• The Transactions of the Korean Institute of Electrical Engineers P
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• v.58 no.3
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• pp.310-315
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• 2009

This investigation was performed to study the characteristics of electricity and heat transfer that occur in the cylinder of electrode type humidifier during the process of water evaporation. Measurements were made to obtain the amount of water evaporation, the consumption of electric power, electrical conductivity, etc according to the materials and shapes of electrode. When the humidifier was in non-drain controlled mode, the number and amplitude of current cycle per minute increased gradually with the lapse of time, whereas for drain controlled mode, it decreased about 40[%] after draining water. It was found that for non-drain controlled mode, the thermal efficiency of humidifier which used SS400, STS316 and wire net electrode type was about 95~96[%] and it was 2~4[%] higher than that of drain controlled mode. Also, it was shown that the thermal efficiency of humidifier which used neighboring six-phase electrode balanced electrically was 4[%] higher than that of existing six-phase type.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.11
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• pp.43-50
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• 2007

We have investigated the electro-optical characteristics and reliability of LEDs with the Indium-Tin-Oxide (ITO) electrodes formed by different deposition methods: electron beam evaporation, sputtering, and hybrid method of electron beam evaporation and subsequent sputtering. The deposition method of the ITO electrode has significant influence on the electro-optical characteristics and reliability of LEDs. The LEDs with the ITO electrodes formed by sputtering and electron beam evaporation have problems caused by sputtering damage and increased electrical resistance, respectively, and the problems have been solved by the hybrid method.

• Current Photovoltaic Research
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• v.7 no.1
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• pp.15-20
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• 2019

Most high-efficiency n-type silicon solar cells are based on the high quality surface passivation and ohmic contact between the emitter and the metal. Currently, various metalization methods such as screen printing using metal paste and physical vapor deposition are being used in forming electrodes of n-type silicon solar cell. In this paper, we analyzed the degradation factors induced by the front electrode formation process using e-beam evaporation of double passivation structure of p-type emitter and $Al_2O_3/SiN_x$ for high efficiency solar cell using n-type bulk silicon. In order to confirm the cause of the degradation, the passivation characteristics of each electrode region were determined through a quasi-steady-state photo-conductance (QSSPC).

• Journal of the Korean Physical Society
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• v.73 no.9
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• pp.1346-1350
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• 2018

An electrode-evaporation technology on both the top and bottom sides of the bare vertical-type single chip separated from the traditional substrate by cooling, was developed for III-nitride vertical-type single chip LEDs with thick GaN epilayer. The post-process of the cooling step was followed by sorting the bare vertical-type single chip LEDs into the holes in a pocket-type shadow mask for deposition of the electrodes at the top and bottom sides of bare vertical-type single chip LEDs without the traditional substrate for electrode evaporation technology for vertical-type single chip LEDs. The variation in size of the hole between the designed shadow mask and the deposited electrodes owing to the use of the designed pocket-type shadow mask is investigated. Furthermore, the electrical and the optical properties of bare vertical-type single chip LEDs deposited with two different shapes of n-type electrodes using the pocket-type shadow mask are investigated to explore the possibility of the e-beam evaporation method.

• Journal of Radiation Industry
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• v.5 no.1
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• pp.95-99
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• 2011

The electrical and mechanical properties of electrode for radiation detection are very important. In general, Au electrode and CZT crystal are combined to form ohmic contacts, and the best energy resolution is shown at the Au electrode. The metal contacts are fabricated by electroless deposition method, sputtering deposition method and thermal evaporation method. The electrode fabrication is easy with use of the thermal evaporation method, while an adhesive strength is weak. Thus interface materials such as Ag, Al and Ni were investigated to overcome defects generated by the this method. The thickness of the interface material between the Au electrode and the CZT crystal was 100 Angstroms, the Au electrode with thickness of 400 Angstroms was deposited. The Al+Au electrode is shown that the results of current-voltage and radiation response are similar to results of Au electrode.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.4
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• pp.754-758
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• 2010

In general, Dye-sensitized Solar Cells(DSCs) consist of the nanocrystalline titanium dioxide($TiO_2$) layer which is fabricated on a transparent conductive oxide(TCO) layer such as $F/SnO_2$ glass, a dye adhered to the $TiO_2$, an electrolyte solution and platinum-coated TCO. Among these components, two TCO substrates are estimated to be about 60% of the total cost of the DSCs. Currently novel TCO-less structures have been investigated in order to reduce the cost. In this study, TCO-less DSCs consisting of titanium electrodes were investigated. The titanium electrode is deposited on top of the porous $TiO_2$ layer using electron-beam evaporation process. The porosity of the titanium electrode was found out by the SEM analysis and dye adhesion. As a result, when the thickness of the titanium electrode increased, the surface resistance decreased and the conversion efficiency increased relatively.

