• 제목/요약/키워드: Electron diffusion

검색결과 629건 처리시간 0.029초

Nickel Doping on Cobalt Oxide Thin Film Using by Sputtering Process-a Route for Surface Modification for p-type Metal Oxide Gas Sensors

  • Kang, Jun-gu;Park, Joon-Shik;An, Byeong-Seon;Yang, Cheol-Woong;Lee, Hoo-Jeong
    • Journal of the Korean Physical Society
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    • 제73권12호
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    • pp.1867-1872
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    • 2018
  • This study proposes a route for surface modification for p-type cobalt oxide-based gas sensors. We deposit a thin layer of Ni on the Co oxide film by sputtering process and annealed at $350^{\circ}C$ for 15 min in air, which changes a typical sputtered film surface into one interlaced with a high density of hemispherical nanoparticles. Our in-depth materials characterization using transmission electron microscopy discloses that the microstructure evolution is the result of an extensive inter-diffusion of Co and Ni, and that the nanoparticles are nickel oxide dissolving some Co. Sensor performance measurement unfolds that the surface modification results in a significant sensitivity enhancement, nearly 200% increase for toluene (at $250^{\circ}C$) and CO (at $200^{\circ}C$) gases in comparison with the undoped samples.

Ni-Al계 금속간화합물 코팅에 미치는 고주파유도 가열 조건의 영향 (Effects of Induction Heating Conditions on Ni-Al Based Intermetallic Compound Coating)

  • 이한영;김태준;조용재
    • 대한금속재료학회지
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    • 제48권2호
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    • pp.141-147
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    • 2010
  • An Ni-Al intermetallic coating has been produced by induction heating on mild steel. The effect of the induction heating conditions on the microstructure of the coating has been investigated. The reaction synthesis of the intermetallic compounds was promoted while increasing the heating rate and the holding time at reaction temperature. Especially, an NiAl phase corresponding to the initial composition of mixed powder was predominantly formed. However, the synthesis at low reaction temperatures occurred by solid state diffusion during the holding time and an Fe-Al reaction layer was formed at the interface with the substrate, regardless of the heating rate. The combustion synthesis of the intermetallic compound occurred at a temperature higher than 1023 K and resulted in an almost single phase NiAl structure.

Spindt Cathode Tip Processing to Enhance Emission Stability and High-Current Performance

  • Spindt, C.A.;Schwoebel, P.R.;Holland, C.E.
    • Journal of Information Display
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    • 제2권3호
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    • pp.44-47
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    • 2001
  • The extracted field emission current can be used to controllably heat microfabricated cold field emission cathode tips. The heating can be sufficient to smooth and recrystallize the tip surface by surface self-diffusion, and at least partially clean the surface of contaminants by thermal desorption. Self-heating not only allows for the achievement and maintenance of stable emission characteristics, but can be used to make the current-voltage characteristics of microfabricated field emitter tips nearly identical to one another. The resulting improvement in emission uniformity will allow for more reliable array operation at increased electron emission current densities.

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Radiative Transfer in Highly Thick Media through Rayleigh and Raman Scattering with Atomic Hydrogen

  • Chang, Seok-Jun
    • 천문학회보
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    • 제46권2호
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    • pp.40.1-40.1
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    • 2021
  • Hydrogen is the most abundant element in the universe, which is, in the cosmological context, attributed to its simplest structure consisting of a proton and an electron. Hydrogen interacts with an electromagnetic wave in astrophysical environments. Rayleigh scattering refers to elastic scattering, where the frequencies of the incident and scattered photons are the same. Rayleigh and resonance scattering is a critical role study Lyman Alpha objects in the early universe. The scattering causes the frequency and spatial diffusion of Lyα. In the case of Raman scattering, the energies of the incident and scattered photons are different. The photons near Lyβ convert to the optical photons near Hα through Raman scattering. The photon scattered by atomic hydrogen can carry both of the properties of the H I region and the emission region. I adopt a Monte Carlo approach to investigate the formation of the various spectral line features through Rayleigh and Raman scattering in highly thick media of atomic hydrogen. In this thesis, I present my works on radiative transfer involving the scattering processes between far UV photon and atomic hydrogen. I introduce scattering processes with atomic hydrogen and the spectral, spatial, and polarized information originating from the scattering.

