• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2137-2143
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• 2008

This paper investigates the plate loop heat pipe system with an evaporator mounted with fin-wick structure to dissipate effectively the heat generated by the electronic components. The heat transfer formulation is modeled and predicted through thermal resistance analysis of the fin-wick structure in the evaporator. The experimental approach measures the thermal resistances and the operating characteristics. These results gathered in this investigation have been used to the objective of the information to improve the LHP system design so as to apply as the future cooling devices of the electronic components.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.40.2-40.2
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• 2005

• Proceedings of the SAREK Conference
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• 2004.06a
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• pp.23-23
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• 2004

• Journal of Advanced Marine Engineering and Technology
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• v.35 no.8
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• pp.994-1000
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• 2011

In this study, the piezoelectric fan cooling system is investigated. In order to find the proper geometry and configuration, the numerical model for the flow field and heat transfer investigation is used. A simplified nonlinear deformation model is employed for transient solutions of a piezoelectric fan with the dynamic mesh and user defined function capability. The results show that the cooling is most effective when the length of a piezoelectric fan is 5 cm and the cooling plate is 3 cm. The results can be used to develop a new design method of heat sink for piezoelectric fans.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.601-602
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• 2007

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.6
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• pp.459-467
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• 2006

Rapid development of electronic technology requires small size, high density packaging and high power in the electronic devices, which results in more heat generation. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the current state-of-the-art electronic equipment. The aim of the present study is to find out the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices through the analysis and experiment. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. Experimental results are compared with the analyses and correlations of several researchers. Finally, the design guide are provided for the required pressure drop and/or the heat transfer characteristics of the heat exchanger.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.5
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• pp.415-420
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• 2007

Generally, a diode package consists of the synthetic resin that has good durability but low thermal conductivity. The surface mounted type fast recovery diode was fabricated by using ceramic package. Its main manufacture processes are composed of soldering, sillicon coating and side termination. And it has various advantages that diode is small, easy manufacture and fast cooling. The electric characteristics of the diode such as reverse recovery time, breakdown voltage, forward voltage, and leakage current were 5.28 ns, 1322 V, 1.08 V, $0.45\;{\mu}A$, respectively.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.11
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• pp.3072-3083
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• 1995

The numerical simulation on the three-dimensional natural convection heat transfer in the enclosure with heat generating chip is performed, and the effects of convective heat loss and vents are also examined. The effects of the Rayleigh number and outer Nusselt number (Nu$_{0}$) on the maximum chip temperature and the fractions of heat loss from the hot surfaces are investigated. The results show that conduction through the substrate is dominant in heat dissipation. With the increase of Rayleigh number, heat dissipation through the chip surfaces increases and heat loss through the substrate decreases. Maximum dimensionless temperature with vents is found to decrease about 40% compared to the one without vents at Nu$_{0}$=0.l. It is also shown that effects of size and location of the vents are negligible.ble.

• Journal of Advanced Marine Engineering and Technology
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• v.7 no.1
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• pp.34-39
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• 1983

Development of modern internal combustion engine requires more precise indicator. In the case of strain gage-strain tube type indicator, thermal expansion of the indicator's fixed part makes zero-shift in spite of water cooling. Therefore, the authors analyzed the cause of zero-shift phenomenon on strain gage-strain tube type indicator and proposed a new device to compensate the zero-shift of indicator by electrical method without detoriorating the dynamic charcteristic. As the results, we found that the zero-shift is varied linearlly according to temperature variation of the indicator's fixed part and appling a new device, we can improve the zero-shift of indicator about 0.63% (0.63 kg/$cm^2$) of full scale, though we got 10% of it without the device at the cylinder head operating temperature (c.a. $200^{\circ}C$).

• Journal of Electrical Engineering and Technology
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• v.9 no.3
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• pp.893-898
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• 2014

Recently, the interior permanent synchronous motor (IPMSM) has been applied to an integrated starter and generator (ISG) for hybrid electric vehicles. In the design of such a motor, thermal analysis is necessary to maximize the power density because the loss is proportional to the power of a motor. Therefore, a cooling device as a heat sink is required internally. Generally, a cooling system designed with a water jacket structure is widely used for electric motors because it has advantages of simple structure and cooling effectiveness. An effective approach to analyze an electric machine with a water jacket is a thermal equivalent network. This network is composed of thermal resistance, a heat source, and thermal capacitance that consider the conduction, convection, and radiation. In particular, modeling of the cooling channel in a network is challenging owing to the flow of the coolant. In this paper, temperature prediction using a thermal equivalent network is performed in an ISG that has a water cooled system. Then, an experiment is conducted to verify the thermal equivalent network.