• Journal of the Korean Institute of Telematics and Electronics
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• v.18 no.1
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• pp.51-56
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• 1981

A new I2L process for a high performance I2L structure is proposed. The modifiedstructure consists of a heavily doped extrinsic base and lowly doped intrinsic base where the collector regions are self-alignment with the intrinsic base regions. The proposed process untilizes spin-on sources as the diffusion sources and the self-alignment of collectors is achieved by using the hardened spin-on source as a diffusion mask. Test devices including a 13-stage ring oscillator have been fabricated by the proposed process on n/n+ silicon wafers with 6.5$\mu$m epitaxial layer. The maximum upward current gain of npn transistors is 8 for a three collector I2L cell. The speed-power product and minimum propagation delay for a one collector structure are 3.5 pJ and 50 ns, respectively.

• Journal of Radiation Protection and Research
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• v.20 no.3
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• pp.143-154
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• 1995

In recent years, the development of new technologies using static magnetic fields has increased the possibility of human exposure to these fields and raised some concern as to their possible health effects. In several countries, governmental or other competent authorities have issued exposure limits that are mainly intended for specific uses, i.e., magnetic resonance imaging (MRI) and particle accelerators for high-energy Physics. Since applications of magnetic fields in industry and medicine are likely to grow in the future, thus increasing the possibility of occupational and general public exposure, and since the number of people with ferromagnetic implants and implanted electronic devices that can be affected by the fields is growing, there is a need for international guidelines. In the present papers, guidelines on limits of exposure to static magnetic fields are selected and discussed in order to review the guidelines of the International Non-ionizing Radiation Committee of the International Radiation Protection Association (IRPA/INIRC) for non-ionizing radiation(NIR)

• Journal of the Korean Electrochemical Society
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• v.2 no.3
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• pp.138-143
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• 1999

Recently, miniaturization of large scale integrated circuits (LSI) and printed circuit board (PCB) have become essential with the downsizing of electronic devices. Gold electroplating is applied of conductivity wiring or terminals for improvement of conductivity and corrosion resistance. However, electroplating is not applicable since the circuits are becoming finer and denser. Accordingly, electroless plating is recently highly attractive method because of the simplicity of the operation requiring no external source of current and no elaborate equipment. In this work, we tried to develop a plating technique on electroless Ni/Au plating. First, the electroless Ni plating was deposited on the PCB with agitation in the bath at $85^{\circ}C$. Then the Au layer was deposited on the Ni layer surface by same method at $90^{\circ}C$. The bonderability were tested in order to evaluate the stability of the electroless Ni/Au by gold wire or solder ball test.

• The Journal of the Korea Contents Association
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• v.12 no.12
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• pp.544-554
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• 2012

Screen content refers to images or videos generated by various electronic devices such as computers or mobile phones, whereas natural content refers to images captured by cameras. Screen contents show different statistical characteristics from natural images, so the conventional video codecs which were developed mainly for the coding of natural videos cannot guarantee good coding performances for screen contents. Recently, researches on efficient SCC(Screen Content Coding) are being actively studied, and especially at ongoing JCT-VC(Joint Collaborative Team on Video Coding) meeting for HEVC(High Efficiency Video Coding) standard, SCC issues are being discussed steadily. In this paper, we analyze the performances of high efficient coding tools in HM(HEVC Test Model) on SCC, and present an optimized SCC model based on the analysis results. We also present the characteristics of screen contents and the future research issues as well.

• The Journal of the Korea Contents Association
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• v.10 no.2
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• pp.130-137
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• 2010

Light Drawing is a photographic technique which exposures are made at night or in a darkened room usually by moving a hand-held light source[1]. Due to the limitations of equipment and environment, users having difficulty in drawing a picture in 3D space. If user take a light drawing, they need a camera that have function and darkened environment. Alternative solution is that we can make a light drawing picture by using the computer drawing tool as in Photoshop. Nevertheless, this solution will let the User lose their interest in drawing because this solution cannot synchronize between the real action of human hand motion and the electronic input devices such as mouse and keyboard. This paper proposed a digital content that can make light drawing easier. We used a digital content that will facility Light Drawing easier. We can measure the light spot position by using the stereo camera. Based on the measured position of the light spot, we reproduce light drawing in virtual space by using drawing effect method.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.2
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• pp.176-184
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• 2011

