• 제목/요약/키워드: Electroforming process

검색결과 60건 처리시간 0.033초

전주공정을 이용한 팔만대장경 동판제작 (Duplication of Koryo Tripitaka (Taejang′kyong) by Copper Electroforming)

  • 김인곤;강경봉;이재근;오명현
    • 한국표면공학회지
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    • 제37권1호
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    • pp.22-27
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    • 2004
  • Copper electroforming process has been applied to duplicate Koryo Tripitaka (Taejang'kyong), wooden printing block. Thin copper replica printing plates of 1 mm thickness was successfully manufactured from the printing face (54.5${\times}$25.5 cm) of wooden printing plate. Major processes are (1) silicon rubber replication of the master (2) silvering on silicon rubber (3) copper electroforming (4) separation of copper from the silicon mandrel (5) final coloring by brass plating and trimming. This process has various Potential applications in making thin metallic objects such as plaques, statues, bust and hollow metal objects for jewelry.

Fe-Ni 합금 극박재 제조를 위한 전주성형기술 및 극박재 특성 (Electroforming and Properties of Fe-Ni alloy thin foil)

  • 임태홍;이흥렬
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2004년도 추계학술대회논문집
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    • pp.188-191
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    • 2004
  • Electroforming is a process that employs technology similar to that used for electroplating but which is used for manufacturing metallic articles, rather than as a means of producing surface coatings. Electroforming provides a cost-effective means of producing alloys and fully dense nanocrystalline metals as foils, sheets and complex shapes. It was able to make Fe-Ni foil with $5{\mu}m$ thickness by electroforming. Electroformed Fe-Ni alloy was nanocrystalline and the yield strength was in the range $2000{\sim}2800\;MPa$. The magnetic permeability at high frequency of electroformed Fe-Ni foil was higher than that of thicker foils.

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전주도금법에 의한 전자파 차폐용 Ni메쉬 제조기술 (Nickel Mesh for EMI Shielding by Continuous Electroforming)

  • 김만;권식철;박상언;이경렬
    • 연구논문집
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    • 통권33호
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    • pp.183-190
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    • 2003
  • Today, We have used many electronic equipment such as computer, TV, cellular phone and so on. These equipment radiate a large amount of EMI(Electromagnetic interference) which is occurred trouble of airplane, medical equipment, communicate equipment, and especially, human health. So, Ni mesh fabrication for EMI shielding by continuous electroforming process was investigated. Continuous electroforming apparatus was made by means of rotating cathode drum. And We investigated the characteristics of two types of Ni electroforming solution. One was made by laboratory and the other was produced by M cooperation. The grain size increased with increasing current density and bath temperature, and decreasing rotating speed of cathode drum. EDX results indicate that the Ni mesh electroformed by the KIMM solution is composed of pure Ni. But the Ni mesh electroformed by the M cooperation solution has Ni and S element. The incorporation of S element in the Ni mesh has a profoundly effect on mechanical properties such as hardness, internal stress and so on.

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니켈 전주도금을 위한 PET의 엑시머 레이저 어블레이션 (The excimer laser ablation of PET for nickel electroforming)

  • 신동식;이제훈;서정;김도훈
    • 한국레이저가공학회지
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    • 제6권2호
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    • pp.35-41
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    • 2003
  • In this study, manufacturing of polymer master and mold insert for micro injection molding was investigated. Ablation by excimer laser radiation could be used successfully to make 3-D microstructure of PET. The mechanism for ablative decomposition of PET with KrF excimer laser(λ: 248nm, pulse duration: 5ns) was explained by photochemical process. And this process showed PET to be adopted in polymer master for nickel mold insert. Nickel electroforming by using laser ablated PET master was preferable for replication method. Finally, it was shown that excimer laser ablation can substitute for X-ray lithography of LIGA process in microstructuring.

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Electroforming을 이용한 PDP용 EMI 메시 개발 (EMI Mesh Development for the PDP using Electroforming)

  • 권혁홍;범민욱;임성룡;황춘섭;박동식;이태환
    • 한국생산제조학회지
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    • 제20권1호
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    • pp.108-113
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    • 2011
  • There are a lot of PDP TV for a plasma discharge pulse voltage generated by the use of electromagnetic waves. EMI mesh film is near Infrared ray caused by malfunction of the remote control intended to prevent this phenomenon. In this study, the formation of fine pattern by making the mold is imprinted on the film sheet. EMI mesh film has been granted by filling in the conductive material region imprinted with electroforming in the manufacture of resistance. The fine patterns fabricated with electroforming facility thickness of homogenization process technology were established to optimize the working conditions.

