• Korean Journal of Materials Research
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• v.26 no.9
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• pp.486-492
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• 2016

Tungsten (W) thin film was deposited at $400^{\circ}C$ using pulsed chemical vapor deposition (pulsed CVD); film was then evaluated as a nucleation layer for W-plug deposition at the contact, with an ultrahigh aspect ratio of about 14~15 (top opening diameter: 240~250 nm, bottom diameter: 98~100 nm) for dynamic random access memory. The deposition stage of pulsed CVD has four steps resulting in one deposition cycle: (1) Reaction of $WF_6$ with $SiH_4$. (2) Inert gas purge. (3) $SiH_4$ exposure without $WF_6$ supply. (4) Inert gas purge while conventional CVD consists of the continuous reaction of $WF_6$ and $SiH_4$. The pulsed CVD-W film showed better conformality at contacts compared to that of conventional CVD-W nucleation layer. It was found that resistivities of films deposited by pulsed CVD were closely related with the phases formed and with the microstructure, as characterized by the grain size. A lower contact resistance was obtained by using pulsed CVD-W film as a nucleation layer compared to that of the conventional CVD-W nucleation layer, even though the former has a higher resistivity (${\sim}100{\mu}{\Omega}-cm$) than that of the latter (${\sim}25{\mu}{\Omega}-cm$). The plan-view scanning electron microscopy images after focused ion beam milling showed that the lower contact resistance of the pulsed CVD-W based W-plug fill scheme was mainly due to its better plug filling capability.

• Progress in Superconductivity and Cryogenics
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• v.9 no.1
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• pp.18-21
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• 2007

Highly textured MgO template by ion-beam-assisted deposition(IBAD) was successfully fabricated using a continuous reel-to-reel(R2R) mode. To enlarge the deposition area, the previous IBAD system was modified into the system with 14-pass and five heating zone. Every processing step was carried out using this multi-turn IBAD system. The overall process consists of R2R electropolishing of a hastelloy C276 tape, deposition of $Al_2O_3$ diffusion barrier, $Y_2O_3$ seed layer, IBAD-MgO and homoepi-MgO layer. The IBAD-MgO templates were fabricated using the IBAD system with 216 cm-length deposition zone and 32 cm diameter ion source. The texture of MgO films developed during the IBAD process was monitored by in-situ reflection high energy electron diffraction(RHEED) to optimize the IBAD process. Recently, 100 m long IBAD-MgO tape with in-plane texture of $\Delta{\phi}<10^{\circ}$ was successfully fabricated using the modified IBAD system. In this report, the detailed deposition condition of getting a long length IBAD-MgO template with a good epitaxy is described.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.254-255
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• 2012

Interest in nano-crystalline silicon (nc-Si) thin films has been growing because of their favorable processing conditions for certain electronic devices. In particular, there has been an increase in the use of nc-Si thin films in photovoltaics for large solar cell panels and in thin film transistors for large flat panel displays. One of the most important material properties for these device applications is the macroscopic charge-carrier mobility. Hydrogenated amorphous silicon (a-Si:H) or nc-Si is a basic material in thin film transistors (TFTs). However, a-Si:H based devices have low carrier mobility and bias instability due to their metastable properties. The large number of trap sites and incomplete hydrogen passivation of a-Si:H film produce limited carrier transport. The basic electrical properties, including the carrier mobility and stability, of nc-Si TFTs might be superior to those of a-Si:H thin film. However, typical nc-Si thin films tend to have mobilities similar to a-Si films, although changes in the processing conditions can enhance the mobility. In polycrystalline silicon (poly-Si) thin films, the performance of the devices is strongly influenced by the boundaries between neighboring crystalline grains. These grain boundaries limit the conductance of macroscopic regions comprised of multiple grains. In much of the work on poly-Si thin films, it was shown that the performance of TFTs was largely determined by the number and location of the grain boundaries within the channel. Hence, efforts were made to reduce the total number of grain boundaries by increasing the average grain size. However, even a small number of grain boundaries can significantly reduce the macroscopic charge carrier mobility. The nano-crystalline or polymorphous-Si development for TFT and solar cells have been employed to compensate for disadvantage inherent to a-Si and micro-crystalline silicon (${\mu}$-Si). Recently, a novel process for deposition of nano-crystralline silicon (nc-Si) thin films at room temperature was developed using neutral beam assisted chemical vapor deposition (NBaCVD) with a neutral particle beam (NPB) source, which controls the energy of incident neutral particles in the range of 1~300 eV in order to enhance the atomic activation and crystalline of thin films at room temperature. In previous our experiments, we verified favorable properties of nc-Si thin films for certain electronic devices. During the formation of the nc-Si thin films by the NBaCVD with various process conditions, NPB energy directly controlled by the reflector bias and effectively increased crystal fraction (~80%) by uniformly distributed nc grains with 3~10 nm size. The more resent work on nc-Si thin film transistors (TFT) was done. We identified the performance of nc-Si TFT active channeal layers. The dependence of the performance of nc-Si TFT on the primary process parameters is explored. Raman, FT-IR and transmission electron microscope (TEM) were used to study the microstructures and the crystalline volume fraction of nc-Si films. The electric properties were investigated on Cr/SiO2/nc-Si metal-oxide-semiconductor (MOS) capacitors.

