• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 제36회 하계학술대회 논문집 C
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• pp.1960-1961
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• 2005

Ploycrystalline $Pb(Zr_{0.5},Ti_{0.5})O_3$ and $BaTiO_3$ powder were prepared by sol-gel process. The alumina substrate were sintered at $1400^{\circ}C$ with bottom electrode of Pt for 2 hours. The Pb(Zr0.5, Ti0.5)O3/BaTiO3 multilayered thick films with laminating times were fabricated on alumina substrate by screening printing method. The obtained thick films were sintered at $800^{\circ}C$ with upper electrode of Ag paste for 1 hour, Structural properties of Pb(Zr0.5,Ti0.5)O3/BaTiO3 multilayered thick films were investigated. As a result of the Differential Thermal Analysis(DTA) of Pb(Zr0.5,Ti0.5)O3, exothermic peak was observed at around $650^{\circ}C$. The X-ray diffraction (XRD) patterns indicated that BaTiO3 and Pb(Zr0.5,Ti0.5)O3 phases and porosities were formed in the interface of Pb(Zr0.5,Ti0.5)O3 / EaTiO3 multilayered thick films.

• 한국전기전자재료학회논문지
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• 제11권12호
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• pp.1139-1145
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• 1998

In this paper, to fabricate a superconducting fault current limiter(FCL) of thick film type, $YBa_2Cu_3O_X superconducting thick films were fabricated by surface diffusion process using the screen printing method. Powder mixture of $3BaCuO_2$+2CuO was screen printed on $Y_2BaCuO_5$(d=15mm). And critical current densities of the thick films were observed as the sintering temperature(92$0^{\circ}C$~95$0^{\circ}C$) and holding time(2h~10h). Based on experimental data, the thick films for superconducting FCL were sintered at $940^{\circ}C$ in 2 hours. The superconducting FCL with a current limiting area of 1mm wide and 66mm long was prepared on $Y_2BaCuO_5$ substrate. To measure the characterization of the fabricated FCL, an alternating voltage (60Hz) was applied to the FCL in 77K liquid nitrogen. At an applied voltage of 4V, the FCL was limited from 20A into 0.6A not farther than 0.5ms.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.19-20
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• 2007

At first the $Ba_{0.5}Sr_{0.5}TiO_3$-MgO powder with $B_2O_3-Li_2CO_3$ were made by the Sol-Gel method. The thick films of BST-MgO with $B_2O_3-Li_2CO_3$ were fabricated on the $Al_2O_3$ substrates coated with Pt by the screen printing method. The structural and dielectric properties of the BST-MgO thick film with $B_2O_3-Li_2CO_3$, addition were investigated. The structure of the BST-MgO with $B_2O_3-Li_2CO_3$ thick films were dense and homogeneous with no pores. The dielectric constant was increased and dielectric loss was decreased with increasing the sintering temperature.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.69-72
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• 1999

A Well oriented Bi$_2$re$_2$CaCu$_2$O$\sub$8/(Bi2212) superconductor thick films were formed successfully on a copper substrate by liquid reaction between a Cu-free precursor and Cu tape using method in which Cu-free BSCO powder mixture was printed on copper plate and heat-treated. And we examined the mechanism for the rapid formation of Bi2212 superconducting films from observing the surface microstructure with heat-treatment time. At heat-treatment temperature, the printing layer partially melt by reacting with CuO of the oxidizing copper plate, and the nonsuperconducting phases present in the melt are typically Bi-free phases and Cu-free phases. Following the partial melting, the Bi$_2$Sr$_2$CaCu$_2$O$\sub$8/ superconducting phase is formed at Bi-free phase/liquid interface by nucleation and grows. It was confirmed that the phase colony from the phase diagram of Bi$_2$O$_3$-(SrO+CaO)/2-CuO system is similar to the observed result.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.129-129
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• 2006

