured using by Fe-3.5Si recycled scrap and Si powder. And then, soft magnetic alloy powder of $D_{50}$ size and sphere type were prepared by gas atomization process. To obtain the soft magnetic powder of a high aspect ratio, in the first, we conducted the ball milling process for 8 hours. And heat treatment was performed under $650^{\circ}C$, 2 hours and $N_2$ atmosphere condition for reducing the residual stress of the powder. Based on these process, we made around $50{\mu}m$ diameter Fe-9.8Si-6.0Al powder, which morphology and shape was a similar to the commercial Fe-Si-Al powder. Finally, the soft magnetic sheets were prepared by tape casting process using by those powders. The permeability of the tape casting sheet was measured, and we confirmed the possibility of reusing to the soft magnetic materials of Fe-Si electric sheet scrap.

廢電子스크랩에서 Thiobacillus ferrooxidans를 이용한 Cu, Al, Zn, Ni, Co, Sn 및 Pb의 浸出 (Biological Leaching of Cu, Al, Zn, Ni, Co, Sn and Pb from Waste Electronic Scrap using Thiobacillus Ferrooxidans)

  • 안재우;김명운;정진기;이재천;김동진;안종관
    • 자원리싸이클링
    • /
    • 제14권1호
    • /
    • pp.17-25
    • /
    • 2005
  • 폐전자스크랩으로부터 미생물 침출법에 의해 유가금속을 회수하기 위한 기초 연구로 Thiobacillus ferrooxidans를 이용하여 Cu, Zn, Al, Co, Ni, Sn 및 Pb의 침출 거동을 조사하였다. 예비실험으로 각 금속의 침출 거동을 조사하기 위해 먼저 폐전자스크랩 대신 각 금속분말을 이용하여 침출 실험을 실시하였는데, 금속분말의 양이 증가함에 따라 츰출율을 감소하는 경향을 보였으며 각각의 금속분말의 농도가 5 g/L이하에서 Cu, Co 및 Zn의 경우 85%이상의 침출율을 나타내었다. 한편 폐전자스크랩을 이용한 침출실험 결과 고액농도가 100 g/L에서 Cu, Co의 경우는 90%이상의 침출율을 보이고 있으나 Al, Zn 및 Ni의 경우는 40%이하의 침출율을 나타내었다. Pb의 경우는 PbSO$_4$ 형태로 Sn의 경우는 SnO 형태로 침전되어 침출액중으로는 거의 용출되지 않았다.