• Journal of the Korean institute of surface engineering
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• v.51 no.6
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• pp.400-404
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• 2018

A metal 3D printer has been developed on its own to electrodeposit the localized area. Nozzles were used to selectively laminate the electrolytic plating method. To analyze the factors affecting the deposition, the stack height, thickness and surface roughness were experimentally analyzed according to the current density and the temperature of the electrolyte. Electrolytic temperature and current are electrodeposited when the deposition conditions are dominant over the etching conditions, but the thickness is kept constant. On the contrary, when the etching conditions are dominant, the electrodeposited shape is rather the etched. As a result, the uniformity of surface quality and electrodeposition rate could be improved by conducting experiments under constant conditions of electrolyte temperature and current density.

• 한국전기화학회:학술대회논문집
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• 1999.10a
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• pp.43-43
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• 1999

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2000.11a
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• pp.56-56
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• 2000

• Design & Manufacturing
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• v.11 no.1
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• pp.1-6
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• 2017

In these days, due to generalization of using smart mobile phone and wearable device such as smart watch, demand of Cover-glass and touch screen panel for protecting display increases. With increasing the demand of Cover-glass, slimming technique is promising for weight lightening, zero bezel. Cover-glass produced by this technique is required to decreasing thickness with increase strength. In the Cover-glass manufacturing process, mechanical processing and chemical processing has improve in the strength. Generally, Diamond electrodeposition wheel is used in mechanical process. Reinforced glass with the characteristics of the brittle and high hardness was manufactured by using a diamond electrodeposition wheel. At this time, Because of surface of the tool present non-uniform distribution of diamond particle, it has generate Loading of wheel and it has been decrease life of grinding tool, efficiency of grinding, quality and shape accuracy of workpiece. Thus Research is needed to controling particle distribution of diamond electrodeposition wheel uniformly. And it is necessary to study micro hole machining such as proximity senser hole, speaker hole positioned Cover-glass. Reinforced glass with the characteristics of the brittle and high hardness is difficult to machining. Processing of reinforced glass have generated wear of tool, micro cracks. Also, it is decreasing shape accuracy. In this paper, We conducted a study on how to control particle distribution uniformly about the diamond tool manufactured using elecetodeposition processing. It analyzed the factors that affect the arrangement of the particles in the electrodeposition process by design of experiment. And There is produced the grinding tool, which derives an optimum deposition conditions, for processing Cover-glass edge and the machinability was evaluated.

• Journal of the Korean Electrochemical Society
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• v.2 no.4
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• pp.237-241
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• 1999

The characteristics of copper thin films and via hole filling capability were investigated by pulsed electrodeposition method. Especially, the effects of additives on the properties of copper thin films were studied. Copper films, which were deposited by pulsed electrodeposition using commercial additives, had low tensile stress value under 83.4 MPa and high preferred Cu (111) texture. Via holes with $0.25{\mu}m$ in diameter and 6 : 1 aspect ratio were successfully filled without any defects by superfilling. It was observed that copper microstructure deformed by twining. After heat treatment at $500^{\circ}C$ for 1 k in vacuum furnace, grain size was 1 or 2 times as large as film thickness and the bamboo structure was formed. Heat treated copper films showed good resistivities of $1.8\~2.0{\mu}{\Omega}{\cdot}cm$.

• Journal of the Korean Electrochemical Society
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• v.24 no.3
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• pp.35-41
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• 2021

In this study, the effect of zwitterionic surfactant on Cu electrodeposition was investigated through cyclic voltammetry. With the addition of (dodecyldimethylammonio)propanesulfonate (DDAPS) as a representative zwitterionic surfactant in the electrolyte for Cu electrodeposition, the electrochemical Cu²⁺ reduction was inhibited on Cu and glassy carbon electrodes. Its inhibition effect was similar to that of cationic surfactant rather than anionic surfactant. Moreover, DDAPS interacted with chloride ion and exhibited the mass transfer-dependent inhibition behavior, which indicates that its inhibition function is associated with the formation of its surface aggregates on anion-covered Cu surface. In addition, adsorbed DDAPS slightly reduced the surface roughness of Cu electrodeposits. These characteristics were similar to those of cationic surfactant, but less obvious. It means the effect of DDAPS on Cu electrodeposition originates from the cationic head group which is shield by anionic head group.

• Korean Journal of Materials Research
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• v.24 no.2
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• pp.105-110
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• 2014

The aim of this work was to investigate the effects of electrodeposition conditions on the microstructural characteristics of copper thin films. The microstructure of electroplated Cu films was found to be highly dependent on electrodeposition conditions such as system current and current density, as well as the bath solution itself. The current density significantly changed the preferred orientation of electroplated Cu films in a DC system, while the solution itself had very significant effects on microstructural characteristics in a pulse-reverse pulse current system. In the DC system, polarization at high current above 30 mA, changed the preferred orientation of Cu films from (220) to (111). However, Cu films showed (220) preferred orientation for all ranges of current density in the pulse-reverse pulse current system. The grain size decreased with increasing current density in the DC system while it remained relatively constant in the pulse-reverse pulse current system. The sheet resistance increased with increasing current density in the DC system due to the decreased grain size.

• Transactions of the Korean hydrogen and new energy society
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• v.23 no.6
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• pp.573-580
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• 2012

Corrosion resistance and basic physical properties of solid tantalum are not comparable to most of the structural metallic materials. The relative high cost and melting temperature of tantalum are obstacles to be widely applied to general engineering processes. Electrodeposition in molten salt enables compact and uniform tantalum coating. In this study, Ta was coated onto base metal (SUS316L) with different current densities (0.5, 5, $20mA/cm^2$) by using MSE (Molten Salt Electrodeposition). In this study, it showed that deposition efficiency and microstructure of Ta coating layer were strongly depended on current density. In the case of the current density of $5mA/cm^2$, densest microstructure was obtained. The current density above $5mA/cm^2$ caused non-uniform microstructure due to rapid deposition rate. Dense microstructure and intact coating layer contributed to significant corrosion resistance enhancement.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.57-63
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• 2006

For chip-stack package applications, Cu filling characteristics into trench vias of $75{\sim}10\;{\mu}m$ width and 3 mm length were investigated with variations of electroplating current density and current mode. At $1.25mA/cm^{2}$ of DC mode, Cu filling ratio higher than 95% was obtained for trench vias of $75{\sim}35{\mu}m$ width. When electroplated at DC $2.5mA/cm^{2}$, Cu filling ratios became inferior to those processed at DC $1.25mA/cm^{2}$. Pulse current mode exhibited Cu filling characteristics superior to DC current mode.

• Journal of the Korean Electrochemical Society
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• v.5 no.1
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• pp.17-20
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• 2002

Various compositions of CoFeNi alloys have been electrodeposited in chloride bath and in sulfate bath, and evaluated for electrodeposition characteristics and magnetic properties. For electrodeposited CoFeNi thin film alloys, the increase of Fe content in the deposits from sulfate bath was considerably faster than those from chloride bath. The current efficiencies in sulfate bath showed observable decrease from $75\%\;to\;50\%$ while those in chloride bath showed no significant decrease. From the low coercivity of 3 Oe in the minimum and the higher squarenesses of the alloys from sulfate bath than those from chloride bath, the alloy at Co, Fe, and Ni contents of $80wt.\%,\;10wt.\%,\;and\;10wt.\%$ can be considered to be the best CoFeNi alloy in this research for the soft magnetic material.