• Journal of Advanced Marine Engineering and Technology
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• v.21 no.2
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• pp.178-185
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• 1997

According to the wide - spread use of rectifier in electronic equipments, such problems as electronic components failures or equipment disorders have been occurred due to current harmonics. To overcome these problems, power factor correction circuits employing boost converter have been used. The high switching stress of boost converter can be reduced by snubber circuit. Recently, research activities in snubber circuits have been directed to energy recovery snubber for improving the efficiency of power converter. In this study, a new passive snubber circuit which can recover trapped snubber energy without added control is proposed for boost converter. The control of boost converter with proposed snubber is the same as the conventional one. In addition, the energy recovery circuit can be implemented with a few passive components. The circuit operation is confirmed through simulation.

• Journal of Industrial Technology
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• v.34
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• pp.71-78
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• 2014

Recently, using the electronic devices was increased with semiconductor developments. So, the EMI(Electromagnetic interference) problem become to important issue for coexistence with each electronic devices. The EMI is caused by switching operation from the power switches as the FET and the transistor in power conversion devices. In this paper, the hybrid EMI filter that composed with active components and passive components was described. The EMI filter is applied to the 160 watts LED driver experimentally verify the performance. The hybrid EMI filter is compared with non-filter, only passive filter and only active filter. The proposed EMI filter attenuated CM noise more than traditional passive filter.

• Journal of the Korean Society of Safety
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• v.15 no.1
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• pp.36-42
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• 2000

An experimental study was carried out to investigate the effects of inclined angles of channel on thermal stability of electronic components. In this study, it is focused on the natural convection heat transfer from an inclined parallel channel with discrete protruding heat sources. The material used for the inclined parallel channel was epoxy-resin, while air as the cooling fluid. Heat transfer phenomena for inclined angles of $\psi$=$15^{\circ}$, $30^{\circ}$, $45^{\circ}$, $60^{\circ}$ and for the range of $9.52{\times}10^5/ were analyzed. The thermal fields in the channel were visualized by Mach-Zehnder interferometer. Also, local temperatures were measured by thermocouples along the channel wall and heat sources surface. As a result, for the range of $4.29{\times} 10^5/, a useful correlation of mean Nusselt number was proposed as a function of modified channel Rayleigh number.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1309-1313
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• 2008

This paper suggests an example of modification of the durability test specifications of electronic control unit for an automotive system in phase of design validation. The basic concept to redefine the specifications of durability test is based on the Arrhenius relationship for accelerated temperature test and the modified Coffin-Manson model for temperature cycle test. The ambient temperature of the powered-event durability test is increased to reduce the required test time of the current specification. Furthermore, the holding time between the events to cool down the temperature of the components is shortened and the resultant temperature rise affects the durability of the components. Thus, the acceleration factor due to the increased temperature range of temperature cycle is also estimated by the modified Coffin-Manson model.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05c
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• pp.23-26
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• 2002

In ceramic systems using LTCC, many components including embedded passives and TRL's are used for composition of 3-dimensional circuit. So the exact analysis on this components must be performed. As for the TRL's, material properties including electrical conductivity of metal, loss factor and effective dielectric constant of dielectric material and geometrical factors like roughness of surface, vias, dimension of TRL structure have a large effect on the characteristics of transmission lines. Such properties of materials have different values in each system with ideal ones presented in text book. In this research, the effective material properties in each system are examined and the effect of material properties and geometrical factors on the characteristics of TRL's are analyzed and quantified by simulation and measurement.

• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.1542-1545
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• 2002

Experimental works were performed to implement the hetero-epitaxial growth of diamond films on the (100)- and (111)-oriented Si substrates. The deposition process used to prepare diamond films consisted of a bias-enhanced nucleation(BEN) step, accompanied with a growth step using a microwave plasma CVD system. The highly oriented diamond films were deposited under the growth condition of relatively low methane concentrations and high temperatures. Material properties and surface morphologies of deposited diamond films were improved by the addition of carburization step into the deposition process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.11a
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• pp.338-341
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• 1996

Anodic bonding is a key technology for micromechanical components. The main advantages of this method can be formed in a batch process, over large areas, and is permanent and irreversible. In this paper, the bonding was performed at temperatures ranging from 300 to 450 $^{\circ}C$, voltages 400 to 1000 V, and times 10 to 30 minutes. The sizes of the Si and the Pyrex #7740 glass were 6 mm $\times$6 mm, respectively. Bonding processes and voids were observed by the optical microscope, and the composition of the anodic bonding interface was analyzed by the SIMS. Optimum condition of the anodic bonding was at temperature above 40$0^{\circ}C$ without regard to voltage.

• Journal of the Optical Society of Korea
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• v.18 no.2
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• pp.129-133
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• 2014

In this paper, we propose a simple Double random phase encryption (DRPE)-based orthogonal encoding technique for color image encryption. In the proposed orthogonal encoding technique, a color image is decomposed into red, green, and blue components before encryption, and the three components are independently encrypted with DRPE using the same key in order to decrease the complexity of encryption and decryption. Then, the encrypted data are encoded with a Hadamard matrix that has the orthogonal property. The purpose of the proposed orthogonal encoding technique is to improve the security of DRPE using the same key at the cost of a little complexity. The proposed orthogonal encoder consists of simple linear operations, so that it is easy to implement. We also provide the simulation results in order to show the effects of the proposed orthogonal encoding technique.

• ETRI Journal
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• v.5 no.3
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• pp.9-15
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• 1983

This paper describes the applicable method of part stress analysis failure rate prediction for electronic components in the MIL-HDBK-217D. The part stress analysis method requires the great amount of detailed informations, such as operating temperature, operating environment, etc. This paper calculates the failure rate of electronic components using the computer program. The program was written by Fortran V and has four basic units as follows (1) Raw data file (2) Failure rate calculation (3) Reliability modelling(Series only) (4) New data file The Functions and structure of the program are illustrated.

• Journal of IKEEE
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• v.18 no.2
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• pp.234-239
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• 2014

This paper proposes a new automatic detection method to inspect mura defects on display film surface using morphological image processing and labeling. This automatic detection method for mura defects on display films comprises 3 phases of preprocessing with morphological image processing, Gabor filtering, and labeling. Since distorted results could be obtained with the presence of non-uniform illumination, preprocessing step reduces illumination components using morphological image processing. In Gabor filtering, mura images are created with binary coded mura components using Gabor filters. Subsequently, labeling is a final phase of finding the mura defect area using the difference between large mura defects and values in the periphery. To evaluate the accuracy of the proposed detection method, detection rate was assessed by applying the method in 200 display film samples. As a result, the detection rate was high at about 95.5%. Moreover, the study was able to acquire reliable results using the Semu index for luminance mura in image quality inspection.