인쇄회로를 제작하기 위하여 기판상에 에칭 레지스트, 도금막, 절연재료, 솔더 마스크 등을 패터닝 하게 되는데, 일반적으로 이러한 유기체 막들은 대부분 액상이나 고형의 필름 형태로 패턴을 형성하게 된다. 형성된 패턴과 동박과의 접착력 향상이 가장 주요한 문제점 중의 하나이다. 상대적으로 편평한 동박면과 유기체 막과의 접착력을 향상시키기 위해 일반적으로 접촉 면적을 증가시키기 위한 표면개질을 하게 된다. 기계적 브러싱이나 스크러빙에 의해서도 기판상의 동박의 surface topography 를 개선하기 위한 노력이 시도 되고 있지만, 본 연구에서는 microetching 방법에 의해서 화학적으로 동박 표면상에 최대한 요철을 많이 형성하여 에칭 레지스트와 동박 간의 접착력을 증대시키기 위한 연구를 수행하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.192-193
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• 2006

The wet coating process could easily be made from large area film with printing paste mixed with semiconductor and binder material at room temperature. Semiconductor film fabricated about 25mm thickness was evaluated by field emissions-canning electron microscopy (FE-SEM). X-ray performance data such as dark current, sensitivity and signal to noise ratio (SNR) were evaluated. The $Hgl_2$ semiconductor was shown in much lower dark current than the others, but the best sensitivity. In this paper, reactivity and combination character of semiconductor and binder material that affect electrical and X-ray detection properties would prove out though experimental results.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.40-41
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• 2006

In this work, we developed the 0-3 type piezoelectric composite to incorporate the advantages of both ceramic and polymer. The PVDF-PZT composites were fabricated with various mixing ratio by 3-roll mi11 mixer. The composite solutions were coated on ITO bottom-electrode deposited on PET (polyethylene terephthalate) polymer film by the conventional screen-printing method. After depositing the top-electrode of silver-paste, 4kV/mm of DC field was applied at $120^{\circ}C$ for 30min to poling the 0-3 composite film. The value of $d_{33}$ was increased as the PZT weight percent was increases. But the $g_{33}$ value showed the maximum at 65 wt% of PZT powder.

• 한국전기전자재료학회논문지
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• 제24권3호
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• pp.200-207
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• 2011

Abstract: The effect of lead free glass frit compositions on the properties of thick film conductor and resistor pastes were investigated. Two types lead free frits, HBF-A(without $Bi_2O_3$) and HBF-B(with $Bi_2O_3$) were made from $SiO_2$, $B_2O_3$, $Al_2O_3$, CaO, MgO, $Na_2O$, $K_2O$, ZnO, MnO, $ZrO_2$, $Bi_2O_3$. And Ag based conductor pastes and $RuO_2$ based resistor paste were prepared by mixed with these frits and functional phase(Ag and $RuO_2$), and organic vehicle. The properties of thick film conductor and resistor sintered at $850^{\circ}C$ were studied after printing on $Al_2O_3$ substrate. The morphology of the sintered films surface were SEM and EDS were carried out to analysis the chemical composition on resistor surface and state of Ru atom in frit matrix.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.431-432
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• 2007

In this study, we used screen printing on the rear glass with silver electrodes, phosphor and a dielectric which is on the silver electrodes, and carried out firing in the temperature of $550^{\circ}C$, $570^{\circ}C$, $450^{\circ}C$ each. To seal the rear and top glass together, we used crystalline frit paste as a sealing material with dispenser and carried out firing up to $450^{\circ}C$. As using this panel, we focused on optimizing the condition which influences characteristics of discharging by the distance between electrodes, electrode structure, type and pressure of gases for FFL.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.947-950
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• 2004

[ $ZnCr_2O_4$ ]에 $Li_2CO_3$를 $5{\sim}30wt%$ 범위에서 정량적으로 첨가한 감습재료에서 screen printing법으로 알루미나 기판 위에 후막으로 인쇄하고 $650\sim750^{\circ}C$에서 소결하여 후막 습도센서를 제작하였으며, $30\sim90%RH$ 범위에서 상대습도에 따른 저항 및 정전용량 특성을 조사하였다. $ZnCr_2O_4$에 $Li_2CO_3$가 5wt%가 첨가된 조성의 센서는 70%RH이상에서, 25wt%이상 첨가된 조성의 센서는 40%RH이하에서 저항 및 정전용량이 급격히 변화하는 switching 현상을 나타내었다. 반면, $ZnCr_2O_4$에 $Li_2CO_3$가 15wt%가 첨가된 조성의 센서는 선형적으로 저항은 감소하였고, 정전용량은 증가하였다.