• Journal of the Korea Computer Industry Society
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• v.2 no.12
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• pp.1533-1540
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• 2001

In this paper, we described extraction method of electrical parameters and modeling method of PCB nets on PCB design process. To analyze electrical characteristics of real PCB structure, we selected a cache memory system as an experimental board and designed 6 layer PCB substrate. For extraction of the electrical parameters, we divided circuit elements into the components of conductor types which are wires, via holes, BGA balls etc. and combined the calculated value by real net structure to modeling the PCB nets. We analyzed the electrical characteristics of the PCB nets with the simulation tools of SPICE and XNS. The simulation analysis has shown that the maximum signal delay was 2.6ns and the maximum crosstalk noise was 281 mV and we found that the designed substrate was adequate to system specification.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.1
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• pp.29-33
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• 2010

As the demands for the higher data transmission speed and capacity as well as integration density grow throughout the network, much works have being done in order to integrate the Electrical PCB with Optical PCB. However, one of the most troublesome problems in the commercial bonding process is to need the high temperature for the bonding. Due to the high temperature bonding process, lots of side problems are followed such as warpage and crack, etc. In this paper, we tried to develop the new bonding technology with low temperature around $100^{\circ}C$. As a result of this study, the PCB bonding technology with high bonding strength is demonstrated with the value of bonding strength from 7 to 8 MPa at the temperature of $100^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.150-152
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• 2004

The number of layers in rigid PCB(printed circuit board) is restricted, so the number of components can be embedded in module is restricted also. But using flexible multilayer PCB, the layers over than 7 can be evaluated. In this study, to verify the possibility of application of flexible multilayer PCB to RF modules, multilayered embedded capacitor is fabricated and analyzed. The characteristics of embedded capacitor is analyzed and compared to that of MLCC and LTCC capacitor. Embedded capacitor has better electrical features than MLCC and compatible one to LTCC capacitor.

• Transactions on Electrical and Electronic Materials
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• v.9 no.1
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• pp.33-37
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• 2008

This paper describes the development of a new $5.0{\times}3.2mm$ SAW filter bank which is consist of 12 L, C matching components and 4 SAW bare chips on PCB substrate with CSP technology. We improved the manufacturing cost by removing the ceramic package through direct flip bonding of $LiTaO_3$ SAW bare chip on PCB board after mounting L, C passive element on PCB board. After that we realized the hermitic sealing by laminating the epoxy film. To confirm the confidentiality and durability of the above method, we have obtained the optimum flip bonding & film laminating condition, and figured out material property and structure to secure the durability & moisture proof of PCB board. The newly developed super mini $5.0{\times}3.2mm$ filter bank shows the superior features than those of existing products in confidence, electrical, mechanical characters.

• The Transactions of the Korean Institute of Power Electronics
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• v.25 no.3
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• pp.162-170
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• 2020

In this paper, we report our study of the current measuring technique by implementing a pick-up coil in the PCB pattern instead of the current measuring sensor in a power converter using a WBG device. The proposed PCB pattern coil structure has a higher mutual inductance value than the conventional pattern by constructing the coil using the multi layer board. It has high sensitivity and is configured without additional process outside the PCB. In the current measurement, the integrator is measured by integrating the coil at the back end and the current waveform measured using proposed pick-up coil is confirmed by comparing it with the original current waveform through DPT simulation.

• Electrical & Electronic Materials
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• v.10 no.9
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• pp.952-959
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• 1997

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.297-298
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• 2009

대부분의 반도체 소자의 고장 원인은 85%정도가 열로 인한 것이며, 고출력 LED는 인가된 에너지의 20%정도의 광으로 출력되며 나머지 80%가 열로 전환된다. 본 논문에서는 PMS-50과 KEITHLEY 2430을 이용하여 PCB 구조와 Via hole 구성에 따른 LED 패키지의 열적 광학적 특성을 분석하였다. 0.6mm의 Via hole을 가진 FR4 PCB의 열특성이 가장 우수하였으며, Via hole 0.6mm FR4 PCB의 경우 McPCB에 상응하는 광출력 특성을 보였다.

• Journal of Microbiology and Biotechnology
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• v.13 no.4
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• pp.495-500
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• 2003

Tight junctions (TJ) between adjacent Sertoli cells in testis are important for the formation of the blood testis barrier (BTB). In an effort to verify the reproductive health risk of endocrine-active chemicals (EACs), changes in the transepithelial electrical resistance (TER) and the expression of TJ genes were examined by co-planar polychlorinated biphenyl (PCB) treatment in cultured mouse Sertoli cells. Although the increase in TER of Sertoli cells was accelerated by 10 nM co-planar PCB, it was downregulated by 100 nM co-planar PCB. The expression of claudin-1 was downregulated by co-planar PCB in a concentration-dependent manner. On the contrary, the expression of claudin-1 was increased in the Sertoli cells by 10 nM co-planar PCB treatment. These results suggest that the structure and function of TJ may be targeted by co-planar PCB in Sertoli cells. Assessment of the structure and function of TJ in Sertoli cells might be useful for screening the reproductive health risk of EACs.

• Journal of IKEEE
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• v.11 no.4
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• pp.252-256
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• 2007

We demonstrate that the effect of the PCB ground length and the cover is important in the performance of 2.4 GHz patch antennas. The Center frequency in the return loss shifts as much as 0.5 GHz, when the length of the PCB ground increases from 30 to 85 mm. The position of 10-dB bandwidth accordingly shifts to lower frequency region. Finally, the resonance at 2.4 GHz becomes stronger when the top cover exists. The radiation pattern of the patch antenna is also strongly affected by the ground structure and the existence of the top cover. In both the return loss and the radiation pattern, 3-dimensional simulations are shown to be an efficient tool.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.7
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• pp.1336-1341
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• 2009

In this paper, an EMI reduction effects using an EMC chamber is described and reduction methods is proposed. In the case of general electronic components a working frequency is low. But in this paper the vehicle cluster works 75MHz in the main clock frequency, becoming weak by noise because of being attached in TFT LCD. As the outer case installed in the vehicle is made up of plastic materials, the noise is radiated if not protecting noise in the PCB itself. Therefore, This paper will explain the theoretical basis and propriety with respect to the discussion and need about the guide for PCB design considering EMC, through the reduction of PCB noise.