• Journal of Soil and Groundwater Environment
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• v.14 no.1
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• pp.36-43
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• 2009

The feasibility of electrokinetic remediation was investigated in the laboratory to treat contaminated soil with Zn, Ni and F. Electro-migration and electro-osmosis are the major removal mechanisms because fluorines desorbed from soil exist as an anionic form in soil pores, and Zn and Ni exist as a cationic form. Desorption of fluorine was enhanced under the alkaline condition, but that of Zn and Ni increased under the acidic condition. Sequential pH control was effective to control the mixed wastes from contaminated soil. 2 V/cm was applied to reactor to evaluate the effect of constant voltage gradient, after two weeks, the removal efficiency of Zn, Ni and F was 20.5%, 2.5% and 57.4%, respectively. Even though the removal of Zn and Ni was very low, the pH control enhanced transport of Zn and Ni significantly. As a result, sequential pH control is a effective method to remediate mixed waste-contaminated soil.

• Journal of Navigation and Port Research
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• v.34 no.10
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• pp.787-792
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• 2010

It is necessary to predict the penetration of chloride ions for designing RC construction in marine environments. However, it takes a long time to obtain chloride migration coefficients. Therefore, the rapid chloride penetration test (RCPT) is generally used to shorten the test time. But there is a difference between chloride migration coefficients determined by rapid chloride penetration tests and those based on exposure in marine environments. In this study, we evaluated the effect on the chloride ion migration coefficient caused by a change in voltage and NaCl concentration. We also compared the relationship between the chloride ion migration coefficient by RCPT and that by exposure in marine environments. As a result of the experiments, we found that there is only a small change in the experimental factors based on changes in voltage and NaCl concentration and since they are so small, we can conclude that they are in the range of experimental error and test results from chloride ion migration coefficients by RCPT and exposure were very different from each other. In the exposure experiments, when the water-cement ratio was increased, the smaller fine air gaps in concrete affected the chloride ion migration coefficient.

• Journal of Electrical Engineering and Technology
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• v.12 no.1
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• pp.302-309
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• 2017

The ageing of XLPE cable insulation will lead to the accelerating accumulation of space charge, which will greatly affect the safe operation of the HVDC cable. In order to investigate the influence of different ageing modes on the space charge distribution of the HVDC cable, thermal stressed, electrical stressed and electro-thermal stressed endurance tests were carried out on the XLPE peelings. The tested XLPE peelings were obtained from 160kV HVDC cable insulation. The endurance tests were carried at thermal stress of 363K, electrical stress of 20kV/mm DC and a combination of both. The Pulsed Electro-Acoustic (PEA) method was used to measure the space charge distribution of the samples. The influences of ageing on the trap energy distribution were analyzed based on the isothermal relaxation theory and the decay characteristics of the space charge. The results showed that thermal ageing would help to improve the crystalline morphologies of the XLPE at the early stage. The total amount of space charge decreased compared to the ones before thermal ageing. The long term of electrical stress would result in the cleavage of polymer molecule chains which would intensify the accumulation of space charge and increase the density and depth of electron traps. With a combination of electrical and thermal stress, the injection and migration of space charge were more significant. Besides, the depth and density of electron traps increased rapidly with the increase of endurance time.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.47-53
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• 2015

By the trends of electronic package to be more integrative, the fine Cu trace pitch of organic PCB is required to be a robust design. In this study, the short circuit failure mechanism of PCB with a Cl element under the Temperature humidity bias test ($85^{\circ}C$/85%RH/3.5V) was examined by micro-structural study. A focused ion beam (FIB) and an electron probe micro analysis (EPMA) were used to polish the cross sections to reveal details of the microstructure of the failure mode. It is found that $CuCl_x$ were formed and grown on Cu trace during the $170^{\circ}C$/3hrs and that $CuCl_x$ was decomposed into Cu dendrite and $Cl_2$ gas during the $85^{\circ}C$/85%RH/3.5V. It is suggested that Cu dendrites formed on Cu trace lead to a short circuit failure between a pair of Cu traces.

