• 제목/요약/키워드: Electronic Component Assembly

검색결과 30건 처리시간 0.023초

Leap Motion을 이용한 전자부품 조립 훈련 시스템 개발에 관한 연구 (A Study on the Development of an Electronic Component Assembly Training System Using Leap Motion)

  • 이인철
    • 한국산업융합학회 논문집
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    • 제26권3호
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    • pp.463-470
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    • 2023
  • In this study, an electronic parts assembly training system using Leap Motion was developed in consideration of the processes actually operated in the assembly process of electronic products. Based on Leap Motion and Oculus VR equipment, the system was developed to transfer user's hand movement data in real time and convert it into hand movement in virtual space so that electronic parts assembly simulation can be performed step by step. Through this, it was confirmed that the user can obtain an experience similar to the actual electronic parts assembly work, prevent errors that may occur during the assembly process, and improve proficiency. It is expected that this thesis will provide directions for the quality improvement and development of various education and training programs for virtual reality-based manufacturing processes.

단일 글로벌 전자상거래 시장을 만들기 위한 컴포넌트와 컨텍스트 기탄의 전자문서 설계 및 구현 (Design and Implementation of a Component and Context based Business Message for Creating a Single Global Electronic Market)

  • 김완평
    • Journal of Information Technology Applications and Management
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    • 제9권3호
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    • pp.13-30
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    • 2002
  • ebXML (Electronic Business using extensible Markup language), sponsored by UN/CEFACT and OASIS, is a modular suite of specifications that enables enterprises of any size and in any geographical location to conduct business over the Internet. Using ebXML, companies now have a standard method to exchange business messages, conduct trading relationships, communicate data In common terms and define and resistor business processes. It is the mission of ebXML that provides an open XML-based infrastructure enabling the global use of electronic business information in an interoperable, secure and consistent manner by all parties for creating a single e1ectronic electronic market. This paper briefly overviews the concept of core component, context, assembly rule and context rule. Then, It designs by standard specifications of ebXML core component commonly used in an industry and among industries, and assembles business messages by using XML schema. Therefore, it suggests the mechanism which effectively exchanges business messages among the trading partners. This paper designs core component by using only three business messages of retail industry : orders, dispatch report, sales report.

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적외선 리플로 솔더링시 작동조건이 전자조립품의 열적반응에 미치는 영향 분석 (Analysis on the Effect of Operating Conditions on the Thermal Response of Electronic Assemblies during Infrared Reflow Soldering)

  • 김성권;손영석;신지영
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2004년도 추계학술대회
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    • pp.1063-1068
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    • 2004
  • A numerical study is performed to predict the effect of operating conditions on the thermal response of electronic assemblies during infrared reflow soldering. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated, and the predictions illustrate the detailed thermal responses. Parametric study is performed to determine the thermal response of electronic assemblies to various conditions such as conveyor speed, exhaust velocity, and component emissivity. The predictions of the detailed electronic assembly thermal response can be used in selecting the oven operating conditions to ensure proper soldering and minimization of thermally-induced electronic assembly stresses.

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캠코더용 Iris Assembly의 국산화 및 생산 기술 개발 사례 (A Study of Development and Product ion Technology for Camcoder Iris Assembly)

  • 고종선
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1996년도 하계학술대회 논문집 A
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    • pp.250-252
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    • 1996
  • In this paper, the principle of operation. the part characteristic, characteristic of component movement, analysis are carried out for camcoder iris assembly which is one of the important element component in Video large projection TV instrument, and some Know-how for development of element component is also included. The magnetic field circuit for the small and simple structure with low power consumption is introduced and new materials of yoke for small motor system is suggested. Especially, the relation with remained magnetic field and operation duration time is analyzed by experimental results. Some problems of nonlinear torque characteristics include to obtain the simple and low cost structure in domestic production of element component is analyzed. Furthermore, development procedure is suggested for iris assembly and some methods to reduce the burr with some check points for small precise accessories are explained.

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A Social Network Analysis on the Common Initiative for the Electronic Government Law: Focusing on the Ruling Party and Seniority Effect

  • Lee, Hun-Hee;Han, Sang-Ik
    • 한국컴퓨터정보학회논문지
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    • 제24권6호
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    • pp.125-133
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    • 2019
  • This study aimed to investigate the political system related to the Electronic Government Law by analyzing the process of the common initiative of the law. To achieve the goal, this study applied the method of social analysis and sugessted the proper role of the assembly for realizing the electronic government and its control. The data were gathered from the bill information service of the national assembly. Netminer 4.0 was used for refining and analyzing data. The results are as follows. First, by analyzing three centrality(degree, betweenness, and eigenvector) of assembly member, the network effect of the powered party and reelected members were revealed as strong in the network. Second, through the component analysis, 5 sub-network has shown in total. The sub-networks showed two distinctive difference between two big parties. By the difference, members in two parties showed different characteristics in constituting communities and the effect of the powered party revealed as strong and clear. Based on the result, this study demonstrated the necessity of social solidarity rather than solipsism in committing common initiative. And a chronological research is need to anlayze $18^{th}$ and $19^{th}$ assembly to verify the effect of the powered party in prospect study.

