• Journal of Korea Foundry Society
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• v.26 no.1
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• pp.40-45
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• 2006

Most of the work reported concerned the semi-solid processing of low melting point alloys, and in particular light alloys of aluminum and magnesium. The purpose of this paper is to develop a semi-solid microstructure of Cu alloys using electromagnetic stirring applicable for squirrel cage rotor of induction motor. The size of primary solid particle and the degree of sphericity as a function of the variation in cooling rate, stirring speed, and holding time were observed. By applying electromagnetic stirring, primary solid particles became finer and rounder relative to as-cast sample. As the input frequency increased from 30 to 40 Hz, particle size decreased. The size of primary solid particle was found to be decreased with increasing cooling rate. Also, it decreased with stirring up to 3 minutes but increased above that point. The degree of sphericity became closer to be 1 with hold time. Semi-solid microstructure of Cu alloys, one of the high melting point alloys, could be controlled by electromagnetic stirring.

• Journal of Korea Foundry Society
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• v.13 no.5
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• pp.402-410
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• 1993

• Transactions of Materials Processing
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• v.16 no.2 s.92
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• pp.113-119
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• 2007

Rapid mold heating has been recent issue to enable the injection molding of thin-walled parts or micro/nano structures. Induction heating is an efficient way to heat material by means of an electric current that is caused to flow through the material or its container by electromagnetic induction. It has various applications such as heat treatment, brazing, welding, melting, and mold heating. The present study covers a finite element analysis of the induction heating process which can rapidly raise mold temperature. To simulate the induction heating process, the electromagnetic field analysis and transient heat transfer analysis are required collectively. In this study, a coupled analysis connecting electromagnetic analysis with heat transfer simulation is carried out. The estimated temperature changes are compared with experimental measurements for various heating conditions.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1512-1513
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• 2007

In this paper the influence of CMOS- and TTL-technology on the breakdown and destruction effects by artificial electromagnetic waves is determined. Different electronic devices(3 CMOS & 5 TTL) were exposed to high amplitude electromagnetic waves. CMOS ICs were occurred only destruction below the max electric field and TTL ICs were occurred breakdown and destruction below the max electric field. The SEM analysis of the destruction devices showed onchipwire and bondwire destruction like melting due to thermal effect. The test results are applied to the data which understand electromagnetic wave effects of electronic equipments.

• Journal of Korea Foundry Society
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• v.25 no.3
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• pp.115-122
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• 2005

In the present study, an EMC (Electromagnetic Casting) process, using a segmented Cu cold crucible under a high frequency alternating magnetic field of 20 kHz, was practiced for the fabrication of poly-crystalline Si ingot of 50 mm diameter. The effects of Joule heating and electromagnetic pressure in molten Si were systematically investigated with various processing parameters such as electric current and crucible configuration. A preliminary experimental work was initiated with the pure Al system for the establishment of a stabilized non-contact working condition, and further adapted to the semiconductor-off-grade Si system. A commercialized software such as Opera-3D was utilized in order to simulate electromagnetic pressure and Joule heating. In order to evaluate the meniscus shape of the molten melts, shape parameter was used throughout the research. A segmented graphite crucible, which was attached at the upper part of the cold crucible, was introduced to enhance significantly the heating efficiency of Si melt keeping non-contact condition during continuous melting and casting processes.

• Journal of the Korea Institute of Military Science and Technology
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• v.11 no.6
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• pp.148-155
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• 2008

We investigated the damage effects of microcontroller devices under high power electromagnetic(HPEM) wave. HPEM wave was radiated from the open-ended standard rectangular waveguide(WR-340) to free space. The influence of different reset-, clock-, data-, and power supply-line lengths has been tested. The susceptibility of the tested microcontroller devices was in general much influenced by clock-, reset-, and power supply-line length, little influenced by data-line length. Further the line length was increased, the malfunction threshold was decreased as expected, because more energy couples to the devices. The surfaces of the destroyed microcontroller devices were removed and the chip conditions were investigated with microscope. The microscopic analysis of the damaged devices showed component and bondwire destructions such as breakthroughs and melting due to thermal effects.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.7
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• pp.1282-1287
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• 2007

