• Journal of Mechanical Science and Technology
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• v.19 no.2
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• pp.496-504
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• 2005

The thermal and mechanical properties of an electro-slag cast steel of a similar chemical composition with an AISI-6F2 steel are investigated and compared with a forged AISI-6F2 steel. AISI-6F2 is a hot-working tool steel. Electro-slag casting (ESC) is a method of producing ingots in a water-cooled metal mold by the heat generated in an electrically conductive slag when current passes through a consumable electrode. The ESC method provides the possibility of producing material for the high quality hot-working tools and ingots directly into a desirable shape. In the present study, the thermal and mechanical properties of yield strength, tensile strength, hardness, impact toughness, wear resistance, thermal fatigue resistance, and thermal shock resistance for electro-slag cast and forged steel are experimentally measured for both annealed and quenched and tempered heat treatment conditions. It has been found that the electro-slag cast steel has comparable thermal and mechanical properties to the forged steel.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2006.05a
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• pp.640-643
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• 2006

In this paper, electro-mechanical coupling of cellulose-based Electro-Active Paper (EAPap) actuator is investigated by measuring induced strain and mechanical properties with and without electric excitation. The maximum induced in-plane strain is measured at the orientation angle of 45? samples. The elastic modulus and strength of EAPap are increased with electric excitation and the orientation angle of $45^{\circ}$ samples shows the largest increment of mechanical properties. From the observations, shear piezoelectricity is considered as the major piezoelectric mode of EAPap.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.4
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• pp.109-116
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• 2019

The mechanical deformation of a battery separator causes internal short-circuiting of the cathode - anode, which directly affects the explosion/ignition of batteries. To increase the mechanical properties of the separator fabricated by electro-spinning, use of a thermal pressing method is inevitable. Therefore, this research aims to maximize the mechanical strength of a porous separator by finding the proper thermal press temperatures given to Electro-spun Polyacrylonitrile (PAN) nanofibers. The different thermal press temperatures $25^{\circ}C$, $50^{\circ}C$, $75^{\circ}C$, and $100^{\circ}C$ were applied to the electro-spun fiber at 30 MPa pressure for one hour. The higher the temperature, the higher the resultant tensile strength; however, a higher temperature also lowered the strain and porosity. Thus, the membrane thermal pressed at $50^{\circ}C$ showed the best mechanical properties and the second highest porosity. Using the data, $50^{\circ}C$ was judged as the best thermal pressing temperature in terms of performance.

• Coupled systems mechanics
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• v.1 no.2
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• pp.205-217
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• 2012

A smart beam made of magneto-electro-elastic (MEE) material having piezoelectric phase and piezomagnetic phase, shows the coupling between magnetic, electric, thermal and mechanical under thermal environment. Product properties such as pyroelectric and pyromagnetic are generated in this MEE material under thermal environment. Recently studies have been published on the product properties (pyroelectric and pyromagnetic) for magneto-electro-thermo-elastic smart composite. Hence, the magneto-electro-elastic beam with different volume fractions, investigated under uniform temperature rise is the main aim of this paper, to study the influence of product properties on clamped-free boundary condition, using finite element procedures. The finite element beam is modeled using eight node 3D brick element with five nodal degrees of freedom viz. displacements in the x, y and z directions and electric and magnetic potentials. It is found that a significant increase in electric potential observed at volume fraction of $BaTiO_3$, $v_f$ = 0.2 due to pyroelectric effect. In-contrast, the displacements and stresses are not much affected.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.1
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• pp.47-53
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• 2011

From recent research, it has revealed that Electroacitve polymer(EAP) has a physical limitation. Carbon nanotube(CNT) is known as the promising material which has excellent electro-mechanical characteristics and is mostly defect-free. It is expected that a successful synthesis of CNT and Nafion known as a primary material for IPMC would make a great improvement on its electro-mechanic feature. In this paper, we suggest the method of synthesis of CNT with Nafion which improves electro-mechanical characteristic. Using mechanical dispersion with Nafion and Isopropyl Alcohol(IPA), we disperse Single-walled carbon nanotubes(SWCNT). For a uniformly layer of CNT, we used a spray gun on a hot plate by a simplified method. In the result, we fabricated a disperse SWCNT/Nafion composite uniformly.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.207-208
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• 2007

Recently, high performance microelectronic devices are designed in multi-layer structure in order to make dense wiring of metal conductors in compact size. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. In this work, we synthesized dielectric composite materials based on epoxy resin, and investigated their thermal stabilities and dynamic mechanical properties for thermal imprint lithography. In order to enhance the mechanical properties and toughness of dielectric material, various modified polyetherimide(PEI) was applied in the resin system. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various conditions were studied using dynamic differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA), and Universal Test Method (INSTRON).

