• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.2
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• pp.125-130
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• 2016

In this paper, various heat dissipation designs for a rail anchoring failure detection module were investigated by a thermal flow analysis. For the detection module with the heat dissipation design on the overall housing surface, an average temperature inside the module was lowered by $25^{\circ}C$ when compared to no heat dissipation design. In addition, an internal heat-flow blocking layer and an heat conduction layer inserted between the LED module and housing case were effective in reducing the temperature in the rail anchoring failure detection, which has a limited space for installation and little air flow. Especially, the temperature near LED module decreased below $55^{\circ}C$ when the optimal heat dissipation design was applied.

• Proceedings of the KIPE Conference
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• 2005.07a
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• pp.254-256
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• 2005

This paper describes a design of a vector control module for AC motor using high density FPGA. In the proposed vector controller, the vector control blocks including inverse dq transform, space vector PWM and quadrature encoder pulse module are implemented in a FPGA using a VHDL. The simulation results are provided to show the validity of the proposed vector control module.

• Journal of Fisheries and Marine Sciences Education
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• v.16 no.2
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• pp.210-217
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• 2004

Cooling technology has been a vital prerequisite for the rapid, if not explosive, growth of the electronic equipment industry. This has been especially true during the last 20 years with the advent of intergrated circuit chips and their applications in computers and related electronic products. The purpose of this study is to develop a telecommunication equipment cooling system using a thermoelectric module combined with cooling fan. Thermoelectric module is a device that can perform cooling only by input of electric power. In the present study, the cooling package using the thermoeletric module has been developed to improve the thermal performance. The cooling characteristics of the electronic chip was placed into the subrack and it can be rapidly assembled or disassembled in the equipment rack. As a preliminary experiment, the cooling performances between a conventional way using a cooling fin and a proposed method applying the thermoelectric module was comosed and analyzyed. The cooling performance at a simulated electronic component packaging a thermomodule operated well.

• Current Photovoltaic Research
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• v.9 no.2
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• pp.31-35
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• 2021

Shingled module shows high ratio active area per total area due to more efficient packing without inactive space between cells. The module is fabricated by connecting the pre-cut cells into the string using electrically conductive adhesives (ECA). ECAs are used for electric and structural connections to fabricate the shingled modules. In this work, we investigated a correlation between ECA peel strength and the efficiency of pre-cut 5 cells module which are fabricated according to ECA interconnection conditions. The curing conditions are varied to determine whether ECA interconnection properties can affect module properties. As a result of the peel test, the highest peel strength was 1.27 N/mm in the condition of 170℃, the lowest peel strength was 0.89 N/mm in the condition of 130℃. The efficiency was almost constant regardless of the curing conditions at an average of 20%. However, the standard deviation of the fill factor increased as the adhesive strength decreased.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.8
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• pp.940-945
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• 2008

In this paper, we have designed the Brick Transmit/Receive Module for K-band which can be applied to active phase array radar system. The proposed structure of T/R Module for K band is brick type for MCM(Multi Chip Module) form and the satisfaction of tile type T/R Module can apply to structure of cavity and main characteristic. The fabricated brick type T/R Module confirmed the main characteristic for electrical goal performance in test and this structure can be applied to active phase array radar.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.06a
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• pp.515-520
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• 1998

In this paper, we propose a new fault tolerant architecture for high availability systems, where for module internal operations both processor modules perform the same tasks at the same time independently of each other while for module external operations both processor modules act actively. That is, operations of synchronization between dual processor modules except clock synchronization are requested only when module external operations are executed. The architecture can not only improve system availability by reducing system reintegration time but also reduce performance degradation problem due to frequent synchronization between dual processor modules. The clock unit consists of a clock generator and a clock synchronization circuit. This supplies a stable clock signal under clock unit disorder of any processor module or rapid clock signal variation. And this architecture achieves system availability and data credibility by designing as symmetrical form.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.359-359
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• 2010

IGBT(Insulated Gate Bipolar Transistor) 란 MOS(Metal Oxide Silicon) 와 Bipolar 기술의 결정체로 낮은 순방향 손실(Low Saturation)과 빠른 Speed를 특징으로 기존의 Thyristor, BJT, MOSFET 등으로 실현 불가능한 분양의 응용처를 대상으로 적용이 확대 되고 있고, 300V 이상의 High Power Application 영역에서 널리 사용되고 있는 고효율, 고속의 전력 시스템에 있어서 필수적으로 이용되는 Power Device이다. IGBT는 출력 특성 면에서 Bipolar Transistor 이상의 전류 능력을 가지고 있고 입력 특성 면에서 MOSFET과 같이 Gate 구동 특성을 갖기 때문에 High Switching, High Power에 적용이 가능한 소자이다. 반면에, Conventional IGBT는 MOSFET과 달리 IGBT 내부에 Anti-Parallel Diode가 없기 때문에 Inductive Load Application 적용시에는 별도의 Free Wheeling Diode가 필요하다. 그래서, 본 논문에서 별도의 Anti-Parallel Diode의 추가 없이도 Inductive Load Application에 적용 가능한 RC IGBT를 적용하여 600V/15A급 Three Phase Inverter Module을 제안 하고자 한다.

• IE interfaces
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• v.13 no.2
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• pp.258-265
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• 2000

EDI(Electronic Data Interchange) allows the exchange of business information and computer-processable data in a standard, structured format electronically between organizational entities. EDI handles the restructuring of a business document into the standard format so that it can be transmitted from one computer to another. This paper identifies features and technologies of web browsed electronic document exchange system as follows 1) the fundamental technologies that consists of the EDI technologies, the Internet/Web technologies, the security/authentication techniques, and the XML implementation technologies. 2) the functions that consists of the document standards, transfer technology of the document, encryption and authentication 3) the implemented Web-EDI systems that consists of document generation module, encryption and authentication module, transfer module, acknowledgement module, administration module. In this paper, the Web-based EDI system implemented from the researched technologies will be installed on the EDI servers owned by corporate customers and enable the exchange of documents between each installed companies.

• Journal of the Semiconductor & Display Technology
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• v.18 no.4
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• pp.149-153
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• 2019

The technology of electronic packaging among semiconductor technologies is evolving as an axis of the market in its own field beyond the simple assembly process of the past. In the field of electronic packaging technology, the packaging of power modules plays an important role for green electric vehicles. In this power module packaging, the thermal reliability is an important factor, and silicon nitride plays an important part of package substrates, Silicon nitride is a compound that is not found in nature and is made by chemical reaction between silicon and nitrogen. In this study, this core material, silicon nitride, was fabricated by reaction bonded silicon nitride. The fabricated silicon nitride was studied for thermo-mechanical properties, and through this, the structure of power module packaging was made using reaction bonded silicon nitride. And the characteristics of stress were evaluated using finite element analysis conditions. Through this, it was confirmed that reaction bonded silicon nitride could replace the silicon nitride as a package substrate.

• Journal of the Optical Society of Korea
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• v.15 no.1
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• pp.44-51
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• 2011

In this paper, an easy-to-use measurement device for illumination distribution is developed. The device consists of a sensor array module, a control module, and a PC interface. The sensor array module incorporates CIE 1931 color sensors and the ARM-based 96 MHz microcontroller in the control module for measurement and data processing. The sensor array module contains 64 color sensors arranged in a $16{\times}4$ array. The sensitivity of the sensor array module can be adjusted depending on the illumination level to be measured. The measurement data and control signals are exchanged via USB 2.0 standard. To demonstrate the performance of the device, the illumination distribution is measured for colors of red, green, and blue and is graphically shown. The device can be used for measurement of the illumination distribution, design and adjustment of LED illumination.