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Crack-Free Fabrications of Yttria-Stabilized Zirconia Films Using Successive-Ionic-Layer-Adsorption-and-Reaction and Air-Spray Plus Method

  • Taeyoon Kim;Sangmoon Park
    • 한국재료학회지
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    • 제34권2호
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    • pp.79-84
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    • 2024
  • Thin films of yttria-stabilized zirconia (YSZ) nanoparticles were prepared using a low-temperature deposition and crystallization process involving successive ionic layer adsorption and reaction (SILAR) or SILAR-Air spray Plus (SILAR-A+) methods, coupled with hydrothermal (175 ℃) and furnace (500 ℃) post-annealing. The annealed YSZ films resulted in crystalline products, and their phases of monoclinic, tetragonal, and cubic were categorized through X-ray diffraction analysis. The morphologies of the as-prepared films, fabricated by SILAR and SILAR-A+ processes, including hydrothermal dehydration and annealing, were characterized by the degree of surface cracking using scanning electron microscopy images. Additionally, the thicknesses of the YSZ thin films were compared by removing diffusion layers such as spectator anions and water accumulated during the air spray plus process. Crack-free YSZ thin films were successfully fabricated on glass substrates using the SILAR-A+ method, followed by hydrothermal and furnace annealing, making them suitable for application in solid oxide fuel cells.

방사선사고시 피폭선량평가를 위한 휴대전화 부품의 전자상자성공명(EPR) 특성에 대한 예비 연구 (Preliminary Study on Electron Paramagnetic Resonance(EPR) Signal Properties of Mobile Phone Components for Dose Estimation in Radiation Accident)

  • 박병룡;하위호;박선후;이진경;이승숙
    • Journal of Radiation Protection and Research
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    • 제40권4호
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    • pp.194-201
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    • 2015
  • 본 연구에서는 전자상자성공명(electron paramagnetic resonance, EPR) 장치를 사용한 휴대전화 부품들의 EPR 특성 측정을 통해 방사선사고시 회구적 선량평가용 선량계로써 활용가능성에 대하여 확인하였다. 화면표시 방식이 다른 두 스마트폰에서 12개의 시료를 선정하여 실험에 사용하였고, 시료의 방사선조사에는 $^{137}Cs$ 감마선 그리고 EPR 측정은 실온에서 Bruker사의 ELEXSYS E500 X-Band EPR spectrometer를 사용하여 수행하였다. 먼저 각 시료에 대하여 비조사시료와 조사시료의 EPR 스펙트럼을 측정하여 방사선에 의한 라디칼 생성 여부를 확인하였고, 그 후 선량반응곡선과 시간에 따른 시그널 크기 변화를 측정하였다. 측정결과 유심 플라스틱과 IC 칩을 제외한 모든 시료에서 방사선에 의한 EPR 시그널 증가를 확인할 수 있었다. 시료 중에서 덮개유리, 카메라렌즈, 도광판, 확산시트는 결정계수 $R^2=0.93$이상의 좋은 선형상관관계를 보였다. 특히 도광판은 선량에 따른 시그널 증가량이 가장 크고 백그라운드 시그널이 없기 때문에 선량평가에 이상적인 특성을 가지고 있었지만, 72 시간 이내에 시그널이 약 50% 감소하는 약점이 있었다. 확산시트 또한 도광판과 유사한 페이딩 특성을 나타내었고, 덮개유리와 카메라렌즈는 단기간 동안에는 시그널이 안정적으로 보존되었다. 휴대전화 부품을 이용한 EPR 선량평가를 실제 대규모 방사선 사고에서 신속하게 적용하기 위해서는 더 많은 휴대전화 기종의 같은 부품에 대한 시그널 차이, 페이딩, 시료 전처리 방법 등에 대한 추가연구가 진행될 필요가 있다. 그러나 현재 결과를 바탕으로 소규모 방사선사고시 피폭환자가 소지하고 있던 휴대전화와 동일한 제품을 구입하여 비교하는 방법 또는 추가조사법을 이용한 선량평가는 가능할 것으로 판단된다.

저온 및 고전류밀도 조건에서 전기도금된 구리 박막 간의 열-압착 직접 접합 (Thermal Compression of Copper-to-Copper Direct Bonding by Copper films Electrodeposited at Low Temperature and High Current Density)

  • 이채린;이진현;박기문;유봉영
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2018년도 춘계학술대회 논문집
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    • pp.102-102
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    • 2018
  • Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

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바이오틴 함유 나노리포좀의 안정성에 관한 연구 (Study on the Stability of Biotin-containing Nano-liposome)