• Journal of Electrochemical Science and Technology
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• v.9 no.2
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• pp.85-92
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• 2018

Olivine structure of $LiFePO_4$ (LFP) is one of the most commonly used materials in aqueous rechargeable lithium batteries (ARLBs), and can store and release charge through the insertion/de-insertion of $Li^+$ between LFP and FP. We have fabricated LFP and LFP/FP electrodes on titanium paper and studied their electrochemical properties in 2 M $Li_2SO_4$. The LFP/FP electrode was determined to be a suitable electrode for electo-ostmotic pump (EOP) in terms of efficiency in water and 0.5 mM $Li_2SO_4$ solution. Experiments to determine the effect of cations and anions on the performance of EOP using LFP/FP electrode have shown that $Li^+$ is the best cation and that the anion does not significantly affect the performance of the EOP. As the concentration of $Li_2SO_4$ solution was increased, the current increased. The flow rate peaked at $4.8{\mu}L/30s$ in 1.0 mM $Li_2SO_4$ solution and then decreased. When the EOP was tested continuously in 1.0 mM $Li_2SO_4$ solution, the EOP transported approximately 35 mL of fluid while maintaining a stable flow rate and current for 144 h.

• Korean Journal of Materials Research
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• v.17 no.9
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• pp.453-457
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• 2007

Interest in use of ink-jet printing for pattern-on-demand fabrication of metal interconnects without complicated and wasteful etching process has been on rapid increase. However, ink-jet printing is a wet process and needs an additional thermal treatment such as an annealing process. Since a metal ink is a suspension containing metal nanoparticles and organic capping molecules to prevent aggregation of them, the microstructure of an ink-jet printed metal interconnect 'as dried' can be characterized as a stack of loosely packed nanoparticles. Therefore, during being treated thermally, an inkjet-printed interconnect is likely to evolve a characteristic microstructure, different from that of the conventionally vacuum-deposited metal films. Microstructure characteristics can significantly affect the corresponding electrical and mechanical properties. The characteristics of change in microstructure and electrical resistivity of inkjet-printed silver (Ag) films when annealed isothermally at a temperature between 170 and $240^{\circ}C$ were analyzed. The change in electrical resistivity was described using the first-order exponential decay kinetics. The corresponding activation energy of 0.44 eV was explained in terms of a thermally-activated mechanism, i.e., migration of point defects such as vacancy-oxygen pairs, rather than microstructure evolution such as grain growth or change in porosity.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.79-80
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• 2007

Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing (CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical planarization/polishing (ECMP) or electro-chemical mechanical planarization was introduced to solve the. technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.

• Korean Membrane Journal
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• v.9 no.1
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• pp.18-26
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• 2007

The transport and removal characteristics of cobalt ions were investigated in a continuous electrodeionization with cation exchange textile (CEDI-CET). It was shown that the removal properties of cobalt ions are strongly dependent on the operating parameters such as temperature, flow velocity, and the solution pH. The transport and removal of cobalt ions was mainly related to the sorption on the surface and the convection and electro-migration through the ion exchange medium. In this study, the CEDI-CET showed good process performance for the removal of metal ions compared with the conventional CEDI with resins.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2005.05a
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• pp.360-363
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• 2005

Biomimetic actuators composed of cellophane with an electrically conducting polyaniline(PANI) film have been fabricated and tested in air ambience conditions doped with two different counter ions such as perchlorate (${ClO_4}^-$) and tetrafluoroborate (${BF_4}^-$). Fabrication of the trilayer CP//CELLOPHANE//CP substantially enhanced the tip displacement (13.2mm) compared to the small displacement (8.3mm) of the bilaye. CP//CELLOPHANE. The ion migration among layers is the main factor behind the expansion of cellophane, while the expansion/contraction of PANI are dependent on the redox reaction of the polymer. The displacement of the composite is dominated by the humidity content. This implies that the actuation principle is possibly due to the assistance of water existing.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.11a
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• pp.69-72
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• 2007

Cellulose is a beneficial material that has low cost, lightweight, high compatibility and biodegradability. Recently electroactive paper (EAPap) on cellulose base was discovered as a smart material and actuator through ion migration and piezoelectric effect. Furthermore cellulose has a potentiality to apply the display material, because of its high reflectivity, flexibility and high transmittance. The various shapes and height patterns of the Cellulose acetate (CA) solution, such as circle and honeycomb patterns, were fabricated and observed by field emission scanning electron microscope (FESEM, S4300 Hitachi). The resulting pattern showed uniform size in the large area without defect. After stretching the CA film with saponification process in the sodium methoxide in methanol solution, Most of the compositions become one directional ordered nanofibers below 50nm.