• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.1080-1084
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• 2001

In manufacturing a micro die with half spherical cavity by MEDM, it is necessary to prepare an electrode with the same shape. This paper suggests a simple method to manufacture a half spherical electrode based on tool wear. The tool wears more rapidly at the edge of a cylindrical electrode. In order to make a half spherical micro electrode, cylindrical electrode was fed into the workpiece by the distance of its radius. The d/R(depth/Radius) value varied with respect to capacitance and electrode diameter. The smaller the size of electrode was, the closer the electrode tip geometry approached to a half sphere.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제50권8호
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• pp.414-418
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• 2001

Failure modes of Mo-tip FEA were investigated in detail as a preliminary study for the application of Mo-tip FEA to the CRT electron-gun as a cold cathode. It was identified that the destruction of Mo-tip FEA was originated from reflowing of arc-current during the spot-knocking process followed by secondary arc between gate electrode and cathode substrate. In order to prevent Mo-tip FEA from destruction due to arc-current, two kinds of methods were suggested, that is one is to provide the by-pass of the reflow current and the other is to install a current limiter in the path of gate connection line.

• Journal of Electrochemical Science and Technology
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• 제4권4호
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• pp.153-156
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• 2013

Charge transfer between STM tip and Au(100) has been investigated by using a Scanning Tunneling Microscopy (STM) technique in dry, $H_2O$, and $D_2O$ atmospheres. Dry atmosphere was indicated by humidity as low as 5 % and high humidity as high as 98% was managed by injecting $H_2O$ and $D_2O$ to the chamber. The current decayed more slowly in high humidity than in dry atmosphere. The plateau currents were found to appear at separations larger than ca. $5{\AA}$ where the current decay stopped depending on applied bias voltages. The polarity dependence was observed at the STM junction between Pt-Ir tip and the gold. On the contrary, little dependence was seen at the one between Au tip and the substrate electrode.

• Journal of Welding and Joining
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• 제27권4호
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• pp.44-48
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• 2009

In automotive company, a lot of researchers have investigated for the spatterless welding process during last two decades. A spatter influences on the product quality such as strength and surface states. In this paper, a hollow tip is proposed for spatterless process. An optimal size of electrode hole is obtained from a weldability evaluation of each hole diameter. Through the cross section analysis, a phenomenon that molten metal moves in the hole which located between two workpiece is observed, and this makes spatterless welding process even though current is higher. Finally, widely acceptable weld area in lobe curve is obtained by using hollow tip as compare with conventional no hollow tip. In this paper, spatterless resistance spot welding with improvement weldability and productivity is proposed by using hollow tip.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 춘계학술대회 논문집
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• pp.15-18
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• 2005

As a display becomes large recently, Acquisition of high luminance and Luminance uniformity is becoming difficult in the existing CCFL or EEFL backlight system. So, study for a performance enhancement has enforced. but lamp development of flat type is asked for high luminance and a luminance uniformity security in of LCD and area anger trend ultimately. In this paper, we changed a tip shape of an electrode for production by the most suitable LCD backlight surface light source, and confirmed discharge characteristic along discharge gas pressure and voltage, and confirmed electric field distribution and discharge energy characteristic through a Maxwell 2D simulation. Therefore the discharge firing voltage characteristic showed a low characteristic than a rectangular type and round type in case of electrode which used tip of a triangle type, and displayed a discharge electric current as a same voltage was low.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 영호남 합동 학술대회 및 춘계학술대회 논문집 센서 박막 기술교육
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• pp.82-85
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• 2006

As a display becomes large recently, Acquisition of high luminance and Luminance uniformity is becoming difficult in the existing CCFL or EEFL backlight system. So, study for a performance enhancement has enforced. but lamp development of flat type is asked for high luminance and a luminance uniformity security in of LCD and area anger trend ultimately. In this paper, we changed a tip shape of an electrode for production by the most suitable LCD backlight surface light source, and confirmed discharge characteristic along discharge gas pressure and voltage, and confirmed electric field distribution and discharge energy characteristic through a Maxwell 2D simulation. Therefore the discharge firing voltage characteristic showed a low characteristic than a rectangular type and round type in case of electrode which used tip of a triangle type, and displayed a discharge electric current as a same voltage was low.

