• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.334-336
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• 2009

An elastic-plasticity model during the austenitic decomposition was derived and implemented to incorporate the two important deformation behaviors observed during the phase transformations: the volumetric strain and transformation induced plasticity due to the temperature change and phase transformation. To obtain transformed phase volume fractions during cooling, the fourth order Runge-Kutta method was used to solve the Kirkaldy's phase kinetics model which is function of temperature, austenitic grain size and chemical composition. The volumetric strain was calculated by considering the densities of constituent phases, while the transformation induced plasticity was based on the micro-plasticity due to the volume mismatch between soft austenitic phase and other harder phases. The constitutive equations were implemented into the implicit finite element software and a simple boundary value problem was chosen as a model problem to validate the effect of transformation plasticity on the deformation behavior of steel under cooling from high temperature. It was preliminary concluded that the transformation plasticity plays a critical role in relaxing the developed stress during forming and thus reducing the magnitude of springback.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.10a
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• pp.10-14
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• 2002

Structural behavior of high-pressure composite vessels of TYPE 3 (full-wrapped over a seamless aluminum liner) was studied through numerical simulations based on 3D nonlinear finite element method. Under high-pressure loading, a TYPE 3 composite vessel shows material nonlinearity due to elastic-plastic deformation of aluminum liner, and mismatch of deformation at the junction of cylinder and dome causes geometrical nonlinearity. Finite element modeling and analysis technique considering this nonlinearity was presented, and a pressure vessel of 6.8L of internal volume was analyzed. Design specification to satisfy requirements was determined based on analysis results.

• Nuclear Engineering and Technology
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• v.52 no.12
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• pp.2949-2957
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• 2020

Fatigue crack growth model has been developed for dissimilar metal weld joints of a piping component under cyclic loading, where in the crack is located at the center of the weld in the circumferential direction. The fracture parameter, Stress Intensity Factor (SIF) has been computed by using principle of superposition as K_H + K_M. K_H is evaluated by assuming that, the complete specimen is made of the material containing the notch location. In second stage, the stress field ahead of the crack tip, accounting for the strength mismatch, the applied load and geometry has been characterized to evaluate SIF (K_M). For each incremental crack depth, stress field ahead of the crack tip has been quantified by using J-integral (elastic), mismatch ratio, plastic interaction factor and stress parallel to the crack surface. The associated constants for evaluation of K_M have been computed by using the quantified stress field with respect to the distance from the crack tip. Net SIF (K_H + K_M) computed, has been used for the crack growth analysis and remaining life prediction by Paris crack growth model. To validate the model, SIF and remaining life has been predicted for a pipe made up of (i) SA312 Type 304LN austenitic stainless steel and SA508 Gr. 3 Cl. 1. Low alloy carbon steel (ii) welded SA312 Type 304LN austenitic stainless-steel pipe. From the studies, it is observed that the model could predict the remaining life of DMWJ piping components with a maximum difference of 15% compared to experimental observations.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2004.05a
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• pp.70-73
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• 2004

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics (Al$_2$O$_3$-SiO$_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a Cu/Al$_2$O$_3$-SiO$_2$ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.308-312
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• 2003

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics ($Al_2O_3-SiO_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a $Cu/Al_2O_3-SiO_2$ ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.1
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• pp.17-22
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• 2016

Flexible organic light-emitting diode (OLED) devices consist of multi-stacked thin films or layers comprising organic and inorganic materials. Due to thermal coefficient mismatch of the multi-layer films, warpage of the flexible OLED is generated during high temperature process of each layer. This warpage will create the critical issues for next production process, consequently lowering the production yield and reliability of the flexible OLED. In this study, we investigate the warpage behavior of the flexible OLED for each bonding process step of the multi-layer films using the experimental and numerical analysis. It is found that the polarizer film and barrier film show significant impact on warpage of flexible OLED, while the impact of the OCA film on warpage is negligible. The material that has the most dominant impact on the warpage is a plastic cover. In order to minimize the warpage of the flexible OLED, we estimate the optimal material properties of the plastic cover using design of experiment. It is found that the warpage of the flexible OLED is reduced to less than 1 mm using a cover plastic of optimized properties which are the elastic modulus of 4.2 GPa and thermal expansion coefficient of $20ppm/^{\circ}C$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.2
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• pp.187-194
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• 2012

The strength of particle-reinforced metal matrix composites is, in general, known to be increased by the geometrically necessary dislocations punched around a particle that form during cooling after consolidation because of coefficient of thermal expansion (CTE) mismatch between the particle and the matrix. An additional strength increase may also be observed, since another type of geometrically necessary dislocation can be formed during extensive deformation as a result of the strain gradient plasticity due to the elastic-plastic mismatch between the particle and the matrix. In this paper, the magnitudes of these two types of dislocations are calculated based on the dislocation plasticity. The dislocations are then converted to the respective strengths and allocated hierarchically to the matrix around the particle in the axisymmetric finite-element unit cell model. The proposed method is shown to be very effective by performing finite-element strength analysis of $SiC_p$/Al2124-T4 composites that included ductile failure in the matrix and particlematrix decohesion. The predicted results for different particle sizes and volume fractions show that the length scale effect of the particle size obviously affects the strength and failure behavior of the particle-reinforced metal matrix composites.