• Korean Journal of Optics and Photonics
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• v.13 no.2
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• pp.105-112
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• 2002

We studied the optical and structural properties of conventional and ion-beam-assisted-deposition (IBAD) Nb$_2$O$_{5}$ films which were evaporated by an electron beam gun. The vacuum-to-air spectral shift and the cross sectional SEM images of the Nb$_2$O$_{5}$ films were investigated. The results show that the IBAD Nb$_2$O$_{5}$ films have a higher packing density than the conventional Nb$_2$O$_{5}$ films. The average refractive index of IBAD Nb$_2$O$_{5}$ films was increased, while the extinction coefficient was decreased compared with the conventional films. As the oxygen flow was increased, the average refractive index and extinction coefficient of the conventional and IBAD films decreased. Both the conventional and IBAD Nb$_2$O$_{5}$ films showed inhomogeneity in refractive index, and the degree of inhomogeneity of the IBAD Nb$_2$O$_{5}$ films became larger as the ion current density was increased. All Nb$_2$O$_{5}$ films were found to be amorphous by x-ray diffraction (XRD) analysis, and hence the crystal structure of Nb$_2$O$_{5}$ films was not changed by IBAD.

• Journal of the Korean Ceramic Society
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• v.42 no.1
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• pp.43-49
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• 2005

YSZ layer containing nano-sized particles has been deposited on the commercial A1203 substrate by Electron Beam Physical Vapor Deposition (EB-PVD). The role of coating rnjcrostructures of YSZ to indentation damage is studied. The different coating microsouctures are prepared by varying the substrate temperatures from $600^{circ}C$ to $800^{circ}C$ during the deposition. Microhardness test and Hertzian indentation are conducted on the $YSZ/Al_{2}O_{3}$ layered systems. The damage and flilure behaviors have been investigated according to the effect of microstructures and indentation loads. With increasing the substrate temperature during EB-PVD, the overall grain sizes are coarser and more faceted, which microsoucture ultimately influences on the indentation behavior, thus, YSZ/Al_{2}O_{3}$ layered system prepared at the substrate temperature of $800^{circ}C$ shows relatively higher damage tolerance.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.6
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• pp.1047-1055
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• 2006

We patterned nano-width lines on a super hard bulk diamond substrate by varying the ion beam current and ion beam sources with a dual beam field ion beam (FIB). In addition, we successfully fabricated two-dimensional nano patterns and three-dimensional nano plate modules. We prepared nano lines on a diamond and a silicon substrate at the beam condition of 30 kV, 10 pA $\sim$ 5 nA with $Ga^+$ ion and $H_2O$ assisted ion sources. We measured each of the line-width, line-depth, etched line profiles, etch rate, and aspect ratio, and then compared them. We confirmed that nano patterning was possible on both a bulk diamond and a silicon substrate. The etch rate of $H_2O$ source can be enhanced about two times than that of Ga source. The width of patterns on a diamond was smaller than that on a silicon substrate at the same ion beam power The sub-100 nm patterns on a diamond were made under the charge neutralization mode to prevent charge accumulation. We successfully made a two-dimensional, 240 nm-width text of the 300-lettered Lord's Prayer on a gem diamond with 30 kV-30 pA FIB. The patterned text image was readable with a scanning electron microscope. Moreover, three dimensional nano-thick plate module fabrication was made successfully with an FIB and a platinum deposition, and electron energy loss spectrum (EELS) analysis was easily performed with the prepared nano plate module.

• Journal of the Korean Vacuum Society
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• v.15 no.3
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• pp.294-300
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• 2006

We fabricated the distributed feedback (DFB) InP/InGaAs/InP grating structures on InP (100) substrates by metal-organic chemical vapor deposition, and their structural properties were investigated by atomic force microscopy and scanning electron microscopy. Self-assembled InAs/InAlGaAs quantum dots (QDs) were grown on the InP/InGaAs/InP grating structures by molecular beam epitaxy, and their optical properties were compared with InAs/InAlGaAs QDs without grating structure. The duty of the grating structures was about 30%. The PL peak position of InAs/InAlGaAs QDs grown on the grating structure was 1605 nm, which was red-shifted by 18 nm from that of the InAs/InAlGaAs QDs without grating structure. This indicates that the formation of InAs/InAlGaAs QDs was affected by the existence of the DFB grating structures.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.303-303
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• 2012

