• 한국초전도ㆍ저온공학회논문지
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• 제25권4호
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• pp.24-27
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• 2023

Until now, many research activities have been conducted to commercialize high-temperature superconducting (HTS) wires for electric applications. Most of all researchers have focused on enhancing the piece length, critical current density, mechanical strength, and throughput of HTS wires. Recently, HTS magnet for generating high magnetic field shows degraded performance due to the deformation of HTS wire by high electro-magnetic force. The deformation can be derived from widthwise thickness non-uniformity of HTS wire mainly caused by wet processes such as electro-polishing of metal substrate and electro-plating of copper. Gradient sputtering process is designed to improve the thickness uniformity of HTS wire along the width direction. Copper stabilizing layer is deposited on HTS wire covered with specially designed mask. In order to evaluate the thickness uniformity of HTS wire after gradient sputtering process, the thickness distribution across the width is measured by using the optical microscope. The results show that the gradient deposition process is an effective method for improving the thickness uniformity of HTS wire.

• 제어로봇시스템학회논문지
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• 제13권11호
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• pp.1067-1073
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• 2007

This paper presents development of an special metal hydride(SMH) actuator system using a peltier module. The newly developed simple SMH actuator, consisting of the plated hydrogen-absorbing alloy as a power source, Peltier elements as a heat source and a cylinder with metal bellows as a functioning part, has been developed. The SMH actuator is characterized by its small size, low weight, noiseless operation and a compliance similar to that of human body. A new SMH actuator that uses reversible reactions between the heat energy and mechanical energy of a hydrogen absorbing alloy. It is well known that hydrogen-absorbing alloys can reversibly absorb and desorb a large amount of hydrogen, more than about 1000 times of their own volume. To improve the thermal conductivity of the hydrogen-absorbing alloy, an electro-less copper plating has been carried out. For this purpose, the effects of the electro-less copper plating and the dynamic characteristics of the SMH actuator have been studied. The hydrogen equilibrium pressure increases and hydrogen is desorbed by heating the hydrogen-absorbing alloys, whereas by cooling the alloys, the hydrogen equilibrium pressure decreases and hydrogen is absorbed. The SMH actuator has the characteristic of being light and easy to use. Therefore, it is suitable for medical and rehabilitation applications.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.551-555
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• 2005

This paper presents the temperature-pressure characteristics of SMH actuator using a peltier module. The simple SMH actuator, consisting of the plated hydrogen-absorbing alloy as a power source, Peltier elements as a heat source and a cylinder with metal bellows a functioning part has been developed. The SMH actuator is characterized by its small size, low weight, noiseless operation and a compliance similar to that of the human body. A new special metal hydride(SMH) actuator that uses the reversible reaction between the heat energy and mechanical energy of a hydrogen absorbing ally. It is well known that hydrogen-absorbing alloys can reversibly absorb and desorb a large amount of hydrogen, more than about 1000 times as their own volume. To improve the thermal conductivity of the hydrogen-absorbing alloy, an electro-less copper plating has been carried out. The effects of the electro-less copper plating and the dynamic characteristics of the SMH actuator have been studied. The hydrogen equilibrium pressure increases and hydrogen is desorbed by heating the hydrogen-absorbing alloys, whereas by cooling the alloys, the hydrogen equilibrium pressure decreases and hydrogen is absorbed. Therefor, the SMH actuator has the characteristic of being light and easy to use and so is suitable for use in medical and rehabilitation applications.

• 한국정보통신학회논문지
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• 제16권4호
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• pp.759-764
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• 2012

고밀도집적을 위하여 전기도금과 무전해도금법을 적용하여 구리기둥주석범프(CPTB)를 제작하고, 그 특성을 분석하였다. CPTB는 ${\sim}100{\mu}m$의 피치를 갖도록 KM-1250 건식감광필름(DFR)을 사용하여 먼저 구리기둥범프(CPB)를 도금 전착시킨 다음, 구리의 산화억제를 위하여 그 위에 주석을 무전해 도금하였다. 열-압력에 따른 산화효과와 접합특성을 위하여 전기저항계수와 기계적 층밀림 전단강도를 측정하였다. 전기저항계수는 산화두께의 증가에 따라서 증가하였고, 전단강도는 $330^{\circ}C$에서 500 N의 열-압력일 때 최고치를 나타냈다. 시뮬레이션 결과에 따르면, CPTB는 시간이 경과됨에 따라 통전면적의 크기 감소의 결과를 나타냈으며, 그것은 구리의 산화에 의해 크게 영향을 받는 것으로 확인되었다.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2010년도 추계학술대회
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• pp.726-729
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• 2010

고밀도집적을 위하여 전기도금과 무전해도금법을 적용하여 구리기둥주석범프(CPTB)를 제작하고, 그 특성을 분석하였다. CPTB는 ${\sim}100{\mu}m$의 피치를 갖도록 KM-1250 건식감광필름(DFR)을 사용하여 먼저 구리 기둥범프(CPB)를 도금 전착시킨 다음, 구리의 산화억제를 위하여 그 위에 주석을 무전해 도금하였다. 열-압력에 따른 산화효과와 접합특성을 위하여 전기저항계수와 기계적 층밀림전단강도를 측정하였다. 전기저항계수는 산화두께의 증가에 따라서 증가하였고, 전단강도는 $330^{\circ}C$에서 500 N의 열-압력일 때 최고치를 나타냈다. 시뮬레이션 결과에 따르면, CPTB는 크기 감소의 결과를 나타냈으며, 그것은 구리의 산화에 의해 크게 영향을 받는 것으로 확인되었다.

