• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1997.10a
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• pp.224-227
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• 1997

In Ni and Zn plating, microstructure and corrosion behavior of electrodeposits with various electroplating condition were investigated. Optical microstructure, SEM images and polarization curves of electrodeposits are different with plating time and temperature.

• Journal of the Korean institute of surface engineering
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• v.47 no.3
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• pp.128-136
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• 2014

In the present study, we successfully developed an eco-friendly chemical etching solution and proper condition for plating on ABS material. The mechanism of forming Ni plating layer on ABS substrate is known as following. In general, the etching solution used for the etching process is a solution of chromic acid and sulfuric acid. The etching solution is given to the surface resulting in elution of butadiene group, so-called anchor effect. Such a rough surface can easily adsorb catalyst resulting in the increase of adhesion between ABS substrate and Ni plating layer. However a use of chromic acid is harmful to environment. It is, therefore, essential to develop a new alternative solution. In the present study, we proposed an eco-friendly etching solution composed of potassium permanganate, sulfuric acid and phosphoric acid. This solution was testified to observe the surface microstructure and the pore size of electrical Ni plating layer, and the adhesive correlation between deposited layers fabricated by electro Ni plating was confirmed. The result of the present study, the newly developed, eco-friendly etching solution, which is a mixture of potassium permanganate 25 g/L, sulfuric acid 650ml/L and phosphoric acid 250ml/L, has a similar etching effect and adhesion property, compared with the commercially used chromium acid solution in the condition at $70^{\circ}C$ for 5 min.

• Korean Journal of Materials Research
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• v.19 no.7
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• pp.349-355
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• 2009

Metal thin film patterns on a LTCC substrate, which was connected through inner via and metal paste for electrical signals, were formed by a screen printing process that used electric paste, such as silver and copper, in a conventional method. This method brought about many problems, such as non uniform thickness in printing, large line spaces, and non-clearance. As a result of these problems, it was very difficult to perform fine and high resolution for high frequency signals. In this study, the electric signal patterns were formed with the sputtered metal thin films (Ti, Cu) on an LTCC substrate that was coated with protective oxide layers, such as $TiO_2$ and $SiO_2$. These electric signal patterns' morphology, surface bonding strength, and effect on electro plating were also investigated. After putting a sold ball on the sputtered metal thin films, their adhesion strength on the LTCC substrate was also evaluated. The protective oxide layers were found to play important roles in creating a strong design for electric components and integrating circuit modules in high frequency ranges.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.7
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• pp.621-628
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• 2009

Nickel-phosphorus alloys are attractive materials for diamond turning applications such as fabrication of large optics and other high precision parts. It is also well-known that the higher phosphorus content of the alloys minimizes the diamond tool wear. Due to the weakness of electoless nickel plating that the phosphorus contents is limited to 13-14% (wgt), increased attention has been paid at electro-nickel plating which enables the alloys with 15-16% phosphorus. In this study, experiments were carried out to observe the wear characteristic of single crystal diamond tools in micro-grooving of electro-nickel plated drums. The experiments shows that long distance (50km) machining of micro-grooving on electro-nickel plated drum is possible with a single crystal diamond tool without any significant tool wear and defective machined surface.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.21-27
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• 2007

Nickel bumps for ACF(anisotropic conductive film) flip chip application were fabricated by electroless and electro plating and their mechanical properties and impact reliability were examined through the compressive test, bump shear test and drop test. Stress-displacement curves were obtained from the load-displacement data in the compressive test using nano-indenter. Electroplated nickel bumps showed much lower elastic stress limits (70MPa) and elastic moduli ($7.8{\times}10^{-4}MPa/nm$) than electroless plated nickel bumps ($600-800MPa,\;9.7{\times}10^{-3}MPa/nm$). In the bump shear test, the electroless plated nickel bumps were deformed little by the test blade and bounded off from the pad at a low shear load, whereas the electroplated nickel bumps allowed large amount of plastic deformation and higher shear load. Both electroless and electro plated nickel bumps bonded by ACF flip chip method showed high impact reliability in the drop impact test.

