• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.33-37
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• 2011

In this study, the degradation mechanism of mounted chip resistors with Ag-epoxy isotropic conductive adhesives (ICAs) under the humidity exposure ($85^{\circ}C$/85%RH) was examined by electrical resistance change and microstructural study. The effect of the chloride content in Ag-epoxy ICA on joint stability was also examined. The increasing range of the electrical resistance in the typical ICA joint was greater than that in the low Cl content ICA joint. In the case of the typical ICA joint, Sn oxides such as SnO, $SnO_2$, and Sn-Cl-O were formed inhomogeneously on the surface of the Sn plating during the $85^{\circ}C$/85%RH test. In contrast, no Sn-Cl-O was found in the low Cl content ICA joint during the $85^{\circ}C$/85%RH. It is suggested that Cl in Ag-epoxy ICA accelerate the electrical degradation of Sn plated chip components joined with Ag-epoxy ICA.

• Korean Journal of Materials Research
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• v.22 no.7
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• Applied Chemistry for Engineering
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• v.16 no.4
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• pp.527-532
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• 2005

Ionic polymer metal composites (IPMC) are soft polymeric smart materials having large displacement at low voltage in air and water. The polymeric electrolyte actuator consists of a thin and porous membrane and metal electrodes plated on both faces, in impregnation electro-plating method. The response and actuation of actuator are governed. Among many factors governing the activation and response of IPMC actuator, the surface electrode plays an important role. In this study, the well-designed modification of electrode surface was carried out in order to improve the chemical stability well as electromechanical characteristics of the IPMC actuator. We employed Ion Beam Assisted Deposition (IBAD) method to prepare the topologically homogeneous thin surface electrode. After roughing the surface of Nafion membrane in order to get a larger surface area, the IPMC was prepared by impregnation for electro-plating and re- coating on the surface through traditional chemical deposition, followed by an additional surface treatment with high conductive metals with IBAD. It was observed that our IPMC specimen shows the enhanced surface electrical properties as well as the improved actuation and response characteristics under applied electric field.

• Journal of the Korean institute of surface engineering
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• v.20 no.3
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• pp.118-126
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• 1987

The Zn-Al composite electroplating was studied by using chloride zinc bath containing metal hydroxides $(Zn(OH)_2,\;Al(OH)_3))$ and aluminium powder. The size of Al powder codeposited in the beaker bath with Al powder of-400 mesh was under 10${\mu}m$. The Zn-Al composite was electro-deposited at 40$^{\circ}C$ in the ranges of current density of 5-50 A/$dm^2$ in the flowing electrolyte. The content of aluminium particles codeposited increased slightly with increasing flow rate of electrolyte from 0.5 m/sec to 1.0 m/sec, and decreased with increasing current density from 5 A/$dm^2$ to 50 A/$dm^2$. The content of aluminium particles codeposited by using the electrolyte containing zinc hydroxide(0.1M) was 2~4 wt%. The Al powder was codeposited mainly near the surface layer of the electrodeposits. The dissolution rate of aluminium particles in the electrolyte containing 0.1M $Zn(OH)_2$ and Boric acid was 0.41 g/l. day in comparison with 1.5 g/l. day dissolution rate in pure chloride bath.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.51-56
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• 2014

The reliability of solder joint is significantly affected by the property of surface finish. This paper reports on a study of high speed shear energy and failure mode for Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder joints with the time of Pd activation. The nodule size of electroless Ni-P deposit increased with increasing the time of Pd activation. The roughness (Ra) of electroless Ni-P deposit decreased with increasing the time of Pd activation. Then, with $HNO_3$ vapor, the quasi-brittle and brittle mode of SAC405 solder joint decreased with increasing the time of Pd activation. This results indicate that the increase in the Pd activation time for Electroless Ni/ Electroless Pd/ Immersion Au (ENEPIG) surface finish play a critical role for improving the robustness of SAC405 solder joint.

• Journal of the Korean institute of surface engineering
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• v.28 no.5
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• pp.276-288
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• 1995

A nickel mesh and an expanded nickel sheet were used as a current collector for supporting active materials of cathode in rechargeable batteries, while a porous nickel substrate was extensively studied because of its 3-dimensional structure which has high capabilities for active materials and current collection. Optimum coating conditions were studied by SEM and two step d. c. constant current electrolysis for the graphite coating and electro-plated nickel on an urethane substance which was highly porous and 3-dimensional structure. The density and the porosity of nickel support obtained by using two step current density and 80 ppi urethane substance were 0.38∼0.40 g /㎤ and 94∼96%, respectively. It was possible to fabricate a highly porous and good packable nickel substrate using two step current density and surfactants at sulfamic acid nickel plating bath.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.140-140
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• 2003

Ti:LiNbO$_3$ 광 도파로를 이용한 광 변조기의 마이크로파 손실을 감소시키고 RF와 광파의 속도정합의 조건하에서 초고속 광변조의 제작을 위해서는 두꺼운 TW(travelling wave) 전극이 필수적이다 또한, 두꺼운 Au 전극이 우수한 RF 특성을 갖기 위해서는 도금된 Au 전극이 고순도의 작은 grain size를 갖는 도금 층을 제조하여야 하며, 도금 후 Au 층의 뒤틀림 현상이 작아야 한다. 따라서, 본 연구에서는 LiNbO$_3$ 기판 위에 30nm Ni-Cr과 50nm의 Au의 기저 막을 올렸으며 감광제를 이용한 photo-lithography 공정으로 CPW(coplanar waveguide) 구조의 패턴을 약 13$\mu\textrm{m}$의 두께로 형성 한 후 non-cyanidic 액을 이용하여 전류밀도 0.02 - 0.06 mA, bubble 및 non-bubble flow를 조건으로 하여 도금된 Au 전극의 특성을 관찰하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2002.05a
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• pp.35-35
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• 2002

Atomic force microscopy was applied to study the formation and growth mechanism of thin chrome layers prepared under various pulse plating conditions. The chrome was electro-deposited from an electrolyte bath containing 250 gl-l of chromic acid, 25 gl-l of sulfuric acid using direct current density of $1.6{\;}mA.$\textrm{mm}^{-2} and pulse currents with on-off time from 5 to 900 ms. The higher current density enhanced nucleation rate which resulted in refining grain size. The chrome growth kinetics determining nodule size and shape significantly depends on the duration of on-time rather than duration of off-time and on/off time ratio.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.314-317
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• 2006

Electroformed part is widely used in modem manufacturing industries, especially semi-conductor division. It is basically a specialized form of electroplating. So, it has very similar parameters with electroplating. The object of this study is development of the fine metal mask by electroforming process. In this paper considered two parameters. The first is relationship of UV exposure and soft baking time. The other one is thickness uniformity of electroformed parts by distance of between electrodes. This paper presents the fabrication method of fine metal mask by electroforming process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.848-853
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• 2001

Electrostatic actuation was adopted for ease of fabrication. We proposed a new driving scheme that uses the vector sum of force generated by comb-finger and by parallel plate. The moving and fixed electrodes are arranged to maximize the driving force. In this paper, an electrostatic field analysis is performed by Maxwell analysis tool for micro actuators. From the analysis, a comb-parallel type micro-actuator with 4${\mu}{\textrm}{m}$ width, 6${\mu}{\textrm}{m}$ overlap and 45${\mu}{\textrm}{m}$ height could be designed. In order to compare the new type of actuator with the conventional comb type of actuator, we arranged that both types have the same area and the same number of actuators. To make a high aspect ratio structure, we are developing fabrication process using SU-8 and electro-plating.