X-선 반사율 측정법(XRR)은 비파괴적인 측정방법으로 수 nm의 두께를 정밀하게 측정할 수 있는 장점으로 반도체 산업현장에서 많은 관심과 연구가 이루어지고 있다. 이러한 XRR의 두께 측정 정밀도를 향상시키고 부정확한 결과를 방지하기 위하여 측정기기를 검증하고 보정할 수 있는 두께 표준물질을 필요로 하고 있다. 본 연구에서는 IBSD (ion beam sputtering deposition)와 ALD (atomic layer deposition)를 이용하여 5 nm, 10 nm의 $HfO_2$ 박막을 제작하고, XRR용 두께 표준물질로 응용할 수 있는지를 살펴보았다. 먼저 두께표준물질로 제작하기 위해서는 박막과 기판이 안정한 상태를 유지해야 한다. 이에 박막은 공기 중 노출에 의한 산화로 박막의 두께가 변할 수 있는 금속박막 대신에 공기 중에서도 안정한 산화물 박막인 $HfO_2$ 박막을 사용하고 기판은 Si wafer를 thermal공기 중에서도 안정한 산화물 박막인 $HfO_2$ 박막을 사용하고 기판은 Si wafer를 therma oxidation법을 이용하여 $1{\mu}m$ 두께로 제작한 비정질 $SiO_2$ 기판을 사용했다. 제작된 시료의 특성평가를 위해 XRR (X-ray reflectometer) 측정을 통해 두께, 거칠기 및 밀도를 확인하였고, TEM (transmission electron microscope)으로 두께 측정을 하여 XRR로 얻은 두께결과와 비교하였다. 측정결과를 확인하였을 때 두 증착 방법 중 ALD를 이용하여 제작한 시편에서는 박막과 기판사이의 interface가 sharp하여 반사율 곡선의 진폭이 크게 잘 나타났고 fitting 결과도 우수하여 IBSD로 증착한 시편보다 두께 표준물질로 응용하기에 더 적합하였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.50.2-50.2
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• 2009

ZnO 는 상온에서 3.37eV의 넓은 밴드갭과 60 meV의 엑시톤 결합에너지를 가지는 직접형 반도체로서 높은 투과성, 저가의 재료비, 비독성, 친환경적인 재료로서 발광다이오드, 디스플레이 응용분야 등 많은 부분에서 관심을 받고 있다. 유리 기판은무겁고 쉽게 깨지는 특성에도 불구하고 디스플레이 응용분야에서 폭넓게 사용되고 있으나 많은 연구자들은 이러한 문제점들을 해결하기 위해 플렉서블 기판위에서의 ZnO 성장 연구를 진행하고 있다 ZnO를 성장시키는 방법에는 molecular beam epitaxy (MEB), chemical vapordeposition (CVD), 그리고 atomic layer deposition (ALD)등많은 방법들이 있다. 이 연구에서 우리는 플렉서블기판의 플라즈마 전처리에 따른 ZnO의 구조적 그리고 광학적 특성에 대해 연구하였다. ZnO는 ALD 방법에 의해 성장되었고 반응물로는 temperature controlled bath 속에서 $10^{\circ}C$와 $30^{\circ}C$로 각각 온도를 유지시킨 diethylzinc (DEZn)과 distilled water ($H_2O$)를 사용하였다. 성장된 ZnO의 표면 morphology는atomic force microscope (AFM) 과 scanning electron microscope (SEM)으로 측정하였고, 광학적, 구조적특성은 Photoluminescence (PL)와 X-ray diffraction (XRD) 방법으로 각각으로 측정 되었다.

• Journal of the Korean institute of surface engineering
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• v.31 no.6
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• pp.345-358
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• 1998

The evolution of surface roughness and morphology in epitaxial Si and $Si_{0.7}Ge{0.3}$ alloys grown by UHV opm-beam sputter deposition onto nominally-singular, [100]-, and [110]-mi-scut Si(001) was investigated by stomic force microscopy and trasmission electron microscopy. The evolution of surface roughness of epitaxial Si films grown at $300^{\circ}C$ is inconsistent with conventional scaling and hyperscaling laws for kineti roughening. Unstable growth leading to the formation of mounds separated by a well-defined length scale is observed on all substrates. Contraty to previous high-temperature growth results, the presence of steps during deposition at $300^{\circ}C$ increases the tendency toward unstable growth resulting in a much earlier development of mound structures and larger surface roughnesses on vicival substrates. Strain-induced surface roughening was found to dominate in $Si_{0.7}Ge{0.3}$ alloys grown on singular Si(001) substrates at $T_S\ge450^{\circ}C$ where the coherent islands are prererentially bounded along <100> directions and eshibt {105} facetting. Increasing the film thickness above critical values for strain relaxation leads to island coalescence and surface smoothening. At very low growth temperatures ($T_s\le 250^{\circ}C$), film surfaces roughen kinetically, due to limited adatom diffusiviry, but at far lower rates than in the higher-temperature strain-induced regime. There is an intermediate growth temperature range, however, over which alloy film surfaces remain extremely smooth even at thicknesses near critical values for strain relaxation.