• Proceedings of the KSME Conference
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• 2008.11a
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• pp.256-259
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• 2008

An micro-probe tip must be manufactured using thin film to evaluate integrity of the semiconductor with narrow distance between pads. In this study, fatigue tests were performed for BeCu thin film which is used in micro-probe tip of semiconductor test machine. The thin film was manufactured by electro plating process, and the specimens were fabricated by wire-cut electric discharge method to make hour glass type specimen of $5000{\mu}m$ width, $29200{\mu}m$ length and $30{\mu}m$ thickness. The fatigue test of load control with 10Hz frequency was performed, in ambient environment. The fatigue cycles were tension-tension with mean stress, at stress ratio, R=0.1.

• Journal of Welding and Joining
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• v.29 no.5
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• pp.90-94
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• 2011

Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.

• Journal of the Korean institute of surface engineering
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• v.4 no.1
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• pp.16-23
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• 1971

In this study , fluoborte solution consisting of lead fluoborate, tin fluoborate and cupric acetate was used. By addition of small amount of Cu+= ion to the solution, the Cu content of deposition layer was almost controlled less than 5%. The amount of Cu in deposition layer was almost constant without any influence of Pb++ & Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution . Agitation of plating solution & low current density result in the increase of Cu content. Analyzing of microscopic structures and etching tests of the deposited alloy, it was believed that the alloy had a lamellar structure consisting of copper rich lamellar and lead rich layer.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.168-168
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• 2016

최근 크로메이트 피막의 대체로서 실란 커플링제를 사용한 화성처리가 주목되고 있다. 실란 커플링제는 $R^{\prime}-(CH_2)_n-Si(OR)_3$로 나타내며 OR은 가수분해 가능한 메톡시기, 에톡시기 등의 알콕시기이다. OR기는 가수분해하여 반응성이 높은 시라놀기(-SiOH)를 생성하여 금속표면에 흡착하기 쉽다. 이후, 건조할 때 탈수 축합하여 공유결합이 가능하다. R'는 탄화수소에 한정되지 않고 성질이 다른 원소의 관능기를 나타내며 아미노(amino)기, 글리시딜(glycidyl)기, 멜캅토(melcapto)기, 비닐(vinyl)기를 들 수 있다. 실란 커플링제 가운데 아미노기를 갖는 실란 커플링제는 아연도금 강판을 포함한 다양한 금속의 내식성을 향상시킬 수 있는 화합물의 하나이다. 본 연구에서는 아미노기를 함유한 실란 커플링제에 인산 수용액을 도포하여 수세하지 않고 건조하여 피막을 형성시켰다. 또 부식거동 조사를 목적으로 아미노기를 함유한 실란 커플링제를 사용하여 초산첨가의 경우와 비교하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.77-79
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• 1997

A 5Gbps LiNb $O_3$ optical phase modulator was packaged and described. A APE(annealed proton exchange) method was employed for the optical waveguide and the electrode of ACPS (asymmetric coplanar strip) type was formed by electro-plating on LiNb $O_3$ fort applying microwave signal. The resulted phase modulator exhibited a single mode at a 1550nm wavelength and Its modulation bandwidth, Insertion loss and driving voltage showed 7$^{GHz}$, 3. $O^{dB}$ and 6V. respectively.y.

• Journal of the Korean institute of surface engineering
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• v.28 no.3
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• pp.123-132
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• 1995

While a nickel mesh and an expanded nickel sheet are used as current collectors for supporting active anode materials in rechargeable batteries, a porous nickel substrate is studied extensively for its 3-dimensional structure which has high capabilities for active materials and current collection. Optimum plating conditions were studied by polarization measurement. Scanning Electron Microscopy (SEM) showed that both electroless-and electro-plated nickel on an urethane substrate were highly porous and consisted of nearly spherical pores. The diameter and the channel size of the pores were found to be 300~500 $\mu\textrm{m}$ and 50~200$\mu\textrm{m}$, respectively. The shape of skeleton resembled a triangular prism with length extending about 50~100 $\mu\textrm{m}$.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.2380-2382
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• 2005

UV-LIGA 공정을 이용하여 3차원 마이크로 인덕터 제작 기술에 관하여 연구하였다. 마이크로 인덕터의 코일, 비아(via), 코어(core)의 Multi-layer 제작을 위해 UV-LIGA 공정을 이용하였으며, 전해도금(electro plating)을 위한 씨올기(seed layer)로서는 e-beam evaporator를 이용하여 금속을 증착하였다. 3차원 마이크로 인덕터의 도금 방법으로는 전해도금을 사용하였으며, 코일과 비아 부분은 구리(Cu) 전해도금, 코어 부분은 니켈(Ni)과 철(Fe)의 합금인 퍼멀로이(Ni/Fe) 전해도금을 하였다. 3차원 마이크로 인덕터의 샘플크기로는 코어의 폭은 $300{\mu}m$, 전체 길이는 9.2mm, 두께는 $20{\mu}m$의 구조로 제작되었으며, 코일 부분은 폭이 $40{\mu}m$, 두께는 $30{\mu}m$이며, 코일턴 수는 70회의 구조로 제작하였다.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.65 no.3
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• pp.224-234
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• 2016

This study developed the conductivity pattern of solid surface using laser direct pattern and compound polymer material technology. For development direct patterning system of solid surface, we used the laser power stabilizer, the dynamic focusing, 3D scanner S/W and the auto aligning techniques. Also For conductivity pattern, we are developed compound polymer material with additive by electro-less plating. These technologies are already used commercially. However operation and control integrated system for direct patterning of solid surface are not yet developed. The objective of this paper is to introduce the laser direct structuring for simple process improvement instead complex PCB process, and develop the operating stability and integration system. Also we implemented new application of laser direct structuring through sample manufacture.

• Proceedings of the KIEE Conference
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• 2001.10a
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• pp.104-106
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• 2001

In this paper, it is object of design of high efficiency slotless BLDC motor using film coil. Slotless BLDC motor is able to have high efficiency property and low cogging torque, due to magnetization of stator core have constant contribution by slotless core. But it is difficult to make coil winding of slotless BLDC motor. So we make amateur of slotless BLDC motor using film coil. Film coil is fabricated by drilling, electro-plating and etching of copper/insulator/copper plate. In this paper, after design of slotless BLDC motor for moving axial blower, it is fabricated by NdFeB permanent magnet type rotor and film coil.

• Journal of the Korean institute of surface engineering
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• v.37 no.5
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• pp.243-248
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• 2004

A palladium-nikel(Pd-Ni) alloy composite membrane has been fabricated on microporous nickel support formed with nickel powder. Plasma surface treatment process is introduced as pre-treatment process instead of HCI activation. Pd coating layer was prepared by dc magnetron sputtering deposition after $H_2$ plasma surface treatment. Palladium-nickel alloy composite layer had a fairly uniform and dense surface morphology. The membrane was characterized by permeation experiments with hydrogen and nitrogen gases at temperature of 773 K and pressure of 2.2psi. The hydrogen permeance was 6 ml/minㆍ$\textrm{cm}^2$ㆍatm and the selectivity was 120 for hydrogen/nitrogen($H_2$/$N_2$) mixing gases at 773 K.