• Title/Summary/Keyword: Electronic devices

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Trajectory of Resonant Displacement of Coupled Vibration Mode Piezoelectric Devices for AE Sensor Application (음향방출 센서 응용을 위한 결합진동 모드 압전소자의 공진 변위 궤적)

  • Jeong, Yeong-Ho;Shin, Sang-Hoon;Yoo, Ju-Hyun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.2
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    • pp.114-118
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    • 2013
  • In this study, coupled mode piezoelectric devices for AE sensor application with excellent displacement and piezoelectric characteristics were simulated using ATILA FEM program, and then fabricated. Displacements and electromechanical coupling factors of the piezoelectric devices were investigated. The simulation results showed that excellent displacement and electromechanical coupling factor were obtained when the ratio of diameter/thickness was 1.0. The piezoelectric device of ${\Phi}/T$= 1.0 exhibited the optimum values of fr= 406 kHz, displacement= $6.11{\times}10^{-8}[m]$, $k_{eff}$= 0.648. The results show that the coupled vibration mode piezoelectric device is a promising candidate for the application of AE sensor piezoelectric device.

A Study on Electrical Characteristics Improvement on Field Stop IGBT Using Trench Gate Structure (Trench Gate를 이용한 Field Stop IGBT의 전기적 특성 분석에 관한 연구)

  • Nam, Tae-Jin;Jung, Eun-Sik;Chung, Hun-Suk;Kang, Ey-Goo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.4
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    • pp.266-269
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    • 2012
  • The most recently IGBT (insulated gate bipolar mode transistor) devices are in the most current conduction capable devices and designed to the big switching power device. Use this number of the devices are need to high voltage and low on-state voltage drop. And then in this paper design of field stop IGBT is insert N buffer layer structure in NPT planar IGBT and optimization design of field stop IGBT and trench field stop IGBT, both devices have a comparative analysis and reflection of the electrical characteristics. As a simulation result, trench field stop IGBT is electrical characteristics better than field stop IGBT.

EMI Debugging Technique of LED Lighting Module (LED 조명기구의 EMI 디버깅 기술)

  • Kim, Jin Sa
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.33 no.2
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    • pp.151-154
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    • 2020
  • Radiation noise due to EMI noise generated by the driving circuits of LED lighting devices in a medical imaging room was reduced by decreasing the noise source in the driving circuits and changing the number of corrections in EMI filters. Noise attenuation and filter changes enabled driving circuits that reduced the electromagnetic waves. Such circuits were efficiently designed by using capacitors and inverters in a given space. Therefore, the malfunction of radiation devices can be minimized by using EMI-reduction filter circuits, and reliable operation of medical devices can be expected by blocking electromagnetic waves.

Design of 4.5kV/1.5kA IGCT (4.5kV/1.5kA급 IGCT 설계 및 특성분석)

  • Kim, Hyoung-Woo;Kim, Sang-Cheol;Seo, Kil-Su;Kim, Eun-Dong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.07a
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    • pp.357-360
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    • 2003
  • In this paper, we designed 4.5kV/1.5kA IGCT devices. GCT thyristor has many superior characteristics compared with GTO thyristor, for examples; snubberless turn-off capability, short storage time, high turn-on capability, small turn-off gate charge and low total power loss of the application system containing device and peripheral parts such as anode reactor and snubber capacitance. In this paper we designed GCT thyristor devices, and analyzed static and dynamic characteristics of GCT thyristor depending on the minority carrier lifetime, n-base thickness and doping concentration of n-base region, respectively. Especially, turn-on and turn-off characteristics are very important characteristics for GCT thyristor devices. So, we considered above characteristic for design and analysis of GCT devices.

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The Interfacial Segregation of Elemental Ag in the Sputter-Deposited AgInSbTe Thin Films (스퍼터 증착시킨 AgInSbTe 박막에서 Ag의 계면편석)

  • Choi, Woo-S.;Kim, Myong-R.;Seo, Hun;Park, Jeong-W.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1996.05a
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    • pp.15-18
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    • 1996
  • The elemental segregation in the sputter-deposited AgInSbTe recording thin films was studied by means of Auger electron spectroscopy and ESCA for the specimens of as-deposited and as heat-treated conditions. Auger electron spectroscopy and ESCA revealed an extremely thin layer of elemental inhomogeneity, especially for the silver, even in as-deposited condition. The chemical analysis results obtained in this alloy system are discussed in terms of process parameters and target microstructure.

