• Journal of Advanced Marine Engineering and Technology
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• 제29권4호
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• pp.436-442
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• 2005

Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices. In this paper, characteristics on oscillating heat pipe according to operating conditions (environment temperature, charging ratio of working fluid, inclination) based on experimental study was investigated From the experimental results $25^{\circ}C$(environment temperature) R-141b (working fluid) $40\%$ (charging ratio) was best performace at others of inclination angle and the top heating mode of OCHP performed $80\%$ efficiency of the bottom heating mode.

• Proceedings of the KSME Conference
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• 대한기계학회 2008년도 추계학술대회B
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• pp.2137-2143
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• 2008

This paper investigates the plate loop heat pipe system with an evaporator mounted with fin-wick structure to dissipate effectively the heat generated by the electronic components. The heat transfer formulation is modeled and predicted through thermal resistance analysis of the fin-wick structure in the evaporator. The experimental approach measures the thermal resistances and the operating characteristics. These results gathered in this investigation have been used to the objective of the information to improve the LHP system design so as to apply as the future cooling devices of the electronic components.

• Journal of the Korean Institute of Intelligent Systems
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• 제25권2호
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• pp.161-167
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• 2015

In this paper, a novel thermoelectric cooling system utilizing condensed water is introduced and its electrical equivalent circuit model is proposed. The introduced system can deals with the condensed water and improves efficiency by spraying the condensed water on heat sink. The electrical equivalent circuit model is derived by combining the circuit model of the classical thermoelectric cooling system with equation of heat exchange. Because the parameters of the model can be defined from not other experimental data but just the data sheet of the thermoelement, the model can be useful to design and develop the controller of the proposed system. We verify that the proposed model is valid and the introduced system is more efficient than the previous thermoelectric cooling system through simulations.

• 전자공학회논문지 IE
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• 제46권4호
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• pp.25-30
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• 2009

The cooling water circulation pipes had been used to drop the temperature of refractory outside shell of blast furnace by cooling plate or stave type. They were attacked by surrounding CO gas and it was the cause that they were corroded and the water inflow in the refractory due to leakage of water. So, the life of refractory material was shorten and changed for the worse the conditions of blast furnace. The automatic sensing device for water leakage of cooling pipe was developed to check the position of trouble by use the micro-process system when cooling water leak and then CO gas will be inflowed into the cooling pipe at the leakage position. The inflowed CO gas will be detected in the micro-process system and delivered the detected position of cooling plate or stave to main control room through the wireless-radio relay station. This system can be possible to detect the position of cooling plate or stave the water leakage part immediately and then deliver the signal to main control room by use the micro-process system and wireless-radio relay station. This system will develop the working condition from manual system to unmanned auto alarm system.

• Proceedings of the SAREK Conference
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• 대한설비공학회 2009년도 하계학술발표대회 논문집
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• pp.1385-1390
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• 2009

In this study the purpose is development of passive cooling system for telecommunication cabinet used by latent heat material. This cooling system is not required for electronic power. It was tested for the performance of the telecommunication combined latent heat material with $48^{\circ}C$ of phase changed temperature and heat pipe. At $45^{\circ}C$ of outside temperature, when heater power was 1,000 W and 1,500 W, the inside temperature of the cabinet was $55^{\circ}C$ and $62^{\circ}C$. This system was showed better performance than the other systems.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• 제15권8호
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• pp.667-673
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• 2003

Recent trends in the electronic equipment indicate that the power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. The influence of the structure of the pin-fin assembly on heat transfer is investigated by porous medium model. The results are compared with the experimental data or correlations of several researchers for the heat transfer coefficients for the channel flow with pin-fin arrays. Finally, the effects of design parameters such as the pin-fin diameter and the spacing are examined.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• 제20권1호
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• pp.81-85
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• 2011

Recently, the electronic parts are to be thinner plate, smaller size, light weight material and CPU, HDD and DRAM in all the parts have been produced on the basis of the high speed and greater capacity. Also, conventional goods have replaced a LED (Light-Emitting Diode) in lighting products so; such industry devices need to have cooling. To maximize all the performance on the heat-radiated products, the area of heat-radiated parts is required to be cooled for keeping the life time extension and performance of product up. Existing cooling systems are using radiant heat plate of aluminum, brass by extrusion molding, heat pipe or hydro-cooling system for cooling. There is a limitation for bringing the light weight of product, cost reduction, molding of the cooling system. So it is proposed that an alternative way was made for bringing to the cooling system. EP (Engineering Plastic) of low-cost ABS (Acrylonitrile butadiene styrene Resin) and PC (Polycarbonate) was coated with brass and the coating made the radiated heat go up. The performance of radiant heat plate is the similar to the existing part. We have studied experimentally on the radiated heat plate for the light-weight, molding improvement and low-cost. From now on, we are going to develop the way to replace the exiting plate with exterior surface of product as a cooling system.

• The Transactions of the Korean Institute of Electrical Engineers P
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• 제58권3호
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• pp.235-240
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• 2009

In automobile, the introduction of electronically commutated motors has been accompanied by a proliferation of electronic devices. With this proliferation of electronic devices, an emphasis has been placed on EMC issues. This paper is proposed to use SRM as a radiator cooling fan in automotive applications. To drive SRM, Energy efficient C-dump converter is applied. Energy efficient C-dump converter, derived from the conventional C-dump converter, is proposed as a switched reluctance motor (SRM) drive for automotive engine cooling application. It is verified more efficient than other converters through simulation and experiments. And also SRM is valid for automotive applications that have strict EMC standards. Simulation and experimental results obtained on a laboratory prototype are finally presented to evaluate the performance.

• Journal of the Korea Academia-Industrial cooperation Society
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• 제15권4호
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• pp.1850-1858
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• 2014

The object of this study is to develop an cooling control algorithm for electronics devices of the electric vehicle. In order to estimate the existing cooling control logic of the electronic devices for the small and medium sized electric vehicle, the experiments on the coolant temperature variation of the cooling system were conducted under 4 different seasons conditions. As a result, the existing cooling control logic were overcooled when it was compared with the reference temperature for a required cooling load. In addition, the newly developed optimum cooling control logic for improving the mileages of the tested electric vehicle with consideration of the ambient temperature, vehicle speed, and refrigerant temperature of the air conditioning on/off is necessary.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• 제19권10호
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• pp.710-717
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• 2007

Electric and telecommunication industries are constantly striving towards miniaturization of electronic devices. Miniaturization of chips creates extra space on PCBs that can be populated with additional components, which decreases the heat transfer surface area and generates very high heat flux. Even though an air-cooling technology for telecommunication equipment has been developed in accordance with rapid growth in electrical industry, it is confronted with the limitation of cooling capacity due to the rapid increase of heat density. In this study, liquid-cooling heat exchangers with MPCM slurries were designed and tested by varying geometry and operating conditions. The liquid-cooling heat exchangers with 4-paths showed higher cooling performance than the others. The cooling performance of liquid cooling heat exchanger with MPCM slurries was more enhanced than that of the air cooling system. It's performance was also slightly superior to that of the water cooling system at the inlet temperature of $19^{\circ}C$.