• Advances in nano research
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• v.5 no.4
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• pp.337-357
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• 2017

Knowledge of thin films mechanical properties is strongly associated to the reliability and the performances of Nano Electro Mechanical Systems (NEMS). In the literature, there are several methods for micro materials characterization. Bulge test is an established nondestructive technique for studying the mechanical properties of thin films. This study improve the performances of NEMS by investigating the mechanical behavior of Nano rectangular thin film (NRTF) made of new material embedded in Nano Electro Mechanical Systems (NEMS) by developing the bulge test technique. The NRTF built from adhesively-bonded layers of basalt fiber reinforced polymer (BFRP) laminate composite materials in Nano size at room temperature and were used for plane-strain bulging. The NRTF is first pre-stressed to ensure that is no initial deflection before applied the loads on NRTF and then clamped between two plates. A differential pressure is applying to a deformation of the laminated composite NRTF. This makes the plane-strain bulge test idea for studying the mechanical behavior of laminated composite NRTF in both the elastic and plastic regimes. An exact solution of governing equations for symmetric cross-ply BFRP laminated composite NRTF was established with taking in-to account the effect of the residual strength from pre-stressed loading. The stress-strain relationship of the BFRP laminated composite NRTF was determined by hydraulic bulging test. The NRTF thickness gradation in different points of hemisphere formed in bulge test was analysed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.242-242
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• 2006

Increasingly complex tasks are performed by computers or cellular phone, requiring more and more memory capacity as well as faster and faster processing speeds. This leads to a constant need to develop more highly integrated circuit systems. Therefore, there have been numerous studies by many engineers investigating circuit patterning. In particular, PCB including module/package substrates such as FCB (Flip Chip Board) has been developed toward being low profile, low power and multi-functionalized due to the demands on miniaturization, increasing functional density of the boards and higher performances of the electric devices. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. The imprint technique. is one of promising candidates, especially due to the fact that the expected resolution limits are far beyond the requirements of the PCB industry in the near future. For applying imprint lithography to FCB, it is very important to control thermal properties and mechanical properties of dielectric materials. These properties are very dependent on epoxy resin, curing agent, accelerator, filler and curing degree(%) of dielectric materials. In this work, the epoxy composites filled with silica fillers and cured with various accelerators having various curing degree(%) were prepared. The characterization of the thermal and mechanical properties wasperformed by thermal mechanical analysis (TMA), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), rheometer, an universal test machine (UTM).

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.2248-2250
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• 2000

We investigated properties of PZT composite for medical ultrasonic transducer array (briefly UTA) for medicine applications fabricated by micro pressing and dicing method. Dicing method was the fabrication process of conventional ultrasonic transducer array by dicing sintered PZT sheet. Micro pressing method was the proposed process using pressing PZT green sheet by PMMA micro mold from LIGA process. Microstructures, electrical and electro -mechanical properties of fabricated UTAs of two cases were analyzed. Thickness mode electro-mechanical coupling coefficient of two cases have same values of 51%. Sintered PZT Microstructures of them showed dense and uniform. Micro pressing method was very mass productive process because of using batch type LIGA process. From results, we found micro pressing method was more competitive than dicing method for UTA fabrication. For further study, uniformity of microstructures and electro-mechanical properties of large scale, and fabrication processes of Ni plating and PMMA molding should be improved and investigated.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.67-73
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• 2006

A system in package (SiP) generally contains a variety of systems such as analog, digital, optical and micro-electro-mechanical systems, integrated in a system-level package connected through a substrate. However, there are many electrical and mechanical reliability issues including the reliability issue for embedded structures. A mismatch of thermal coefficients of expansion among packaging materials and devices can lead to warping or delamination in the package. In this study, the effect of material properties of underfill, such as Young's modulus and CTE, are investigated through FEM simulation. Experimental investigation on the warpage of the package is also carried out to verify the simulation results. The results show that the reliability of the system in package is closely related to the material properties of underfill. The results of this study provide a good guidance for the material selection when designing the system in package.