• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.375-375
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• 2010

CdTe as an absorber material is widely used in thin film solar cells with the heterostructure due to its almost ideal band gap energy of 1.45 eV, high photovoltaic conversion efficiency, low cost and stable performance. The deposition methods and preparation conditions for the fabrication of CdTe are very important for the achievement of high solar cell conversion efficiency. There are some rearranged reports about the deposition methods available for the preparation of CdTe thin films such as close spaced sublimation (CSS), physical vapor deposition (PVD), vacuum evaporation, vapor transport deposition (VTD), closed space vapor transport, electrodeposition, screen printing, spray pyrolysis, metalorganic chemical vapor deposition (MOCVD), and RF sputtering. The RF sputtering method for the preparation of CdTe thin films has important advantages in that the thin films can be prepared at low growth temperatures with large-area deposition suitable for mass-production. The authors reported that the optical and electrical properties of CdTe thin film were closely connected by the thickness-uniformity of the film in the previous study [1], which means that the better optical absorbance and the higher carrier concentration could be obtained in the better condition of thickness-uniformity for CdTe thin film. The thickness-uniformity could be controlled and improved by the some process parameters such as vacuum level and RF power in the sputtering process of CdTe thin films. However, there is a limitation to improve the thickness-uniformity only in the preparation process [1]. So it is necessary to introduce the external or additional method for improving the thickness-uniformity of CdTe thin film because the cell size of thin film solar cell will be enlarged. Therefore, the authors firstly applied the chemical mechanical polishing (CMP) process to improving the thickness-uniformity of CdTe thin films with a G&P POLI-450 CMP polisher [2]. CMP process is the most important process in semiconductor manufacturing processes in order to planarize the surface of the wafer even over 300 mm and to form the copper interconnects with damascene process. Some important CMP characteristics for CdTe were obtained including removal rate (RR), WIWNU%, RMS roughness, and peak-to-valley roughness [2]. With these important results, the CMP process for CdTe thin films was performed to improve the thickness-uniformity of the sputtering-deposited CdTe thin film which had the worst two thickness-uniformities of them. Some optical properties including optical transmittance and absorbance of the CdTe thin films were measured by using a UV-Visible spectrophotometer (Varian Techtron, Cary500scan) in the range of 400 - 800 nm. After CMP process, the thickness-uniformities became better than that of the best condition in the previous sputtering process of CdTe thin films. Consequently, the optical properties were directly affected by the thickness-uniformity of CdTe thin film. The absorbance of CdTe thin films was improved although the thickness of CdTe thin film was not changed.

• 전기화학회지
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• 제6권1호
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• pp.59-64
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• 2003

고상 반응법을 이용하여 $La_{0.7}Sr_{0.3}Ga_{0.6}Fe_{0.4}O_{3-\delta}$ 분말을 합성하고 소결하여 혼합전도성 분리막을 제조하였다. 제조된 분리막들은 페롭스카이트 단일상 결정구조를 나타내었으며, $95\%$, 이상의 상대밀도를 나타내었다. 산소이온 변환 능력을 향상시키기 위해 $La_{0.7}Sr_{0.3}Ga_{0.6}Fe_{0.4}O_{3-\delta}$의 양 표면에 $La_{0.6}Sr_{0.4}CoO_{3-\delta}$ paste를 스크린 프린팅 방법으로 코팅한 결과, 코팅되지 않은 분리막에 비해 산소투과 유속이 크게 증가하여 $950^{\circ}C,\; {\Delta}P_{o_2}=0.21 atm$에서 약 $0.5ml/min{\cdot}cm^2$의 값을 나타내었다. 이러한 산소투과 유속은 표면 코팅층이 다공성일수록, $La_{0.7}Sr_{0.3}Ga_{0.6}Fe_{0.4}O_{3-\delta}$의 결정립 크기가 증가할수록 증가하는 경향을 나타내었다. 제조된 디스크 형상의 소결체를 이용하여 $950^{\circ}C$에서 메탄부분산화반응을 행한 결과 $40\%$ 이상의 메탄전환율과 합성가스의 수율을 얻을 수 있었으며, CO의 선택도는 $100\%$를 나타내었다 또한, $950^{\circ}C$의 메탄분위기에서 600시간의 장기부분산화반응을 통해 상의 안정성을 확인하였다.