• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.1
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• pp.17-28
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• 2012

In this study, we suggest a method for material property evaluation by dual-triangular pyramidal indenters using the reverse analysis. First, we demonstrated that load-displacement curves of conical and triangular pyramidal indenters are different for the same material. For this reason, an independent research on the triangular pyramidal indenter is needed. From FE indentation analyses on various materials, we then investigated the relationships among material properties, indentation parameters and load-displacement curves. From this, we established property evaluation formula using dual-triangular pyramidal indenters having two different half-included-angles. The approach provides the values of elastic modulus, yield strength and strain-hardening exponent within an average error of 3% for various materials.

• Journal of Mushroom
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• v.9 no.3
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• pp.96-100
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• 2011

MST247ns(Hwaseong #2) was developed by the method of Di-mon mating between monokaryotic strains derived from "Hwaseong #1" and dikaryotic strain "Suhan #1". The optimum temperature of mycelial growth was $25-30^{\circ}C$. The optimum temperature of primordia formation and fruiting body development were $8-15^{\circ}C$ and $9-14^{\circ}C$. Days of primordia formation were 4-5 days later Suhan #1. The stipes were longer than "Suhan #1". The surfaces of stipe were white and the tissues got harder and more elastic. Therefore, the management of growth environment under low temperatures was relatively easy and storability got much better.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.9
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• pp.877-880
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• 2009

A curing process in post-printing section of R2R process is required for an electrical property of the printed pattern when devices such as RFID, Solar cell are printed. PEN as well as heat-stabilized PET which is used as a plastic substrate would be deformed at high temperature due to change of its elastic modulus. And crack in the printed pattern, which is on the plastic substrate is occurred due to the deformation of the substrate. The occurrence of crack causes electrical resistance to increase and the quality of the device to deteriorate. In case of RFID antenna, the range of reading distance is shortened as the electrical resistance of the antenna is increased. Therefore, the deformation of the plastic substrate, which causes the occurrence of crack, should be minimized by setting up low operating tension in R2R process. In low tension, slippage between a moving substrate and a roller would be generated when the operating speed is increased. And scratch would be occurred when slippage is generated due to an air entrainment, which is related to the thickness of the air film. The thickness of the air film is increased when operating speed is increased as shown by simulation based on mathematical model. The occurrence of scratch in conductive pattern printed by roll to roll process is a critical damage because it causes degradation or failure of electrical property of it.

• Nuclear Engineering and Technology
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• v.49 no.4
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• pp.744-751
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• 2017

The fatigue crack propagation behaviors of Z3CN20.09M duplex stainless steel (DSS) were investigated by studying oxide films of specimens tested in $290^{\circ}C$ water and air. The results indicate that a full oxide film that consisted of oxides and hydroxides was formed in $290^{\circ}C$ water. By contrast, only a half-baked oxide film consisting of oxides was formed in $290^{\circ}C$ air. Both environments are able to deteriorate the elastic modulus and hardness of the oxide films, especially the $290^{\circ}C$ water. The fatigue lives of the specimens tested in $290^{\circ}C$ air were about twice of those tested in $290^{\circ}C$ water at all strain amplitudes. Moreover, the crack propagation rates of the specimen tested in $290^{\circ}C$ water were confirmed to be faster than those tested in $290^{\circ}C$ air, which was thought to be due to the deteriorative strength of the oxide films induced by the mutual promotion of oxidation and crack propagation at the crack tip. It is noteworthy that the crack propagation can be postponed by the ferrite phase in the DSS, especially when the specimens were tested in $290^{\circ}C$ water.

