• 디지털산업정보학회논문지
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• 제11권1호
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• pp.69-78
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• 2015

Internet of Things(IoT) is electronic devices and household appliances use wireless sensor network in environment of high speed wireless network and LTE mobile service. The combination of the development of Internet and wireless network led to development of new forms of service such as electronic devices and household appliances can connect to the Internet through various sensors and online servers such as a Home Network. Even though Internet of Things is useful, there are problems in Internet of Things. In environment of Internet of Things, information leakage could happens by illegal eavesdropping and spoofing. Also illegal devices of wireless communication interference can cause interfere in Internet of things service, physical damage and denial of service by modulation of data and sensor. In this thesis, it will analyze security threats and security vulnerability in environment of mobile services and smart household appliances, then it will suggest plan. To solve security issues, it is important that IT and RFID sensor related companies realize importance of security environment rather than focus on making profit. It is important to develop the standardized security model that applies to the Internet of Things by security-related packages, standard certification system and strong encrypted authentication.

• 한국전기전자재료학회논문지
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• 제28권1호
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• pp.57-63
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• 2015

Recently, LED is widely used in the kinds of display devices or lighting. In this paper, we fabricated LED chamber light for naval vessels to replace to conventional chamber light using incandescent lamp. The LED package of chamber light was designed with luminous intensity of 5.5 cd, color temperature of $6,000{\pm}500K$, forward voltage of 3~3.2 V and input current of 60 mA. A LED module was composed of 36 LED packages and metal PCB. The VF and luminous intensity of LED package were getting down when temperature increased. The temperature of LED chamber light was measured by changing the number of LED package and applied current for one hour when an electric current flow. The heat transfer capability have been improved by using metal PCB. The power consumption of LED chamber light reduced by 86% compared to the conventional chamber light using incandescent lamp.

• Transactions on Electrical and Electronic Materials
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• 제13권1호
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• pp.16-18
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• 2012

LED lighting systems that combine lighting capability, emotional and physiological characteristics are required for lighting source and multifunctional applications. In this work, Simulation studies using optical analysis software packages, Light Tools, are presented. This is done to estimate the uniformity ratio of illuminance and photosynthetic photon flux density (PPFD) of the periodic 2D lattice arrangements, such as square, diamond, two-way bias quadrangular, hexagonal, and Kagome lattices, under the same transmissivity, absorptance and reflectivity. It has been found out that the two-dimensional Kagome lattice arrangement exhibited high uniformity ratio of illuminance and PPFD compared to other lattices. Accordingly, these results can be used to guide a design and improve the lighting environment which in turn would maximize the uniform distributions of illuminance.

• 한국문헌정보학회지
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• 제41권1호
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• pp.373-389
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• 2007

빅딜은 각 출판사가 발행하는 학술지를 패키지로 묶어 일괄 판매하는 것으로 전자학술지 등장 이후 급격히 확산되었다. 이 연구는 국내의 대학 및 연구도서관에서 구독하고 있는 해외학술지 컨소시엄 조건에 관한 데이터를 수집하여 빅딜판매의 조건 및 상황을 분석하였다. 분석결과 과거에 비해 최근의 빅딜판매 조건은 보다 다양해졌고 선택의 폭도 다소 넓어진 것을 확인할 수 있었다. 그렇지만 주요 출판사의 경우에는 여전히 과거 구독분을 그대로 유지할 것을 요구하는 등 전형적인 빅딜판매 조건을 고수하고 있어 이에 대한 보완 및 대체 방안 수립이 시급한 것으로 드러났다. 전자출판물의 보급이 확산되면서 현재 학술출판물 시장도 급격하게 변하고 있는 만큼 향후에는 전통적인 출판방식과 오픈 액세스 출판방식을 결합한 새로운 출판방식이 호응을 얻을 것으로 기대되는 바이다.

• 마이크로전자및패키징학회지
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• 제10권3호
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• pp.43-55
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• 2003

최근 IT산업의 발달과 그에 따른 전자부품기술의 발전이 가속화됨에 따라, 전자부품의 경박 단소화 및 고성능에 대한 요구는 전자패키지 (electronic package) 및 반도체기판(PKG substrate) 업체들로 하여금 고밀도의 입출력(I/O)과 우수한 열적, 전기적 특성을 보유하면서 높은 양산수율로 제품이 가격경쟁력을 갖도록 유도하고 있다. 이러한 경향에 따라 세계적인 반도체 회사(chip-maker)들은 더욱 혹독한 조건의 신뢰성 표준을 마련하여 제반 산업에 전반적인 적용을 요구하고 있으며, 환경친화 및 고주파, 고성능의 특성을 지닌 새로운 소재를 개발하도록 촉구하고 있는 실정이다. 반도체기판은 구성소재에 따라 구현되는 특성의 범위가 매우 크므로 우수한 특성의 소재를 반도체기판에 적용할 때 고객의 요구조건에 충분히 만족시킬 수 있을 것으로 기대된다. 따라서, 기판업계에서는 우수한 특성을 나타내는 원자재의 개발 및 수급이 절실하게 되었으며 급변하는 원자재의 기술 동향에 대한 분석은 향후 전자패키지 및 기판제품의 경쟁력을 향상시킬 수 있을 것이므로 본 연구에서는 최신 반도체기판 원자재의 기술 동향과 원자재의 특성을 분석하고자 하였다.

