• Title/Summary/Keyword: Electromagnetic Coupling

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Analysis of HEMP Coupling Signal for a Coaxial Cable with Braided Shields (Braided Shield를 가진 동축 케이블의 HEMP 결합 신호 해석)

  • Lee, Jin-Ho;Cho, Jea-Hoon;Kim, Eung-Jo
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.22 no.8
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    • pp.790-796
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    • 2011
  • The system which is exposed in the impact range of High-altitude Electromagnetic Pulse(HEMP) may get serious damage because HEMP has a very large electric field value, a very fast rise-time, and so on. Electromagnetic analysis should be performed for signals coupled to the opening or cables of the system prior to derive the system design specifications in order to protect the system against HEMP adequately. In this paper, we analyzed the HEMP coupled signals for the coaxial cable which is generally used to transmit and receive video or RF signals and compared the coupled signal of the one wire with that of the inner conductor of a coaxial cable to confirm the decreased effect of HEMP by the shield. The coaxial cable is analyzed by the external and internal region of the shield separately. For the external region of the coaxial cable, general scattered equation was applied to calculate currents on the surface of the shield and for internal region of the coaxial cable, chain matrix algorithm is used. To verify this paper the analyzed results were compared the results of the existing paper and the two results have good agreements.

Low-Pass Filter with Wide Stop-Band Characteristics Using Controllable Transmission Zeros (제어 가능한 전송 영점을 이용한 광대역 차단 특성을 갖는 저역 통과 필터)

  • Lee, Geon-Cheon;Kim, Yu-Seon;Kim, Kyung-Keun;Lee, Tae-Sung;Na, Hyeon-Sik;Lim, Yeong-Seog
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.18 no.8
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    • pp.887-894
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    • 2007
  • In this paper, design and fabrication of the LPF with controllable four transmission zeros using electric coupling and added open stub is presented. Pass-band of the LPF is GSM band, and two transmission zeros are generated by the electric coupling at the WiBro and S-DMB band, And the other two transmission zeros are generated by the open stub at the upper frequencies. Harmonic frequency of the stop-band is suppressed by the realization of the filter using quasi-lumped element with small parasitic values. $C_M$, which is the electric coupling element of the equivalent circuit, is realized by the distance control between the open stubs of the filter structure. The fabricated LPF used teflon substrate with relative permittivity of 2.6. And it has a size of $38{\times}20{\times}0.79 mm^3$, which is including a feed line. The measured 3 dB cut-off frequency is 1.55 GHz, and locations of the transmission zeros are 2.20, 2.43, 4.11 and 6.84 GHz, respectively.

Review of Failure Mechanisms on the Semiconductor Devices under Electromagnetic Pulses (고출력전자기파에 의한 반도체부품의 고장메커니즘 고찰)

  • Kim, Dongshin;Koo, Yong-Sung;Kim, Ju-Hee;Kang, Soyeon;Oh, Wonwook;Chan, Sung-Il
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.6
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    • pp.37-43
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    • 2017
  • This review investigates the basic principle of physical interactions and failure mechanisms introduced in the materials and inner parts of semiconducting components under electromagnetic pulses (EMPs). The transfer process of EMPs at the semiconducting component level can be explained based on three layer structures (air, dielectric, and conductor layers). The theoretically absorbed energy can be predicted by the complex reflection coefficient. The main failure mechanisms of semiconductor components are also described based on the Joule heating energy generated by the coupling between materials and the applied EMPs. Breakdown of the P-N junction, burnout of the circuit pattern in the semiconductor chip, and damage to connecting wires between the lead frame and semiconducting chips can result from dielectric heating and eddy current loss due to electric and magnetic fields. To summarize, the EMPs transferred to the semiconductor components interact with the chip material in a semiconductor, and dipolar polarization and ionic conduction happen at the same time. Destruction of the P-N junction can result from excessive reverse voltage. Further EMP research at the semiconducting component level is needed to improve the reliability and susceptibility of electric and electronic systems.

