• Proceedings of the KIEE Conference
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• 2005.05a
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• pp.137-140
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• 2005

The electronic dispenser is composed of electronic part and mechanical part. Electronic part is consisted of input keypad, micro-controller, display module, and pump module. In this paper we designed micro-controller for electronic part. The micro-controller controls display module and pump module. The display module is composed by LCD device, and the pump module is composed by motor device. The micro-controller for an electronic dispenser is designed by VHDL. We used WX12864APl for the LCD device and SPS20 for the stepping motor. Also, the micro-controller is designed by Altera Quartus tool and verified with Agent 2000 Design-kit using APEX20K Device. In this paper, we present possibility to adopt of biotechnology field through designing of one-chip controller for an electronic dispenser.

• The Journal of Information Systems
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• v.11 no.1
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• pp.175-198
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• 2002

This paper is to develop a security module for electronic approval systems. Electronic documents are created, transmitted and saved in the company's intranet computer network. Transmitting electronic documents, however, brings us a security problem. Communications among various computer systems are exposed to many security threats. Those threats are eavesdropping, repudiation, replay back etc. The main purpose of this paper is to develop a module which provides the security of electronic documents while they are passed from one place to another This paper applies Multi-Level security to the electronic approval system that guarantees security of electronic documents from many threats. Multi-Level security controls the access to the documents by granting security level to subject users and object electronic documents. To prevent possible replay back attacks, this paper also uses one time password to the system. The security module is composed of client program and server one. The module was developed using Microsoft Visual Basic 6.0 and Microsoft SQL Server 7.0. The code uses Richard Bondi's WCCO(Wiley CryptoAPI COM Objects) library functions which enables Visual Basic to access Microsoft CryptoAPI.

• Journal of IKEEE
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• v.18 no.3
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• pp.356-361
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• 2014

This paper proposes hardware architecture of HEVC (high efficiency video coding) CABAC (context-based adaptive binary arithmetic coding) binarizer. The proposed binarizer was designed and implemented as an independent module that can be integrated into HEVC CABAC encoder. It generates each bin string of each syntax element in a single cycle. It consists of controller module, TU (truncated unary binarization) module, TR (truncated Rice binarization) module, FL (fixed length binarization) module, EGK (k-th order exp-Golomb coding) module, CALR (coeff_abs_level_remaining) module, QP Delta (cu_qp_delta_abs) module, Intra Pred (intra_chroma_pred_mode) module, Inter Pred (inter_pred_idc) module, and Part Mode (part_mode) module. The proposed binarizer was designed in Verilog HDL, and it was implemented in 45 nm technology. Its operating speed, gate count, and power consumption are 200 MHz, 1,678 gates, and 50 uW, respectively.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.59-63
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• 2013

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.43 no.2 s.308
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• pp.33-39
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• 2006

This paper designed the electronic circuit part of Potable Infrared Night Vision Scope for a small size, light weight, and low power. Designed electronic circuit part is composed of an Auto Voltage Selecting Module, and a Power Supply Module. An Auto Voltage Selecting Modulo is composed of a switch, a battery, a step up voltage part, and a selecting voltage part. A Power Supply Module is composed of a high luminous sensing part, a battery voltage sensing part, a infrared illumination part, a connection sensing part, and a power control part. And this module controls the power of Image Intensifier Tube. To verify the performance of the designed electronic circuit part, we experimented the consumption power and continuous using time. Experimental results show that the designed electronic circuit part improves considerably on the performance of the AN/PVS-14. performance.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2420-2425
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• 2007

Heat transfer from three-dimensional heat-generating modules was investigated. A simulated electronic module in an array configured with dummy module elements was used to measure the average heat transfer coefficients. Various module arrangements were tested using module spacings of 0.85 and 1.15 cm for six Reynolds numbers ranging from 500 to 975. The results show that a module placed in-line with and upstream of a heated module results in the heat transfer enhancement due to a high level in turbulence prompted by upstream modules. The highest enhancement occurs when the separation distance between modules is close to the module length in the flow direction. Flow visualization reveals laminar flow on the front of the first module, slow recirculation regions on the sides parallel to the air stream, and turbulence on the back side. It appears that the first module serves to trip the air stream and produce a high level of turbulence, which enhances the heat transfer rate downstream.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.32 no.6
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• pp.407-412
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• 2008

Heat transfer from three-dimensional heat-generating modules was investigated. Simulated electronic module in an array configured with dummy module elements were used to measure the average heat transfer coefficients. Various module arrangements were tested using module spacings of 0.85 and 1.15 cm for six Reynolds numbers ranging from 500 to 975. The results show that a module placed in-line with and upstream of a heated module results in the heat transfer enhancement due to high turbulence intensity prompted by upstream modules. The highest enhancement occurs when the separation distance between modules is close to the module length in the flow direction. The laminar flow was observed on the front of the first module, slow recirculation regions on the sides parallel to the airstream, and turbulent flow on the back side. It appears that the first module serves to trip the air stream and produce a high level of turbulence, which enhances the heat transfer rate downstream.

• Journal of IKEEE
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• v.9 no.2 s.17
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• pp.101-107
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• 2005

This paper presents an one-chip controller for an electronic dispenser. The electronic dispenser is composed of electronic part and mechanical part. The electronic part is consisted of input keypad, micro-controller, display module, and pump module. In this paper we designed micro-controller for the electronic part. The micro-controller controls display module and pump module. The display module is composed by LCD device, and the pump module is composed by motor device . The micro-controller for an electronic dispenser is designed by VHDL. We used WX12864AP1 for the LCD device and SPS20 for the stepping motor. Also, the micro-controller is designed by Altera Quartus tool and verified with Agent 2000 Design-kit using APEX20K Device. In this paper, we present possibility to adopt of the biomedical device through the one-chip controller for the electronic dispenser.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.12
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• pp.815-819
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• 2014

Aluminum nitride (AlN) thin film and TiN film as a buffer layer were deposited on INCONEL 600 substrate by reactive RF magnetron sputtering at room temperature(R.T.) under 25~75% $N_2/Ar$ atmosphere. The as-deposited AlN films at 25~50% $N_2/Ar$ showed a polycrystalline phase of hexagonal AlN, and an amorphous phase. The peak of AlN (002) plane, which was determinant on a performance of piezoelectric transducer, became strong with increasing the $N_2/Ar$ ratio. Any change in the preferential orientation of the as-deposited AlN films was not observed within our $N_2$ concentration range. The piezoelectric sensing properties of AlN module were performed using pressure-voltage measurement system. The output signal voltage of AlN module showed a linear behavior between 20~80 mV in 1~10 MPa range, and the pressure-sensing sensitivity was calculated as 3.6 mV/MPa.

• Journal of the Korean Society of Industry Convergence
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• v.7 no.1
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• pp.25-31
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• 2004

The heat transfer characteristics of a plasma display panel has been investigated for cooling an electronic module. Hence, a two dimensional $\kappa-{\varepsilon}$ turbulent model was developed to predict the temperatures of the panel and module. The heat conduction was solve for the material region. To consider the mixed convection at the solid-fluid interfaces between the air and the panel and module, the energy equation was solved simultaneously. When the electronic module stands face to face with the panel, the temperatures of panel and module are lower than other arrangement due to the chimney effect. However the gap between the panel and module does not affect significantly the maximum temperature when the aspect ratio is less than 0.1. To maintain the maximum temperature of the module under a certain limit, the passage of air should be well designed by the optimal layout of electronic modules which have different heat emission.