• Transactions on Electrical and Electronic Materials
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• 제3권1호
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• pp.4-8
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• 2002

The typical mold method for FED (field emission display) fabrication is used to form a gate electrode, a gate oxide layer, and emitter tip after fabrication of a mold shape using wet-etching of Si substrate. However, in this study, new mold method using a side wall space structure was developed to make sharp emitter tips with the gate electrode. In new method, gate oxide layer and gate electrode layer were deposited on a Si wafer by LPCVD (low pressure chemical vapor deposition), and then BPSG (Boro phosphor silicate glass) thin film was deposited. After then, the BPSG thin film was flowed into the mold at high temperature in order to form a sharp mold structure. TiN was deposited as an emitter tip on it. The unfinished device was bonded to a glass substrate by anodic bonding techniques. The Si wafer was etched from backside by KOH-deionized water solution. Finally, the sharp field emitter array with gate electrode on the glass substrate was formed.

• 한국정밀공학회지
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• 제17권7호
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• pp.132-140
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• 2000

Plasma arc cutting is one of the most widely used processes in metal cutting fields and is a process that produces parted metal plates by cutting them with an arc plasma established between the electrode tip and the plate(workpiece). When the tip-to-workpiece distance varies during cutting, the cut quality, for example the kerf width, is deteriorated by the change of plasma arc. The variations of tip-to-workpiece distance are due to the different factors such as inaccuracies in setting the torch or workpiece, thermal distortions during cutting, and uneven surface of workpiece. The control to keep the tip-to-workpiece distance constant is thus indispensable to improve the flexibility of automatic plasma arc cutting system applications. In this study, an arc sensor which utilizes the electrical signal obtained from the plasma arc itself was developed. The arc sensor has an advantage that no particular sensing device is necessary and real-time sensing of the tip-to-workpiece distance is possible directly under the plasma arc. The relationship between plasma arc voltage and tip-to-workpiece distance was determined through the repeated experimental results. The model was used for developing an automatic tip-to-workpiece distance control system of plasma arc cutting. It could be shown that the proposed system has a successful capability of tip-to-workpiece distance control.

• 한국터널지하공간학회 논문집
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• 제25권2호
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• pp.101-120
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• 2023

전기비저항 탐사 방법은 매질의 표면에 관입된 두 전극의 전위차와 전류와의 관계를 통해 전기 저항을 측정하고, 형상 계수를 이용하여 매질의 고유한 특성인 전기비저항을 계산한다. 현장 및 실대형 크기의 전기비저항 실험은 전극과 매질 사이의 접촉 면적이 적고, 전극 간 거리가 충분하기 때문에 계산상 편의를 위해서 동일한 표면적을 가진 반구형으로 치환하여 전기비저항을 산정한다. 하지만, 실내 소규모 크기의 전기비저항 실험은 전극의 지오메트리(전극의 관입 깊이, 전극사이의 거리, 전극의 길이와 반지름 크기)로 인해서, 등전위면과 전류 흐름이 달라지게 되므로, 궁극적으로 전기비저항값의 오차를 야기한다. 본 연구는 기존 연구에서 유도된 4가지 전극 형상(반구, 원기둥, 반구형 팁을 가진 원기둥, 콘형 팁을 가진 원기둥)에 따른 전기 저항 이론식을 정리하고, 전극 형상을 고려한 전기 저항 수치 해석을 실시하였으며, 이론식과 수치 해석 결과들의 비교를 통해서 개발된 수치 해석 모듈을 검증하였다. 또한, 각 전극 형상에 따른 전극 주변과 전극사이에 형성된 전기 저항 분포를 분석하였다. 추가적으로, 현장 전기비저항 탐사에서 주로 사용되는 콘형 팁을 가진 원기둥 전극의 전기적 특성에 따른 전류 흐름 분포를 고찰하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.682-685
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• 2003

In this paper, we propose the method to measure the Young's modulus of carbon nano tube which was manufactured by chemical vapor deposition. We also made the tungsten tip by electrochemical etching process and the carbon nano tube which was detangled through ultra-sonication with isopropyl alcohol was attached to the tungsten tip. This tip which was composed of tungsten tip and carbon nano tube can be used in Young's modulus measurement by applying DC voltage with counter electrode. The attachment process and measurement of the deflection of carbon nano tube was done under optical microscope.