• Korean Journal of Materials Research
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• v.28 no.4
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• pp.235-240
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• 2018

We propose a speedy two-step deposit process to form an Au electrode on hole transport layer(HTL) without any damage using a general thermal evaporator in a perovskite solar cell(PSC). An Au electrode with a thickness of 70 nm was prepared with one-step and two-step processes using a general thermal evaporator with a 30 cm source-substrate distance and $6.0{\times}10^{-6}$ torr vacuum. The one-step process deposits the Au film with the desirable thickness through a source power of 60 and 100 W at a time. The two-step process deposits a 7 nm-thick buffer layer with source power of 60, 70, and 80 W, and then deposits the remaining film thickness at higher source power of 80, 90, and 100 W. The photovoltaic properties and microstructure of these PSC devices with a glass/FTO/$TiO_2$/perovskite/HTL/Au electrode were measured by a solar simulator and field emission scanning electron microscope. The one-step process showed a low depo-temperature of $88.5^{\circ}C$ with a long deposition time of 90 minutes at 60 W. It showed a high depo-temperature of $135.4^{\circ}C$ with a short deposition time of 8 minutes at 100 W. All the samples showed an ECE lower than 2.8 % due to damage on the HTL. The two-step process offered an ECE higher than 6.25 % without HTL damage through a deposition temperature lower than $88^{\circ}C$ and a short deposition time within 20 minutes in general. Therefore, the proposed two-step process is favorable to produce an Au electrode layer for the PSC device with a general thermal evaporator.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.312-312
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• 2013

GaN based light emitting diodes (LEDs) are important devices that are being used extensively in our daily life. For example, these devices are used in traffic light lamps, outdoor full-color displays and backlight of liquid crystal display panels. To realize high-brightness GaN based LEDs for solid-state lighting applications, the development of p-type ohmic electrodes that have low contact resistivity, high optical transmittance and high refractive index is essential. To this effect, indiumtin oxide (ITO) have been investigated for LEDs. Among the transparent electrodes for LEDs, ITO has been one of the promising electrodes on p-GaN layers owing to its excellent properties in optical, electrical conductivity, substrate adhesion, hardness, and chemical inertness. Sputtering and e-beam evaporation techniques are the most commonly used deposition methods. Commonly, ITO films on p-GaN by sputtering have better transmittance and resistivity than ITO films on p-GaN by e-bam evaporation. However, ITO films on p-GaN by sputtering have higher specific contact resistance, it has been demonstrated that this is due to possible plasma damage on the p-GaN in the sputtering process. In this paper, we have investigated the advanced sputtering using plasma damage-free p-electrode. Prepared the ITO films on the GaN based LEDs by e-beam evaporation, normal sputtering and advanced sputtering. The ITO films on GaN based LEDs by sputtering showed better transmittance and sheets resistance than ITO films on the GaN based LEDs by e-beam evaporation. Finally, fabricated of GaN based LEDs by using advanced sputtering. And compared the electrical properties (measurement by using C-TLM) and structural properties (HR-TEM and FE-SEM) of ITO films on GaN based LEDs produced by e-beam evaporation, normal sputtering and advanced sputtering. As a result, It is expected to form plasma damage free-electrode, and better light output power and break down voltage than LEDs by e-beam evaporation and normal sputter.

• The KSFM Journal of Fluid Machinery
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• v.11 no.4
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• pp.7-13
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• 2008

The computational investigation is performed to find out the interaction of arc plasmas with surrounding materials and the thermal flow characteristics in a PASB (Puffer-Assisted Self-Blast) chamber, which is one of new breaking concepts in $SF_6$ switchgears. It is very important to define the flow and mass transfer happened during the full arcing history for further understanding complex physics inside the chamber. In this study, we have considered two diffusion processes by the hot arc plasma, one is PTFE nozzle ablation and the other is Cu electrode evaporation, simultaneously. It was found that the principle of the pressure-rise inside the chamber is confirmed by the computational results and the increase of the electrical conductivity of the residual gas near current zero is critical to the chamber design.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.1462-1465
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• 2004

A new method to fabricate metal electrodes on side wall of the microchannel is presented. Coulter counter allows to count the number of cell passing through the microchannel by detecting impedance variation between two electrodes. The relative position of two electrodes is important for sensitivity of impedance measurement. 100nm thick Al electrodes are deposited on the channel side wall by means of shadow evaporation.