We investigated the damage of the CMOS IC which manufactured three different technologies by high power microwave. The tests separated the two methods in accordance with the types of the CMOS IC located inner waveguide. The only CMOS IC which was located inner waveguide was occurred breakdown below the max electric field (23.94kV/m) without destruction but the CMOS IC which was connected IC to line organically was located inner waveguide and it was occurred breakdown and destruction below the max electric field. Also destructed CMOS IC was removed their surface and a chip condition was analyzed by SEM. The SEM analysis of the damaged devices showed onchuipwire and bondwire destruction like melting due to thermal effect. The tested results are applied to the fundamental data which interprets the combination mechanism of the semiconductors from artificial electromagnetic wave environment and are applied to the data which understand electromagnetic wave effects of electronic equipments.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.954-956
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• 1993

This paper describes the process of levitation melting of metals in an axisymmetric induction heating system. This process has advantages of low heat losses, heating with short times and clean operating conditions. The shape of molten metal is determined using sensitivity analysis and optimization technique. Electromagnetic, gravitational and surface tension energies are considered, and these energies are used as an objective function in optimization process. Electromagnetic field are calculated using the finite element method. The fact that volume is constant in the process is also considered as an equality constraint.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.12
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• pp.2263-2268
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• 2008

We investigated the malfunction and destruction characteristics of microcontroller devices under high power electromagnetic(HPEM) wave by magnetron. HPEM was rated at a microwave output of 0 to 1,000 W, at a frequency of 2,450${\pm}$50 MHz and was radiated from the open-ended standard rectangular waveguide(WR-340) to free space. The influence of different reset-, clock-, data-, and power supply-line lengths has been tested. The variation of the line length was done with flat cables. The susceptibility of the tested microcontroller devices was in general much influenced by clock-, reset-, and power supply-line length, little influenced by data-line length. Further the line length was increased, the malfunction threshold was decreased as expected, because more energy couples to the devices. The surfaces of the destroyed microcontroller devices were removed and the chip conditions were investigated with microscope. The microscopic analysis of the damaged devices showed component and bondwire destructions such as breakthroughs and melting due to thermal effects. The obtained results are expected to provide fundamental data for interpreting the combined mechanism of microcontroller devices in an intentional microwave environment.

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.187.2-187.2
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• 2011

태양광산업의 value chain중 up-stream쪽인 고순도 실리콘산업은 셀, 모듈, 시스템 쪽에 비하여 영업 이익률이나 부가가치 측면에서 매우 높은 성장성을 현재 보여주고 있으며 최근 원자력산업의 안전성 문제가 대두됨으로 인하여 태양광수요가 전 세계적으로 증대되는 경향을 나타내어 태양광용 실리콘의 수요가 확대됨과 아울러 spot시장에서의 가격 또한 상승하고 있다. 이런 관점에서 잉곳 및 웨이퍼 가공 중에 발생하는 고순도 실리콘 폐기물의 재활용 이 다시 주목받고 있다. 태양전지 웨이퍼(wafer)용 소재는 6N급 이상의 결정질 실리콘 잉곳(ingot)이 주를 이루며, 고효율의 셀을 제조하기 위해서 단결정 실리콘 잉곳이 많이 사용된다. 실리콘 단결정을 육성하는 방법에는 Floating zone 법, Czochralski 법, Bridgeman 법, CVD 등 매우 다양하다. 이 중 Czochralski 법은 전체 생산량의 대부분을 차지하고 있는 방법으로, 용융액에서 결정을 인상하여 ingot을 제작하는 방법이다. 그러나 대량의 전기에너지를 소비하여 제작되는 고순도의 실리콘 단결정 잉곳은 후 가공공정에서 그 절반 이상이 분말(powder) 및 슬러지(sludge)로 폐기되므로, 자원의 재활용 및 환경오염 측면에서 주요과제가 되고 있다. Czochralski 법으로 제작된 ingot의 경우 그 표면이 매끄럽지 못하여, 웨이퍼 단위의 가공 시 형태가 진원이 될 수 있도록 표면을 미리 연마(grinding)하는데, 이때에도 미세 분말이 다량 발생하게 된다. 본 연구에서는 이러한 고순도 단결정 실리콘 ingot의 연마 가공공정에서 발생한 미세 분말을 용해하여 보았다. 진공 챔버(chamber) 내부에 유도가열 코일과 냉도가니로 구성된 장비를 통해 전자기유도가열을 이용하여 실리콘 분말 폐기물을 용해하고, 그 시편을 ICP-MS 및 비저항 측정을 통해 분말 의 특성을 조사하여 재활용 가능성을 검토해 보았다.