  • 양성준;김태양;이춘몽;이광식;윤경섭
    • 대한화장품학회지
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    • 제46권2호
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    • pp.133-145
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    • 2020
  • 본 연구는 용해도가 낮은 수용성 활성물질인 바이오틴(biotin)의 안정화 및 용해도 증가를 목적으로 나노리포좀을 활용하였다. 이번 실험을 통해 바이오틴 나노리포좀의 안정성에 pH가 큰 영향을 준다는 사실을 확인할 수 있었으며, pH 상승이 바이오틴 활성에 튼 영향을 미치지 않음을 확인하였다. 또한 제타사이저(zetasizer)로 입자크기, 제타전위(zeta potential) 및 다분산지수(polydispersity index)를 측정하여 안정성을 평가하였다. 입자크기는 평균 100 ~ 250 nm, 제타전위 -80 ~ -30 mV로 나노리포좀 제조가 가능함을 확인하였다. 바이오틴 나노리포좀 내의 바이오틴 캡슐화율(capsulation efficiency)을 측정하기 위해 dialysis membrane method (DMM)를 이용하여 평가하였으며, 이를 통해 알지닌을 첨가시킨 바이오틴 나노리포좀이 일반 바이오틴 나노리포좀보다 캡슐화율이 5 배 높은 것으로 측정되었다. 바이오틴 나노리포좀의 경피흡수율을 측정하기 위해 in vitro franz diffusion cell method를 통해 확인하였으며, cryogenic transmission electron microscopy (cryo - TEM)을 통해 바이오틴 나노리포좀이 잘 형성되었는지 확인하였다. 본 논문을 통하여 모발건강과 밀접한 관계가 있는 것으로 소개된 바이오틴을 약물전달체(drug delivery carrier)인 나노리포좀에 캡슐화시켜 기존의 낮은 용해도 및 석출되는 문제를 보완한 바이오틴 나노리포좀을 만들 수 있음을 확인하였다.

역 알루미늄 유도 결정화 공정을 이용한 실리콘 태양전지 다결정 시드층 생성 (Fabrication of Poly Seed Layer for Silicon Based Photovoltaics by Inversed Aluminum-Induced Crystallization)

  • 최승호;박찬수;김신호;김양도
    • 한국재료학회지
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    • 제22권4호
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    • pp.190-194
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    • 2012
  • The formation of high-quality polycrystalline silicon (poly-Si) on relatively low cost substrate has been an important issue in the development of thin film solar cells. Poly-Si seed layers were fabricated by an inverse aluminum-induced crystallization (I-AIC) process and the properties of the resulting layer were characterized. The I-AIC process has an advantage of being able to continue the epitaxial growth without an Al layer removing process. An amorphous Si precursor layer was deposited on Corning glass substrates by RF magnetron sputtering system with Ar plasma. Then, Al thin film was deposited by thermal evaporation. An $SiO_2$ diffusion barrier layer was formed between Si and Al layers to control the surface orientation of seed layer. The crystallinity of the poly-Si seed layer was analyzed by Raman spectroscopy and x-ray diffraction (XRD). The grain size and orientation of the poly-Si seed layer were determined by electron back scattering diffraction (EBSD) method. The prepared poly-Si seed layer showed high volume fraction of crystalline Si and <100> orientation. The diffusion barrier layer and processing temperature significantly affected the grain size and orientation of the poly Si seed layer. The shorter oxidation time and lower processing temperature led to a better orientation of the poly-Si seed layer. This study presents the formation mechanism of a poly seed layer by inverse aluminum-induced crystallization.

스퍼터링 증착한 CdTe 박막의 효과적인 Ag 도핑을 위한 이온 교환법 연구 (A Study on Ion Exchange Method for Effective Ag Doping of Sputtering-Deposited CdTe Thin Film)

  • 김철준;박주선;이우선
    • 전기학회논문지
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    • 제60권6호
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    • pp.1169-1174
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    • 2011
  • CdTe thin-film solar cell technology is well known that it can theoretically improve its conversion efficiency and manufacturing costs compared to the conventional silicon solar cell technology, due to its optical band gap energy (about 1.45eV) for solar energy absorption, high light absorption capability and low cost requirements for producing solar cells. Although the prior studies obtained the high light absorption, CdTe thin film solar cell has not been come up to the sufficient efficiency yet. So, doping method was selected for the improvement of the electrical characteristics in CdTe solar cells. Some elements including Cu, Ag, Cd and Te were generally used for the p-dopant as substitutional acceptors in CdTe thin film. In this study, the sputtering-deposited CdTe thin film was immersed in $AgNO_3$ solution for ion exchange method to dope Ag ions. The effects of immersion temperature and Ag-concentration were investigated on the optical properties and electrical characteristics of CdTe thin film by using Auger electron spectroscopy depth-profile, UV-visible spectrophotometer, and a Hall effect measurement system. The best optical and electrical characteristics were sucessfully obtained by Ag doping at high temperature and concentration. The larger and more uniform diffusion of Ag ions made increase of the Ag ion density in CdTe thin film to decrease the series resistance as well as mede the faster diffusion of light by the metal ions to enhance the light absorption.