Fe-Ni 합금 극박재 제조를 위한 전주성형기술 및 극박재 특성 (Electroforming and Properties of Fe-Ni Alloy Thin Foils)

  • 임태홍;이흥렬
    • 소성∙가공
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    • 제14권2호
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    • pp.121-125
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    • 2005
  • Electroforming is a process that employs technology similar to that used for electroplating but which is used for manufacturing metallic articles, rather than as a means of producing surface coatings. Electroforming provides a cost-effective means of producing alloys and fully dense nanocrystalline metals as foils, sheets and complex shapes. Fe-Ni nanocrystalline alloy foils with composition in the $36\~80wt\%$ Ni range were fabricated by electroforming. The thickness of electroformed foils was in the range of $5\~30{\mu}m$. TEM and XRD analysis was applied for measuring the grain size. Very fine grain size$(\~10nm)$ was obtained in alloy foils. The yield and tensile strength of electroformed Fe-Ni alloy were 2000-2800 MPa and 2500-3300 MPa respectively. The magnetic permeability at high frequency of electroformed Fe-Ni foil was higher than that of thicker foils.

전주금형 제작을 위한 폴리머의 엑시머 레이저 어블레이션 (Excimer Laser Ablation of Polymer for Electroformed Mold)

  • 이제훈;신동식;서정;김도훈
    • 한국정밀공학회지
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    • 제21권12호
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    • pp.13-20
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    • 2004
  • Manufacturing process for the microfluidic device can include such sequential steps as master fabrication, electroforming, and injection molding. The laser ablation using masks has been applied to the fabrication of channels in microfluidic devices. In this study, manufacturing of polymer master and mold insert for micro injection molding was investigated. Ablation of PET (polyethylene terephthalate) by the excimer laser radiation could be used successfully to make three dimensional master fur nickel mold insert. The mechanism fur ablative decomposition of PET with KrF excimer laser $({\lambda}: 248 nm, pulse duration: 5 ns)$ was explained by photochemical process, while ablation mechanism of PMMA (polymethyl methacrylate) is dominated by photothermal process, the .eaction between PC (polycarbonate) and KrF excimer laser beam generate too much su.face debris. Thus, PET was adopted in polymer master for nickel mold insert. Nickel electroforming using laser ablated PET master was preferable for replication method. Finally, it was shown that excimer laser ablation can substitute for X-ray lithography of LIGA process in microstructuring.

연속전주공정을 이용한 전자파 차폐용 정밀니켈메쉬 제조 신공정 (Novel Process of Precision Nickel Mesh Fabrication for EMI Shielding Using Continuous Electroforming Technique)

  • 이주열;김만;권식철;;김인곤
    • 한국표면공학회지
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    • 제38권6호
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    • pp.212-215
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    • 2005
  • Novel continuous electroforming process equipped with a rotating patterned mandrel, soluble/insoluble anode and multiple stage of rolling wheels was proposed to produce precision nickel mesh, which is known as a very efficient electromagnetic interference (EMI) shielding material. Continuously electroformed nickel deposits showed a tendency to form small-sized particles as the plating solution temperature increased and mandrel rotation speeded up and the applied current density decreased. Along the honeycomb patterns of mandrel, nickel was accurately electrodeposited on the surface of rotating mandrel, but quite different visual/structural characteristics were measured on both sides.

50nm급 패턴 니켈 스탬퍼 제작에 관한 연구 (A Study on the Fabrication of Ni Stamper for 50nm Class of Patterns)

  • 유영은;오승훈;이관희;김선경;윤재성;최두선
    • 한국금형공학회:학술대회논문집
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    • 한국금형공학회 2008년도 하계 학술대회
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    • pp.35-38
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    • 2008
  • A pattern master and a Ni stamper for 50nm class of patterns are fabricated through e-beam lithography and Ni electroforming process. A model pattern set is designed, which is based on unit patterns of 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The e-beam process is optimized to fabricate designed patterns with some parameters including dose, accelerating voltage, focal distance and developing time. For Ni electroforming to fabricate Ni stamper, a seed layer, a conducting layer, is deposited first on the pattern master fabricated by an e-beam lithography process. Ni, Ti/Ni and Cr are first tested to find optimal seed layer process. Currently the best result is obtained when adopting Cr deposited to be 100nm thick with continuous tilting motion of the master substrate during the deposition process.

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