An Electrical Properties Analysis of CMOS IC by Narrow-Band High-Power Electromagnetic Wave (협대역 고출력 전자기파에 의한 CMOS IC의 전기적 특성 분석)

  • Park, Jin-Wook;Huh, Chang-Su;Seo, Chang-Su;Lee, Sung-Woo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.9
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    • pp.535-540
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    • 2017
  • The changes in the electrical characteristics of CMOS ICs due to coupling with a narrow-band electromagnetic wave were analyzed in this study. A magnetron (3 kW, 2.45 GHz) was used as the narrow-band electromagnetic source. The DUT was a CMOS logic IC and the gate output was in the ON state. The malfunction of the ICs was confirmed by monitoring the variation of the gate output voltage. It was observed that malfunction (self-reset) and destruction of the ICs occurred as the electric field increased. To confirm the variation of electrical characteristics of the ICs due to the narrow-band electromagnetic wave, the pin-to-pin resistances (Vcc-GND, Vcc-Input1, Input1-GND) and input capacitance of the ICs were measured. The pin-to-pin resistances and input capacitance of the ICs before exposure to the narrow-band electromagnetic waves were $8.57M{\Omega}$ (Vcc-GND), $14.14M{\Omega}$ (Vcc-Input1), $18.24M{\Omega}$ (Input1-GND), and 5 pF (input capacitance). The ICs exposed to narrow-band electromagnetic waves showed mostly similar values, but some error values were observed, such as $2.5{\Omega}$, $50M{\Omega}$, or 71 pF. This is attributed to the breakdown of the pn junction when latch-up in CMOS occurred. In order to confirm surface damage of the ICs, the epoxy molding compound was removed and then studied with an optical microscope. In general, there was severe deterioration in the PCB trace. It is considered that the current density of the trace increased due to the electromagnetic wave, resulting in the deterioration of the trace. The results of this study can be applied as basic data for the analysis of the effect of narrow-band high-power electromagnetic waves on ICs.

Equivalent Circuit Modeling of Aperture-Coupled Microstrip-to-Vertically Mounted Slotline Coupler (개구면을 통한 마이크로스트립-수직 슬롯 라인 결합 구조의 회로망 해석과 모델링)

  • Nam, Sang-Ho;Kim, Jeoung-Phill
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.20 no.4
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    • pp.357-365
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    • 2009
  • A general analysis of a microstrip-to-vertically mounted slotline(VMS) coupler is presented with a view to developing an equivalent circuit, and the efficient evaluation of the related circuit element values. Based on this theory, the effects of frequency and structure parameters such as aperture length and VMS width on the characteristics of the coupler are studied. In order to check the validity of the proposed analysis and design theory, a C-band linearly tapered slot antenna fed by an aperture-coupled back-to-back microstripline-to- VMS coupling structure is optimally designed using a hybrid genetic algorithm. Moreover, the computed characteristics from the network analysis is compared to the measurement and simulation results. The obtained results fully validate the efficiency and accuracy of the proposed network model.

Design and Crosstalk Analysis of MEMS Probe Connector System (누화 특성 감소를 위한 MEMS 프로브 커넥터 시스템의 설계)

  • Bae, Hyeon-Ju;Kim, Jong-Hyeon;Lee, June-Sang;Pu, Bo;Lee, Jae-Joong;Nah, Wan-Soo
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.23 no.2
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    • pp.177-186
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    • 2012
  • In this paper, we propose a design method that the crosstalk of probe connector pins satisfy the limitation of -30 dB. The parameters(inductance and capacitance) were extracted in the grid-structured probe connector pin system, and it is shown that the new parameters are easily calculated with increasing ground pin numbers using the previously calculated parameters. In addition, the crosstalk reduction algorithm by employing more grounds around the signal pin has been suggested, and it is confirmed that the suggested method is quite effective especially for the reduction of inductive couplings. Finally, we suggested the correlation between the pitch and the length of the pins to satisfy the crosstalk limitation of -30 dB with the given number of ground pins, which will be quite useful when design a probe connector pin system.

