• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.1
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• pp.21-27
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• 2015

We propose a fabrication process of a 3-electrode type reflective display and ascertain the realized color panel. The first design is proceeded with basis on Ti electrode for fast panel fabrication, easy align process, and high reflection of a white image. To observe the particle movement at the lower electrodes and optimize the space between electrodes, we design the second patterns, from which we establish a fabrication process with the mixing of electronic ink, loading of this ink, electronic ink assembly, driving, and packaging. After aging process, we ascertain a normally driving panel with black, white, and blue color.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.8
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• pp.524-530
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• 2015

We propose a three-electrode type electronic paper display and its fabrication process to realize single color at the same display panel. We establish a fabrication process with the mixing of electronic ink, loading of this ink, electronic ink assembly, packaging and driving. Also, we discuss an operating principle of this panel and the induced image reversal phenomenon by electric field area of the lower electrodes. This phenomenon is not occurred for the panel having $10{\mu}m$ electrode space. By this pixelation structure like this three-electronic paper display, a single color realization without color filter is possible and various kind of color is defined by a dye selection for charged particles and electrically neutral fluid.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.12.1-12.1
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• 2009

For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.65-70
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• 2011

These days, printed electronics attract attention from electronics industry. In this paper, the fabrication of the fine patterns by Near Field Electro Spinning (NFES) was studied by using Ag ink on silicon wafer (substrate). Two types of ink, the high viscous ink Ag-200 and low viscous ink Ag-15, were used. The fine and uniform patterns were easily fabricated by using Ag-200 because jet breakup is less occurred in high viscosity solution. As increasing flow rate of solution, aspect ratio of Ag pattern decreased. And there was optimum applied voltage for fine pattern. In case of Ag-200, the optimum applied voltage was about 2.02KV. When pattern was fabricated by NFES, the pattern width and height were affected by many factors such as viscosity, flow rate of solution, applied voltage etc.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1118-1121
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• 2009

We have fabricated inverted staggered pentacene Thin Film Transistor (TFT) with 1-${\mu}m$ channel length by micro contact printing (${\mu}$-CP) method. Patterning of micro-scale source/drain electrodes without etching was successfully achieved using silver nano particle ink, Polydimethylsiloxane (PDMS) stamp and FC-150 flip chip aligner-bonder. Sheet resistance of the printed Ag nano particle films were effectively reduced by two step annealing at $180^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.511-511
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• 2007

Low-emissivity (low-e) coatings with visible transparency have attracted increased interest m reducing heat radiation loss through window panes from ecological and sustainable aspects. $TiO_2$-silver transparent thin films for low-e have good properties for UV and IR blocking as well as photocatalyst compared to that with commercial UV blocking films such as fluorine doped oxide (FTO), antimony doped tin oxide (ATO), etc. In this study, transparent $TiO_2$-silver thin films were prepared by successive ink-jet printing of commercial nano silver and $TiO_2$ sol. The $TiO_2$ sol, as ink for ink-jet printing, were synthesized by hydrothermal process in the autoclave externally pressurized with $N_2$ gas of 200 bar at $120^{\circ}C$ for 10 hrs. The synthesized $TiO_2$ sols were all formed with brookite phase and their particle size was several to 30 nm. At first nano sized silver sol was coated on glass substrate, after that $TiO_2$ sol was coated by ink-jet printing. With increasing coating thickness of $TiO_2$-silver multilayer by repeated ink-jet coating, the absorbance of UV region (under 400nm) and IR region (over 700nm) also increase reasonably, compared to that with commercial UV blocking films.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.5
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• pp.494-499
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• 2023

In this paper, in order to apply the CF (color filter) type of the micro light emitting device (Micro LED) display method, a study on the manufacturing process of red and green phosphor inks for the inkjet process was conducted. The blue light-emitting KSF and LuAG phosphors were respectively used to control the phosphor particle size to about 1㎛, and a phosphor ink was prepared by synthesizing with a low-viscosity solution (IPA/Eg). A chemical dispersion method was applied to selectively control the dispersion characteristics in the manufacture of phosphor inks, and in particular, phosphor inks with a dispersant applied a dispersant secured stable dispersion characteristic compared to phosphor inks without a dispersion process. Therefore, it seems possible to manufacture CF for Micro LED through an inkjet process capable of controlling the dispersion characteristics of phosphor ink.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.11
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• pp.992-998
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• 2009

We investigated the influence of organic solvents on the droplet properties of 6,13-bis (triisopropylsilylethynyl) pentacene (TIPS-pentacene), which was used for semiconductor of organic thin film transistors (OTFTs) and deposited by ink jet printing. From the result of the investigation, the conditions of a suitable solvent is that boiling point should be above $200^{\circ}C$ to reduce coffee stain and the surface tension above 32 dyn/cm to decrease the droplet size. Consequently, we selected tetralin which have a high boiling point ($207^{\circ}C$) and high surface tension (34.3 dyn/cm) as the solvent for TIPS-pentacene, and applied it to OTFTs. In fabrication process the conventional bank process employing photolithography and etching process was replaced by ink jet printed bank process, resulting in simplifying the process. Especially, polyvinylphenol was used for the bank, and the high hydrophobicity could improve the confinement of TIPS molecules inside the bank, enhancing the performance over the conventional hydrophilic polyvinylalcohol bank. The mobility was $0.18\;cm^2/Vs$, current on/off ratio $2.09{\times}10^5$, subthreshold slope 0.42 V/dec, and off state current $0.049\;pA/{\mu}m$.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1600-1603
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• 2009

In this work, we have fabricated inverted staggered ZnO TFTs with 1-${\mu}m$ resolution channel length by micro contact printing (${\mu}$-CP) method. Patterning of micro scale source/drain electrodes without etching is successfully achieved by micro contact printing method by using silver ink and polydimethylsiloxane (PDMS) stamp. And the time dependent characteristics of the sheet resistance show that Ag inklayer could be used as source and drain electrodes for ZnO TFTs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.332-332
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• 2010

We have successfully demonstrated the inkjet printing method to create $Al_2O_3$ films withouWe have successfully demonstrated the inkjet printing method to create $Al_2O_3$ films without a high temperature sintering process. In order to remove the coffee ring effect in the ink drop, we have introduced a co-solvent system in order to create Marangoni flow in the ink drop, which leads to the dense packing of ceramic powders on the substrate during inkjet process. The packing density of the Inkjet-printed $Al_2O_3$ films is around 60% (max. 70%) which is very high compared to the value obtained from the same material films by other conventional methods such as film casting, dip coating process, etc. The voids inside the films (which are around 40% of the entire film volume) are filled with the polymer resin (Cyanate ester) by the infiltration process. This resin infiltration is also implemented by the inkjet printing process right after the Ah03 film ink-jetting process. The microstructures of the printed $Al_2O_3$ films are investigated by Scanning Electron Microscope (SEM) to understand the degree of packing density in the printed films. The inkjet-printed $Al_2O_3$ films have been characterized to investigate its thickness and roughness. Quality factor of the printed $Al_2O_3$ film is also measured to be over 300 at 1MHz.