• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.06a
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• pp.68-68
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• 2001

• Proceedings of the Korean Ceranic Society Conference
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• 2003.04a
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• pp.120.2-120
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• 2003

• Journal of Korean Society of Environmental Engineers
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• v.38 no.1
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• pp.1-7
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• 2016

In order to treat electrolysis nickel plating pickling wastewater to meet the effluent limit less than 3.0 mg/L, the electrolysis process by using soluble and insoluble electrode were studied. Electrolysis using soluble electrodes has a characteristic of easy elution from the electrode which the insoluble electrodes close not release metal from the electrode. For these reasons, there exist different characteristics in nickel removal efficiency, purity of nickel sludge. With this connection, the feasibility test were concluded to develop optimal conditions for the treatment of pickling wastewater electrolysis by using soluble electrodes, insoluble electrodes. Optimal condition of current density, pH were derived from the pickling wastewater using insoluble electrodes. It was concluded the highest removal efficiency of nickel at the operation condition of at pH 9, current density of $15mA/cm^2$. At these conditions, 95.3% purity of nickel sludge was achieved, iron content was 2.9%. Optimal condition when using soluble electrodes was derived current density of $10mA/cm^2$, pH 9. Purity of nickel sludge was 77.3%, iron content was 21.0%. 50.7% and 24.2% of operating cost can be saved by the use of soluble electrodes and the use of insoluble electrodes, respectively.

• Proceedings of the Materials Research Society of Korea Conference
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• 1992.05b
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• pp.26-27
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• 1992

The effect of activation and electroless nickel plating conditions on contact properties were investigated for selective electroless nickel plating of Si farers in order to obtain an optimum condition of contact hole filling. According to RCA prosess, p-type si 1 icon (100) surface was cleaned out and activated. The effects of temperture, DMAB concentration, time, and stirring iwere investigated for activation of p-type Si(100) surface. The optimal activation condition obtained was 0.5M HF, 1mM PdCl$_2$, 2mM EDTA, 7$0^{\circ}C$, 90sec under ultrasonic vibration. In electroless nickel plating, the effect of temperature, DMAB concentration, pH, and plating ti me were studied. The optimal plating condition found was 0. 10M NiS0$_4$.$H_2O$, 0.lIM Citrate, pH 6.8, 6$0^{\circ}C$, 30 minutes. The contact resistence of fi]ms wascomparatively low. It took 30 minutes to obtain 1$\mu$m thick film with 8$\mu$M DMAB concentration. The film surface roughness was improved with increasing temperature and decreasing pH of the plating solution. The best quality of the film was obtained with the condition of temperature 6$0^{\circ}C$ and pH 6.8. The micro-victors hardness of film was about 600Hv and was decreased wi th increasing particle size of plating layer.

• Journal of the Korean institute of surface engineering
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• v.22 no.2
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• pp.69-77
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• 1989

Codeposion of inert particles particles in a metallic mateix by electroless plating process involves two phenomena. Firstly, the adsorption of inercles and secondly, the adsorption of inert particles on the cathode. In the present paper the first adsorption phenomenon and in the next paper the second ane are studied in greaterdetail for the Ni-SiCc, Ni-Al2AO3 and Ni-WC systems. Measurements of the Zeta potentials for the SiC and Al2AO3 particles have been in different electrolyte solutions and the ionic species adsorbed on the Particles studied. The addition of sodium acetate, trisodium citrate and sodium phosphinate to nikel sulface sruomotes the zeta potential of SiC and Al2O3 particles, but zeta phosphinate to nickel is more positive than Al2O3 particles although the amount of nickel ion adsorbrd on the Al2O3 particles become greater than that of SiC particles. It is suggested that this is due to adsortion of Na ion onto the surface SiC particles.