• Journal of the Korean institute of surface engineering
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• v.41 no.1
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• pp.33-37
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• 2008

Polycarbonate has a high transmittance to light, low specific gravity, flexibility and cost-effectiveness that extends the application field of the polymer to bio-engineering, optics, electronic parts, etc. Moreover, electro plating of metallic film on PC could endow the parts the electromagnetic interference shielding capability. However, poor adhesion of copper on PC limited the wide usage in the industry. In this work, a composite(PC/ABS) and MmSH(Momentary mold Surface Heating) injection process were used to improve the plating characteristics; plating thickness, gloss and adhesion. Also plasma treatment and chemical treatment were employed for improving adhesion. Plating characteristics on PC/ABS were better than those on PC due to the anchoring effect of butadiene. MmSH injection process could ameliorate the gloss and coating adhesion. Also plating thickness and adhesion of PC and PC/ABS were increased by plasma treatment.

• Journal of the Korean institute of surface engineering
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• v.42 no.6
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• pp.301-310
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• 2009

Recently, it has been increasing for the eco-environment plating and surface treatment of eco-environment to decrease hazardous materials. Particular eco-environment can be applied to electronics or automotive parts of industry. In the case of mobile phone, if there were fired, the products bearing dye may be contaminated with the hazardous and wasted. we can obtain the original metal color by electro coloring by metal salt, get rid of hazardous gas, decrease the wasted sludges. Now, the industrial patent number is increasing in Korea, we can accomplish the development of green industry by supporting technical trend of the plating and surface treatment in eco-environment.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.224-234
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• 1999

An attempt was made to characterize the relationship between pretreatment processes, electrolysis conditions and behaviors of the plated gold layer. In order to investigate the effect of pretreatment processes on plating, rest potential measurements of various pretreated stainless steels and a.c.-impedance spectroscopy tests were carried out in the strike plating solution. Characteristics of plated gold layers and adhesions between plated gold layers and stainless steel substrates were examined by scratching tests and micro-Vickers hardness tests. The result shows that the strike plating enhanced the adhesion of interface, the cathodic electro-activation pretreatment process improving both corrosion resistance and adhesion strength. The preferred orientations of plated gold layers were examined by the X-ray diffraction technique. As the current density increases, [111] preferred orientation of plated gold layers was found to become well developed.

• Carbon letters
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• v.10 no.3
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• pp.213-216
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• 2009

The electrochemical deposition of Pt nanoparticles on carbon nanotubes (CNTs) supports and their catalytic activities for methanol electro-oxidation were investigated. Pt catalysts of 4~12 nm average crystalline size were grown on supports by potential cycling methods. Electro-plating of 12 min time by potential cycling method was sufficient to obtain small crystalline size 4.5 nm particles, showing a good electrochemical activity. The catalysts' loading contents were enhanced by increasing the deposition time. The crystalline sizes and morphology of the Pt/support catalysts were evaluated using X-ray Diffraction (XRD) and Transmission Electron Microscopy (TEM). The electrochemical behaviors of the Pt/support catalysts were investigated according to their characteristic current-potential curves in a methanol solution. In the result, the electrochemical activity increased with increased plating time, reaching the maximum at 12 min, and then decreased. The enhanced electroactivity for catalysts was correlated to the crystalline size and dispersion state of the catalysts.

• Resources Recycling
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• v.5 no.3
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• pp.31-36
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• 1996

The metallic copper was recovered from sludge of the copper electro-plating plant by pyrometallurgical process. The reducing agent was Pyrolysized from waste tires and the flux was a mixture $Na_2CO_3$, $NaB_4O_7$, and glass. The green sludge contained 87.5% moisture and 12.5% solid with 56.5% Cu and 1.59% Fe. The sludge dried at $100^{\circ}C$ was analyized to be $Cu_4SO_4(OH)_6{\cdot}2H_2O$ and CuO by XRD analysis. The former was 84% and the latter 16%, However, the calcined sludge at $500^{\circ}C$ was 49% $Cu_2O(SO_4)$ and 51% CuO. The sludge could by smelted at $1100^{\circ}C$ for two hours with 6 to 8 moles carbon with respect to copper to produce metallic copper (>90%) with recovery of 9% above.