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Formation of Microporosities in Sputter-Deposited AgInSbTe Thin Films and Their Behavior (스퍼터 증착시킨 AgInSbTe 박막에서 미세기공의 형성과 그 거동)

  • Kim, Myong-R.;Seo, H.;Park, J. W.;Choi, W. S.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1996.05a
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    • pp.84-89
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    • 1996
  • The nucleation and growth of microporosities was observed during the course of annealing treatment of sputter-deposited AgInSbTe thin films. There was a close correlation between the density of microporosity and the sputtering gas pressure in annealed thin films. The void density for a given composition decreased with sputtering gas pressure. It was shown from the present study that the number of porosities decreased while the average porosity size increased as the annealing temperature and holding time increased. The mechanism of porosity formation in the sputter-deposited AgInSbTe thin flus containing Ar-impurity trapped from the Ar-plasma is discussed in the present article.

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A Study of the Characteristics of Degradation in Nonvolatile MNOS Memory Devices (비휘발성 MNOS반도체 기억소자의 열화특성에 관한 연구)

  • 이상배;서원철;김병철;서광열
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1988.10a
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    • pp.14-17
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    • 1988
  • Degradation effects observed in nonvolatile MNOS memory devices with in increasing W/E (Write/Erase) cycling were investigated using n-type MNOS capacitors. The results showed that the density of Si-SiO$_2$ interface states and the conductivity of nitride were increased with W/E cycles, therefore the memory retention characteristics of the MNOS memory devices were degraded. Also, annealing of the degraded devices restored the original Si-SiO$_2$ interface states density, but failed to restore the original nitride conductivity. Based on these experimental results, we found that the degradation of memory retention characteristic was affected by the nitride conductivity rather than by Si-SiO$_2$ interface states.

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Programming Characteristics of the Multi-bit Devices Based on SONOS Structure (SONOS 구조를 갖는 멀티 비트 소자의 프로그래밍 특성)

  • 김주연
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.9
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    • pp.771-774
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    • 2003
  • In this paper, the programming characteristics of the multi-bit devices based on SONOS structure are investigated. Our devices have been fabricated by 0.35 $\mu\textrm{m}$ complementary metal-oxide-semiconductor (CMOS) process with LOCOS isolation. In order to achieve the multi-bit operation per cell, charges must be locally frapped in the nitride layer above the channel near the source-drain junction. Programming method is selected by Channel Hot Electron (CUE) injection which is available for localized trap in nitride film. To demonstrate CHE injection, substrate current (Isub) and one-shot programming curve are investigated. The multi-bit operation which stores two-bit per cell is investigated. Also, Hot Hole(HH) injection for fast erasing is used. The fabricated SONOS devices have ultra-thinner gate dielectrics and then have lower programming voltage, simpler process and better scalability compared to any other multi-bit storage Flash memory. Our programming characteristics are shown to be the most promising for the multi-bit flash memory.

Langmuir-Blodgett Methods and Photelectronic Devices (Langmuir Blodgett법에 의한 광전자소자)

  • 신동명
    • Korean Journal of Optics and Photonics
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    • v.2 no.2
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    • pp.108-113
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    • 1991
  • This paper describes the necessity and utility of Langmuir-Blodgett (L-B) methods in developing molecular electronic devices. It also covers the application area and limitations of the methods. With L-B methods, the membrane thickness can be controlled in a range of 50 nm and 1000 nm depending on nature of the materials and layering methods. The molecular arrangement within the membrane can be altered by altering the surface pressure and nature of the layering materials. Such a variation can be altered by altering the surface pressure and nature of the layering materials. Such a variation can offer a new application of the methods to the future electronic devices. More over 2nd and 3rd nonlinearity generated in the nonsymmetric thin membrane will be used in the development of the optoelectronic devices.

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A Study on Operating Lifetime of Cs3Sb Emitters in Panel Device Applications

  • Jeong, Hyo Soo
    • Transactions on Electrical and Electronic Materials
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    • v.18 no.3
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    • pp.176-179
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    • 2017
  • Non-vacuum processing technology was used to produce $Cs_3Sb$ photocathodes on substrates and fabricate in-situ panel devices. Electrical properties of these panel devices were characterized by measuring anode current and charge dose as functions of devices operation time. An excitation light source with a 475 nm wavelength was used for photocathodes. Results showed that emission properties of these photocathode emitters depended heavily on the vacuum level of these devices and that $Cs_3Sb$ flat emitters had the potential of operating for a long lifetime with stable electron emission characteristics via re-cesiation process in the panel device. These features make $Cs_3Sb$ photocathodes suitable as flat emitters in panel device applications.