• Transactions of the Korean hydrogen and new energy society
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• v.20 no.4
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• pp.291-299
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• 2009

Ni-plated polytetrafluoroethylene(Ni-PTFE) particles($25{\mu}m$, $500{\mu}m$) were prepared by using nickel electroless plating. The Ni content in Ni-PTFE particles increased with increasing the amount of reduction agent. At about 53 wt% Ni content, $25{\mu}m$ Ni-PTFE particles showed conductivity of 320S/m. The Ni-PTFE particles were formed into the Ni-PTFE plate using heat treatment at $350^{\circ}C$ under $10{\sim}1000kg/cm^2$. The Ni-PTFE plate displayed the high conductivity of 5100S/m due to the formation of 3-dimentional Ni network. The plate was used as an electrode in an alkaline fuel cell(AFC). In terms of the current density, the Ni-PTFE electrode having higher Ni content(53 wt%) showed improved performance.

• Korean Journal of Metals and Materials
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• v.48 no.5
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• pp.462-468
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• 2010

Carbon Nanotubes (CNTs) have recently emerged as a material with outstanding properties. It has shown promising potential for applications in many engineering fields as electronic devices, thermal conductors, and light-weight composites. Researchers have investigated their use as reinforcements in themetal matrix composites of CNTs. In the present work, we decorated CNTs with Ni particles by electroless plating. The CNTs were wet-ball milled for various milling times with a nickel sulfate solution. The precipitated Ni particles were observed mainly by FESEM. In this study, the dispersion of the CNTs and Ni particles was improved with the addition of the surfactant. Also, as the CNTs were shortened and widened by an increased ball milling time, the size of the precipitated Ni particles increased. It was estimated that the CNTs were deformed and caused some defects on their surface during the ball milling process. Those defects were assumed to be heterogeneous nucleation sites for the Ni particles.

• Korean Journal of Materials Research
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• v.8 no.5
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• pp.444-449
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• 1998

There are various shielding materials that have been considered; the use of a metallic plate or the layering of a conductive material on a plastic surface and the insertion of filler in plastics. All of these methods have shown their merits and weakness. Therefore, many studies have concentrated on developing materials that effectively cut down EMI without increase in weights of housing materials. In these respects, this study has focused on investigations of the shielding effect of materials that have electroless nickel plating on the lamella structured micro particles surface with low specific gravity. When a film of electroless nickel were plated on a micro particle surfaces and then mixed with paint, the electromagnetic shielding effects were measured as 63dB. Although these effects were less than that 90dB of the copper plate, trials in a series of 6 times increased the shielding effect by IOdB and is applicable to wide range of EMI shielding.

• Korean Journal of Metals and Materials
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• v.50 no.1
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• pp.71-77
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• 2012

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

• Korean Journal of Metals and Materials
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• v.49 no.3
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• pp.237-242
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• 2011

The effect of shearing speed on the shear force and energy of Sn-0Ag-0.5Cu solder ball was investigated. Various UBM (under bump metallurgy)'s on Cu pads were used such as ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold; Ni/Pd/Au), ENIG (Electroless Nickel, Immersion Gold; Ni/Au), OSP (Organic Solderability Preservative). To fabricate a shear test specimen, a solder ball, $300{\mu}m$ in diameter, was soldered on a pad of FR4 PCB (printed circuit board) by a reflow soldering machine at $245^{\circ}C$. The solder bump on the PCB was shear tested by changing the shearing speed from 0.01 m/s to 3.0 m/s. As experimental results, the shear force increased with a shearing speed of up to 0.6 m/s for the ENIG and the OSP pads, and up to 0 m/s for the ENEPIG pad. The shear energy increased with a shearing speed up to 0.3 m/s for the ENIG and the OSP pads, and up to 0.6 m/s for the ENEPIG pad. With a high shear speed of over 0 m/s, the ENEPIG showed a higher shear force and energy than those of the ENIG and OSP. The fracture surfaces of the shear tested specimens were analyzed, and the fracture modes were found to have closer relationship with the shear energy than the shear force.