• Journal of Korean Society of Archives and Records Management
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• v.16 no.4
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• pp.79-120
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• 2016

Along with the changing computing environment, the production of public documents is moving to G-Cloud and On-nara System, which are re-engineered on G-Cloud. In this process, it is predicted that the Open Document Format (ODF) will replace the proprietary document format, HWP, and will become widely used in the near future. To preserve digital records produced in ODF, this study reviewed the current long-term preservation strategies and identified considerations for new formats. For ODF source files, it is suggested to eliminate the conversion to PDF/A-1 and preserve the documents in the extended ODF with added metadata of records management. Moreover, ODF is presented as an alternative format for preserving proprietary formats. Finally, this study reviewed the current long-term preservation format, i.e., NEO, and suggests a zipped BagIt package, which has an ISO 21320 specification.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.491-491
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• 2011

Transparent and flexible electronic devices that are light-weight, unbreakable, low power consumption, optically transparent, and mechanical flexible possibly have great potential in new applications of digital gadgets. Potential applications include transparent displays, heads-up display, sensor, and artificial skin. Recent reports on transparent and flexible field-effect transistors (tf-FETs) have focused on improving mechanical properties, optical transmittance, and performances. Most of tf-FET devices were fabricated with transparent oxide semiconductors which mechanical flexibility is limited. And, there have been no reports of transparent and flexible all-organic tf-FETs fabricated with organic semiconductor channel, gate dielectric, gate electrode, source/drain electrode, and encapsulation for sensor applications. We present the first demonstration of transparent, flexible all-organic sensor based on multifunctional organic FETs with organic semiconductor channel, gate dielectric, and electrodes having a capability of sensing infrared (IR) radiation and mechanical strain. The key component of our device design is to integrate the poly(vinylidene fluoride-triflouroethylene) (P(VDF-TrFE) co-polymer directly into transparent and flexible OFETs as a multi-functional dielectric layer, which has both piezoelectric and pyroelectric properties. The P(VDF-TrFE) co-polumer gate dielectric has a high sensitivity to the wavelength regime over 800 nm. In particular, wavelength variations of P(VDF-TrFE) molecules coincide with wavelength range of IR radiation from human body (7000 nm ~14000 nm) so that the devices are highly sensitive with IR radiation of human body. Devices were examined by measuring IR light response at different powers. After that, we continued to measure IR response under various bending radius. AC (alternating current) gate biasing method was used to separate the response of direct pyroelectric gate dielectric and other electrical parameters such as mobility, capacitance, and contact resistance. Experiment results demonstrate that the tf-OTFT with high sensitivity to IR radiation can be applied for IR sensors.

• Journal of KIISE:Computing Practices and Letters
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• v.7 no.4
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• pp.324-335
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• 2001

Information systems, which support information security functions such as CALS and EC systems, should have cryptographic functions for information in order to storage and communicate securely. Additionally, including recovery of lost keys, lots of cryptographic keys should be securely managed. In this paper, we present some results of development of a key recovery system for recovery of encrypted data. The proposed system, in a type of key encapsulation approach, confirms to NIST's RKRP(Requirements for Key Recovery Products) that is a defecto international key recovery standard, as well as CC 2.0 that is a international security evaluation criteria. A message sender secretly choices two or more key recovery agents from a pool of key recovery agents. The key recovery information is generated by using the recovering key, random keys and public keys of the chosen agents. A message receiver can not know which key recovery agents are involved in his key recovery service. We have developed two versions of prototype of key recovery system such as C/Unix and Java/NT versions. Our systems can be used for recovery of communicating informations as well as storing informations, and as a new security service solution for electronic commerce service infrastructures.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.1-10
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• 2020

This paper reviews the recent development of electronic textile technology, mainly focusing on chip-textile bonding. Before the chip-textile bonding, a circuit on the textile should be prepared to supply the electrical power and signal to the chip mounted on the fabrics. Either embroidery with conductive yarn or screen-printing with the conductive paste can be applied to implement the circuit on the fabrics depending on the circuit density and resolution. Next, chip-textile bonding can be performed. There are two choices for chip-textile bonding: fixed connection methods such as soldering, ACF/NCA, embroidery, crimping, and secondly removable connection methods like a hook, magnet, zipper. Following the chip-textile bonding process, the chip on the textile is generally encapsulated using PDMS to ensure reliability like water-proof.