Recent Progress in Layer-by-layer Assembly of Nanomaterials for Electrochemical Energy Storage Applications

  • Kim, Sung Yeol
    • 전기화학회지
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    • 제17권3호
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    • pp.139-148
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    • 2014
  • Electrochemical energy-storage devices such as batteries and supercapacitors are important components in emerging portable electronic device, electric vehicle, and clean energy storage and supply technologies. This review describes recent progress in the development of nanostructured electrodes, the main component of the electrochemical energy-storage device, prepared by layer-by-layer (LbL) electrostatic assembly. Major advantages associated with, and challenges to, the fabrication of LbL electrodes, as well as the future outlook for expanding the application of LbL techniques, are discussed.

Electrochemical Characterization of Multilayered CdTe/PSS Films Prepared by Electrostatic Self-assembly Method

  • Rabbani, Mohammad Mahbub;Yeum, Jeong Hyun;Kim, Jungsoo;Nam, Dae-Geun;Oh, Weontae
    • Transactions on Electrical and Electronic Materials
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    • 제15권5호
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    • pp.257-261
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    • 2014
  • Multilayered CdTe/PSS films were prepared by the electrostatic self-assembly method in an aqueous medium. Positively-charged cadmium telluride (CdTe) nanoparticles and anionic polyelectrolyte, poly (sodium 4-styrene sulfonate) (PSS) were assembled alternately in order to build up a multilayered film structure. A linear proportion of absorbance to the number of bilayers suggests that an equal amount of CdTe was adsorbed after each dipping cycle, which resulted in the buildup of a homogenous film. The binding energies of elements (Cd and Te) in multilayered CdTe/PSS film shifted from those of the CdTe nanoparticles in the pure state. This result indicates that the interfacial electron densities were redistributed by the strong electrostatic interaction between the oppositely-charged CdTe and PSS. Electrochemical properties of the multilayered CdTe/PSS films were studied in detail by cyclic voltammetry (CV).

전자부품 조립공정의 자동화를 \ulcorner나 실시간 영상처리 알고리즘에 관한 연구 (A Real-Time Image Processing Algorithms for An Automatic Assembly System of Electronic Components)

  • 유범재;오영석;오상록
    • 대한전기학회논문지
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    • 제37권11호
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    • pp.804-815
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    • 1988
  • Real-time image processing algorithms to detect position and orientation of rectangular type electronic components are developed. The position detection algorithm is implemented with the use of projection method which is insensitive to noise. Also dynamic thresholding method of projection is employed in order to distinguish between the boundary of a component and any marking on the component. The orientation is determined by Hough transform of boundary candidates of a component, which is obtained a priori by a simple edge detection method. For real-time processing of both position and orientation for a component which is not aligned well, parallel processing method of image data is proposed and tested in real-time.

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Feeder Re-assign Problem in a Surface Mount Device with a Piano-Type Multi-Headed Gantry

  • Tae, Hyunchul;Kim, Byung-In
    • Industrial Engineering and Management Systems
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    • 제12권4호
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    • pp.330-335
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    • 2013
  • A surface mount device (SMD) assembles electronic components on printed circuit boards (PCB). Since a component assembly process is a bottleneck process in a PCB assembly line, making an efficient SMD plan is critical in increasing the PCB assembly line productivity. Feeder assignment is an important part of the SMD plan optimization. In this paper, we propose a feeder re-assign improvement algorithm for a specific type of SMD machine with a piano type multi-head gantry. Computational results on some real-world benchmark data sets show the effectiveness of our proposed algorithm.

지능적인 이형부품 인식과 비전 정렬 방법에 관한 연구 (A Study on the Intelligent Recognition of a Various Electronic Components and Alignment Method with Vision)

  • 신균섭;김종원
    • 반도체디스플레이기술학회지
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    • 제23권2호
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    • pp.1-5
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    • 2024
  • In the electronics industry, a lot of research and development is being conducted on electronic component supply, component alignment and insertion, and automation of soldering on the back side of the PCB for automatic PCB assembly. Additionally, as the use of electronic components increases in the automotive component field, there is a growing need to automate the alignment and insertion of components with leads such as transistors, coils, and fuses on PCB. In response to these demands, the types of PCB and parts used have been more various, and as this industrial trend, the quantity and placement of automation equipment that supplies, aligns, inserts, and solders components has become important in PCB manufacturing plants. It is also necessary to reduce the pre-setting time before using each automation equipment. In this study, we propose a method in which a vision system recognizes the type of component and simultaneously corrects alignment errors during the process of aligning and inserting various types of electronic components. The proposed method is effective in manufacturing various types of PCBs by minimizing the amount of automatic equipment inserted after alignment with the component supply device and omitting the preset process depending on the type of component supplied. Also the advantage of the proposed method is that the structure of the existing automatic insertion machine can be easily modified and utilized without major changes.

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