As modern megalopolises become more complex and huge, convenience and safety of citizens are main components for a welfare state. In order to make safe society, telemetrics technology, which remotely measures the information of target system using electronic devices, is an essential component. In general, telemetrics technology consists of USN (ubiquitous sensor network) based on a wireless network, smart sensor, and SoC (system on chip). In the smart sensor technology, the following two problems should be overcome. Firstly, because it is very difficult for transducer manufacturers to develop smart sensors that support all the existing network protocols, the smart sensor must be independent of the type of networking protocols. Secondly, smart sensors should be modular so that a faulty sensor element can be replaced without replacing healthy communication element. To solve these problems, this paper investigates the feasibility of an IEEE 1451 based ZigBee smart sensor system. More specifically, a smart sensor for large network coverage has been developed using ZigBee for active telemetrics.

• Journal of the Korean Chemical Society
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• v.45 no.4
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• pp.351-356
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• 2001

Planarization of the free-standing diamond film surface as smooth as possible could be obtained by using the hydrogen plasma etching with the diffusion of the carbon species into the metal alloy (Fe, Cr, Ni). For this process, we placed the free-standing diamond film between the metal alloy and the Mo substrate like a metal-diamond-molybdenum (MDM) sandwich. We set the sandwich-type MDM in a microwave-plasma-enhanced chemical vapor deposition (MPECVD) system. The sandwich-type MDM was heated over ca. 1000 $^{\circ}C$ by using the hydrogen plasma. We call this process as the hydrogen plasma etching with carbon diffusion process. After etching the free-standing diamond film surface, we investigated surface roughness, morphologies, and the incorporated impurities on the etched diamond film surface. Finally, we suggest that the hydrogen plasma etching with carbon diffusion process is an adequate etching technique for the fabrication of the diamond film surface applicable to electronic devices.

• Journal of IKEEE
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• v.19 no.3
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• pp.440-446
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• 2015

This study has examined susceptibility of LNA(Low Noise Amplifier) due to Front-Door Coupling under Narrow-Band high power electromagnetic wave. M/DFR(Malfunction/Destruction Failure Rate) was measured to investigate the diagnostic of IC test. In addition, decapsulation analysis was used to understand the inside of the chip state in LNA devices. The experiments is employed as an open-ended waveguide to study the destruction effects of LNA using a 2.45 GHz Magnetron as a high power electromagnetic wave. The susceptibility level of LNA was assessed by electric field strength, and its failure modes were observed. The malfunction of LNA device has showed as the type of self-reset and power-reset. The electric field strength of malfunction threshold is 524 V/m and 1150 V/m respectively. Also, he electric field of destruction threshold is 1530 V/m. Three types of damaged LNA were observed by decapsulation analysis: component, onchipwire, and bondwire destruction. Based on these results, the susceptibility of the LNA can be applied to a database to help elucidate the effects of microwaves on electronic equipment.

• Journal of IKEEE
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• v.17 no.3
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• pp.317-323
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• 2013

In this paper, 25W wireless power transmission(WPT) system using the coupled magnetic resonance is presented. The WPT system consists of a 100W class-F power transmitter, 1.7MHz magnetic resonators and a 40W full-bridge receiver using diodes. Especially, the transmit power control function using the 400MHz FSK communication between the transmitter and the receiver is adopted in the proposed system for the stable power transmission. Using the system and the power control function, the WPT system can be adopted in the various electronic devices and the commercialization of WPT system can be moved forward.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.37-41
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• 2014

One of the important developments in next generation electronic devices is the technology for power delivery and heat dissipation. In this study, the Cu-to-Cu flip chip bonding process was evaluated using the square ABL power bumps and circular I/O bumps. The difference in bump height after Cu electroplating followed by CMP process was about $0.3{\sim}0.5{\mu}m$ and the bump height after Cu electroplating only was about $1.1{\sim}1.4{\mu}m$. Also, the height of ABL bumps was higher than I/O bumps. The degree of Cu bump planarization and Cu bump height uniformity within a die affected significantly on the misalignment and bonding quality of Cu-to-Cu flip chip bonding process. To utilize Cu-to-Cu flip chip bonding with ABL bumps, both bump planarization and within-die bump height control are required.