A Design and Implementation of Digital Ultra-Narrowband Walky-Talky Using Direct Conversion Method (직접 변환 방식을 이용한 디지털 초협대역 무전기 설계 및 구현)

  • Chong Young-Jun;Kang Min-Soo;Yoo Sung-Jin;Chung Tae-Jin;Oh Seung-Hyeub
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.16 no.6 s.97
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    • pp.603-614
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    • 2005
  • In this paper, digital ultra-narrowband Walky-Talky using direct conversion method for CQPSK modulation scheme is implemented with satisfying the requirements of APCO P25. RF transceiver design and implementation scheme that minimize the influence of DC-offset and AC-coupling at ultra-narrowband is proposed. This scheme also minimizes the influence of nonlinear characteristic at power amplifier fir CQPSK modulation method. Test results of full system including DSP module and direct conversion RF transceiver show that FCC emission mask at 36.8 dBm PEP meets the standard requirements. The characteristic of receiver AGC by PWM control signal is linear at 40 dB dynamic range and voice communication at input power level of -116 dBm is successful. Also it is verified that the performance of BER versus frequency offset and versus SNR meets the standard requirements.

Study on Improvement of the Array Antenna Performance by Isolation Enhancement (격리도 향상을 통한 배열안테나의 성능개선 연구)

  • Park, Minseo;Lee, Jae-Gon;Lee, Jeong-Hae
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.27 no.3
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    • pp.229-238
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    • 2016
  • In this paper, we have studied isolation enhancement using a suppression of surface wave to improve performance of array antenna. To reduce isolation between elements of array antenna, perfect magnetic conductor(PMC) and SOFT-surface is designed and located at center of ground plane, isolation and gain is simulated by commercial full wave simulator(HFSS). As a result, isolation of more than 40 dB and gain improvement of 2.2 dBi are obtained at E-plane array in case of both PMC and SOFT-surface. At H-plane array, air coupling is dominant compared to coupling by surface wave. It is conclude that this study is useful for design of compact array antenna and performance improvement of array antenna.

Damage Effect and Delay Time of CMOS Integrated Circuits Device with Coupling Caused by High Power Microwave (도선에 커플링 되는 고출력 전자파에 의한 CMOS IC의 피해 효과 및 회복 시간)

  • Hwang, Sun-Mook;Hong, Joo-Il;Han, Seung-Moon;Huh, Chang-Su
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.19 no.6
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    • pp.597-602
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    • 2008
  • This paper examines the damage effect and delay time of CMOS integrated circuits device with coupling caused by high power microwaves. The waveguide and magnetron was employed to study the influence of high power micro-waves on CMOS inverters. The CMOS inverters were composed of a LED circuit for visual discernment. Also CMOS inverters broken by high power microwave is observed with supply current and delay time. When the power supply current was increased 2.14 times for normal current at 9.9 kV/m, the CMOS inverter was broken by latch-up. Three different types of damage were observed by microscopic analysis: component, onchipwire, and bondwire destruction. Based on the results, CMOS inverters can be applied to database to elucidate the effects of microwaves on electronic equipment.

Evaluation of KOMPSAT-2 System in the Conducted EMC Environment (전도성 전자파환경에서의 다목적실용위성 2호 시스템 설계 검증)

  • Kim, Tae-Youn;Lim, Seong-Bin;Choi, Seok-Weon
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.32 no.8
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    • pp.138-144
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    • 2004
  • Satellite generates a complex electromagnetic noise by conducted and radiated coupling effect of the various electrical instruments. This noise may cause serious problems on the satellite system. To minimize the electromagnetic coupling effects and maintain the system safety margin, system noise reduction technique should be applied from the beginning of the system design. The KOMPSAT-2 system is evaluated by measuring the conducted noise on system electrical power leads and verifying a 6dB system safety margin under the complex noise environment with current injection. This paper describes the KOMPSAT-2 system evaluation result performed on ETB(Electrical Test Bed) and the analysed noise element, the analysed result will be reflected on FM(Flight Model) EMC test.