• Magazine of the Korea Concrete Institute
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• v.8 no.6
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• pp.223-234
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• 1996

The purpose of this paper is to present an analysis method by using the finite element method which can exactly analyze load-deflection relationships, crack propagations. and stresses and strains of reinforcements, tendons, and concrete in behaviors of elastic. inelastic and ultimate ranges of reinforced and prestressed concrete slabs under monotonically increasing loads. For t h i s purpose, the m a t e r i a l and geometric nonlinearities are taken into account in this study. The total Lagrangian formulation based upon the simplified Von Karman strain expressions is used to take into account the geometric nonlinearities of the structure. The material nonlinearities are taken into account by comprising the tension, compression. and shear models of cracked concrete and models for reinforcements and tendons in the concrete : and also a so-called smeared crack model is incorporated. The reinforcements and t,endons are assumed to be in a uniaxial stress state and are modelled as smeared layers of equivalent thickness. For the verification of application and validity of the method proposed in this paper, several numerical examples are analyzcd and compared with experimental results. As a result, this method can successfully predict the nonlinear and inelastic behaviors throughout the fracture of reinforced and prestressed concrete slabs.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.35-45
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• 2002

The stresses of the underfill/chip interface due to thermal loading was studied using the finite element method. At first, the effective properties of underfill for several volume fractions of silica particles were calculated by Mori-Tanaka method for three different material sets, and the parameters of singularity for the bimaterial edge and the bimaterial wedge were calculated. Consequently, the stresses at the underfill/chip interface with volume fraction of silica particles were investigated. Five different geometric models of flip-chip assembly involving two kinds of bimaterial strips and three kinds of three-layer models were considered under the assumption that the underfill is homogeneous. It was assumed that all components of the flip-chip assembly were linear elastic and isotropic, and their properties were temperature independent. The analysis was conducted in the context of the uncoupled plane thermo-elasticity under a plane strain assumption.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 2005.10a
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• pp.283-288
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• 2005

Application of semiconductor sensors has widely spreaded into various industries because those have several merits like easy miniaturization and batch production comparison with previous mechanical sensors. But external conditions such as thermal and repetitive load have a bad effect on sensors's lifetime. Especially, this paper was focused on fatigue life of a interconnect made by various materials. Firstly we implemented the stress analysis for interconnect under thermal load and wording pressure. And the fatigue lifetime of each material was induced by Manson & Coffin Equation using the plastic stress-strain curve obtained by the plastic-elastic Finite Element Analysis.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.2
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• pp.121-127
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• 2014

An atomistic-based finite bond element model for predicting the tearing mode (mode III) fracture of a single-layer graphene sheet (SLGS) is developed. The model uses the modified Morse potential for predicting the maximum strain relationship of graphene sheets. The mode III fracture of graphene under out-of-plane shear loading is investigated with extensive molecular mechanics simulations. Molecular mechanics is used for describing the displacements of atoms in the area near a crack tip, and linear elastic fracture mechanics is used outside this area. This work shows that the molecular mechanics method can provide a reliable and yet simple method for determining not only the shear properties of SLGS but also its mode III fracture toughness in the armchair and the zigzag directions; the determined mode III fracture toughness values of SLGS are $0.86MPa{\sqrt{m}}$ and $0.93MPa{\sqrt{m}}$, respectively.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.12
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• pp.1503-1512
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• 2013

In this study, we proposed an indentation evaluation method for fracture toughness using cohesive finite element simulations. First, we examined the effect of material properties (yield strain, Poisson's ratio, and elastic modulus) on crack size during Vickers indentation and then generated a regression formula that explains the relations among fracture toughness, indentation load, and crack size. We also proposed another indentation formula for fracture toughness evaluation using the contact size a and E/H (H: hardness). Finally, we examined the relation between the crack size and the indenter shapes. Based on this, we can generate from the formula obtained using the Vickers indenter a formula for an indenter of different shapes. Using the proposed method, fracture toughness is directly estimated from indentation data.

• Journal of the Earthquake Engineering Society of Korea
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• v.7 no.4
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• pp.1-13
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• 2003

For spatial free vibration of non-symmetric thin-walled curved beams with shear deformation, an improved formulation is proposed in the present study. The elastic strain and the kinetic energies are first derived by considering constant curvature and shear deformation effects due to shear forces and restrained warping torsion. Next equilibrium equations and force-deformation relations are obtained using a stationary condition of total potential energy. And the finite element procedures are developed by using isoparametric curved beam element with arbitray thin-walled sections. Particularly not only shear deformation and thickness-curvature effects on vibration behaviors of curved beams but also mode transition and crossover phenomena with change in curvatures of beams are parametrically investigated. In order to illustrate the accuracy and the reliability of this study, various numerical solutions for spatial free vibration are compared with results by available references and ABAQUS's shell element.