• 해양환경안전학회지
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• 제17권2호
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• pp.155-160
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• 2011

현재 지구온난화 등의 환경문제로 인해 각종 산업분야에서 정량화에 대한 요구가 증대되어 해양산업에도 그 수요가 증가하고 있는 실정이다. 따라서 본 연구에서는 차세대 경량화 재료인 마그네슘이 활용되기 위해서 반드시 극복해야할 가장 중요한 특성인 내식특성에 대하여 고찰하고, 그 내식특성 향상을 위한 마그네슘 박막의 Morphology나 결정배향성의 영향을 해명하고자 하였다. 실험결과로부터 제작한 Mg 박막의 전기화학적 내식특성은 Ar 가스압이 높은 조건에서 제작한 막일수록 내식특성이 우수하였다. 이러한 경향은 표면 및 단면의 Morphology와 결정배향성과의 상관관계를 통하여 설명 가능하였다.

• 한국표면공학회지
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• 제49권2호
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• pp.111-118
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• 2016

A method to quantitatively analyze the defects formed by the hydrogen evolution during electroplating was suggested based on the theoretical approach of the small angle neutron scattering technique. In case of trivalent chrome layers, an isolated defect size due to the hydrogen evolution was about 40 nm. Direct and pulse plating conditions gave the average defect size of about 4.9 and $4.5{\mu}m$ with rod or calabash shape, respectively. Current density change of the pulse plating from $1.5A/dm^2$ to $2.0A/dm^2$ enlarged the average defect size from 3.3 to $7.8{\mu}m$. The defect morphology like rod or calabash was originated by inter-connecting the isolated defects. Small angle neutron scattering was useful to quantitatively evaluate defect morphology of the deposit.

• 한국재료학회지
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• 제19권6호
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• pp.344-348
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• 2009

The electrolyte effects of the electroplating solution in Cu films grown by ElectroPlating Deposition(EPD) were investigated. The electroplated Cu films were deposited on the Cu(20 nm)/Ti (20 nm)/p-type Si(100) substrate. Potentiostatic electrodeposition was carried out using three terminal methods: 1) an Ag/AgCl reference electrode, 2) a platinum plate as a counter electrode, and 3) a seed layer as a working electrode. In this study, we changed the concentration of a plating electrolyte that was composed of $CuSO_4$, $H_2SO_4$ and HCl. The resistivity was measured with a four-point probe and the material properties were investigated by using XRD(X-ray Diffraction), an AFM(Atomic Force Microscope), a FE-SEM(Field Emission Scanning Electron Microscope) and an XPS(X-ray Photoelectron Spectroscopy). From the results, we concluded that the increase of the concentration of electrolytes led to the increase of the film density and the decrease of the electrical resistivity of the electroplated Cu film.

• 한국폐기물자원순환학회지
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• 제35권7호
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• pp.653-659
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• 2018

In the industrial wastewater that occupies a large proportion of river pollution, the wastewater generated in textile, leather, and plating industries is hardly decomposable. Though dyeing wastewater has generally been treated using chemical and biological methods, its characteristics cause treatment efficiencies such as chemical oxygen demand (COD) and suspended solids (SS) to be reduced only in the activated sludge method. Currently, advanced oxidation technology for the treatment of dyeing wastewater is being developed worldwide. Electro-coagulation is highly adapted to industrial wastewater treatment because it has a high removal efficiency and a short processing time regardless of the biodegradable nature of the contaminant. In this study, the effects of the current density and the electrolyte condition on the COD removal efficiency in dyeing wastewater treatment by using electro-coagulation were tested with an aluminum anode and a stainless steel cathode. The results are as follows: (1) When the current density was adjusted to $20A/m^2$, $40A/m^2$, and $60A/m^2$ under the condition without electrolyte, the COD removal efficiency at 60 min was 62.3%, 72.3%, and 81.0%, respectively. (2) The removal efficiency with NaCl addition was 7.9% higher on average than that with non-addition at all current densities. (3) The removal efficiency with $Na_2SO_4$ addition was 4.7% higher on average than that with non-addition at all current densities.

• 마이크로전자및패키징학회지
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• 제28권1호
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• pp.47-54
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• 2021

미세화 되고 있는 PCB 솔더 범프 접합을 위해 종래 마이크로 볼에 의한 PCB 솔더 범프의 제조를 대신하여 주석 전기도금을 통한 패턴을 제작하기 위한 도금액을 제작하고 도금공정 조건을 찾는 실험을 진행하였다. SR 패터닝 후에 Cu 씨드층을 형성하고, 다시 DFR 패터닝을 통해 PCB 기판상에 선택성장이 가능한 패턴을 제작하였다. 도금액은 메탄술폰산을 기본액으로 하는 주석도금액을 사용하였으며, 2가의 주석이온의 산화를 방지하기 위해 hydroquinone을 첨가하였다. 표면활성제로는 Triton X-100를 사용하고, 결정립 미세화를 위해 gelatin을 첨가하여 시료를 제작하였다. 전기화학적 분극곡선을 측정함으로써, Triton X-100 및 gelatin 첨가제의 작용 특성을 비교하였으며, gelatin이 -0.7 V vs. NHE까지 수소발생을 억제하는 것에 비해 Triton X-100을 첨가하게 되면 -1 V vs. NHE까지 수소발생이 억제되는 것을 확인할 수 있었다. 결정립의 크기는 전류밀도가 증가하면서 미세화되는 일반적 경향을 나타내었으며, gelatin을 첨가하는 경우에 보다 더 미세해지는 것이 관찰되었다.