• 마이크로전자및패키징학회지
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• 제31권3호
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• pp.10-17
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• 2024

본 논문은 전자 기기의 소형화와 유연성을 실현하기 위한 플렉시블 패키징 핵심 기술 중 하나인 Chip On Film(COF) 기술에 대해 논의합니다. COF는 Display Driver IC(DDI)를 유연한 폴리이미드(Polyimide) 기판에 직접 부착하여, 고해상도 디스플레이의 경량화와 두께 감소를 가능하게 합니다. COF 기술은 주로 Organic Light Emitting Diode(OLED) 디스플레이와 같은 고성능 디스플레이 패널에서 사용되며, 스마트폰과 웨어러블 기기와 같은 휴대용 전자 장치에서 핵심적인 역할을 합니다. 본 연구에서는 COF의 주요 구성 요소 및 본딩 기술의 발전을 분석합니다. 특히, 열압착(Thermo-Compression Bonding), 초음파 본딩(Thermo-sonic Bonding)과 같은 최신 본딩 기법의 도입으로, 본딩 신뢰성 및 전기적 성능이 크게 향상되었습니다. 이러한 본딩 기술은 미세 피치 구조에서 높은 전기적 연결성을 유지하면서도, COF 패키지의 기계적 안정성을 강화합니다. 또한, COF 본딩 기술의 향후 발전 방향과 그에 따른 도전 과제를 논의하며, 차세대 디스플레이 및 Advanced 패키징 기술로서의 가능성을 조망합니다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 The IMAPS-Korea Workshop 2001 Emerging Technology on packaging
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• pp.119-126
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• 2001

Chip-on-glass(COG) mounting of area array electronic packages was attempted by heating the rear surface of a contact pad film deposited on a glass substrate. The pads consisted of an adhesion(i.e. Cr or Ti) and a top coating layer(i.e. Ni or Cu) was heated by an UV laser beam transmitted through the glass substrate. The laser energy absorbed on the pad raised the temperature of a solder ball which is in physical contact with the pad, forming a reflowed solder bump. The effects of the adhesion and top coating layer on the laser reflow soldering were studied by measuring temperature profile of the ball during the laser heating process. The results were discussed based on the measurement of reflectivity of the adhesion layer. In addition, the microstructures of solder bumps and their mechanical properties were examined.

• 한국재료학회지
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• 제17권12호
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• pp.676-681
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• 2007

According to progress rapidly digitalization, networked and mobilization of electronics industry, there are demands for being smaller, thinner, more light, and more efficient complex functions of electronic devices which are wireless devices, semi-conductors, packages and mobile devices. Therefore, the solder resist on a printed circuit board have been required with the high resolution and the eco-friendly materials in the surface treatments such as high heating process and coating process with electrolysis. In this study, the photoinitiator initiator and monomers of the solder resist were prepared with their contents for reducing the occurrence of the under-cut. We investigated the sample surface by UV/VIS spectrometer, FT-IR, OM after HASL and ENIG process. From our results, it is possible to get a high adhesion of resist with optimal contents between the photoinitiator initiator and monomers after surface treatments.

• 산업경영시스템학회지
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• 제25권4호
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• pp.8-15
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• 2002

This paper proposes a case study to treat planning and scheduling in factory of supply chain. In fact, the planning and the scheduling of a factory are not easily solved because of constraints of facility resources, material requirements, allowed planning times, and so on. However many packages are developed by vendors in Advanced Planning and Scheduling(APS) aspects to solve these problems. Therefore, in this paper, we analyze problems of an electronic company and apply the tool, Factory Planner(FP), to solve problems. The FP, which was developed by if technologies, is very popular planning and scheduling tool in the world. Also, the tool is successfully applied to many fields.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1295-1300
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• 2008

During the manufacturing and the service life of Au-Al wire bonded electronic packages, the ball bonds experience elevated temperatures and hence accelerated thermal diffusion reactions that promote the transformation of the Au-Al phases and the IMC growth. In this paper, the IC under high temperature storage (HTS) tests at $175^{\circ}C,\;200^{\circ}C$, and $250^{\circ}C$ are meticulously investigated. Thermal exposure resulted in the IMC growth, Kirkendall void and the crack of the Au-Al phases. The crack propagation occurs resulting in the failure of the Au-Al ball bonds. As the IC was exposed at the high temperature, decreased in the lifetime.