• 한국세라믹학회지
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• 제32권1호
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• pp.106-112
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• 1995

In order to examine the effect of CuO and Al2O3 addition on the electrical conductivity of ZnO, both Al2O3 (0, 1, 2, 5, 10at.%) and CuO (1, 5at.%) were added to ZnO. Al2O3 addition (~2at.% Al) increased the total electrical conductivity of ZnO which was already decreased by CuO doping effect Above solid solubility of Al (~2at.%), ZnAl2O4 formed and the total electrical conductivity decreased due to the decrease of sintered density. Impedance measurements were used to know the reason and degree of contribution of three resistive elements, ZnO grain, ZnO/CuO, and ZnO/ZnO grain boundaries, to the total electrical conductivity changed.

• 한국주조공학회지
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• 제35권4호
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• pp.67-74
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• 2015

In this study, Mg-Zn alloys are investigated in terms of their thermal properties after an addition of Cu. Al element is added to improve the mechanical properties and castability in general case. However, it was excluded here because it significantly decreases the thermal conductivity. On the other hand, Zn was added as a major element, which had less influence on reducing the conductivity and can complement the mechanical properties as well. Cu was also added, and it improved the heat transfer characteristics as the amount was increased. The composition ranges of Zn and Cu are 6 wt.% and 0~1.5 wt.%, respectively. Mg-6Zn-xCu alloy was prepared by a gravity casting method using a steel mold and then the thermal conductivity and the microstructure of the as-cast material were investigated. By measuring the density_(${\rho}$), specific heat_(Cp) and thermal diffusivity_(${\alpha}$), the thermal conductivity_(${\lambda}$) was calculated by the equation ${\lambda}={\rho}{\cdot}Cp{\cdot}{\alpha}$. As the amount of Cu increased in the Mg-6Zn-xCu alloy, the heat transfer characteristics were improved, resulting in a synergistic effect which is slow when the added Cu exceeds 1 wt.%. In order to investigate the relative thermal conductivity/emission of the Mg-6Zn-xCu alloy, AZ91 and AZ31 were experimentally evaluated and compared using a separate test equipment. As a result, the Mg-6Zn-1.5Cu alloy when compared to AZ91 showed improvements in the thermal conductivity ranging from 30 to 60% with a nearly 20% improvement in the thermal emission.

• 한국주조공학회지
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• 제34권3호
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• pp.100-106
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• 2014

In recent years, Mg and its alloys have attracted a great deal of attention due to their low density, relatively excellent castability, and straightforward recyclability. Mg alloys have been widely applied to various industrial fields, and are representatively used in automotive and electronic parts. According to previous researches, the electrical conductivity of Mg alloys greatly decreases with increasing Al content. However, with the addition of Zn and/or Cu, the electrical conductivity of Mg alloys is maintained or slightly increased, and improved mechanical properties are obtained as well. On this basis, Mg-Zn-Cu alloys have been investigated in the present study with a focus on the effect of adding Zn and Cu on the electrical conductivity. The Zn and Cu contents ranged from 4 to 6wt.% and 0 to 1.5wt.%, respectively. Ternary Mg-Zn-Cu alloys have been prepared by gravity casting in a steel mold. In the as-casting condition, the electrical conductivity of Mg-Zn-Cu alloys showed a linear increasing trend with decreasing Zn and increasing Cu contents. Furthermore, impact values of Zn = -1.5 and Cu = 2.5 were determined for these alloys by electrical conductivity tests.

• Journal of Welding and Joining
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• 제23권6호
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• pp.93-98
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• 2005

The purpose of this study is to investigate the characteristics of pb-free $Zn-(3\~6)\%Al-(1\~6)\%Cu$ solder alloys for ultra high temperature(>573K) which applied to air craft, space satellite, automotive, oil, gas well exploration and data logging of geo-thermal wells. Melting range, solderability, electric resistivity, microstructure and mechanical properties were examined with solder alloys casted in Ar gas atmosphere. $Zn-4\%Al-(1\~3)\%Cu,\;Zn-5\%Al-(2\~4)\%Cu\;and\;Zn-6\%Al-(3\~5)\%Cu$ alloys satisfied the optimum melting range of 643 to 673k for ultra high temperature solder. A melting temperature increased with increasing Cu content, but decreased with increasing Al content. The spreadability was improved with increasing hi content. But the content of Cu had no effect on the spreadability. The electric resistivity was lowered with increasing Al and decreasing Cu content. In all Zn-Al-Cu solder alloys, primary dendritic $\varepsilon$ phase(Zn-Cu), dendritic $\eta$ phase(Zn-Cu-Al), $\alpha(Al-Zn)-\eta$ eutectic and eutectoid phase were observed. The addition of Al increased the volume fraction of eutectic and eutectoid phase and it decreased f phases. Also, the addition of Cu increased slightly the volume fraction of e, the eutectic and eutectoid phases. With increasing total content of Al and Cu, a hardness and a tensile strength were linearly increased, but anelongation was linearly decreased.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 추계학술발표대회 개요집
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• pp.219-221
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• 2005

Sn-9Zn solder balls were bonded to Cu, ENIG (Electroless Nickel/Immersion Gold) and electrolytic Au/Ni pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Au/Ni/Cu substrate, an $AuZn_{3}$ IMC layer formed at the interface due to the fast reaction between Au and Zn. In addition, the $AuZn_{3}$ IMC layer became detached from the interface after reflow. When the aging time was extended to 100 h, $Ni_{5}Zn_{21}$ IMC was observed on the Ni substrate.

• 한국재료학회지
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• 제5권6호
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• pp.682-689
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• 1995

Mg-Zn합금계의 입자미세화를 위하여 0.5-6 wt.% 조성범위의 Cu 및 Si를 첨가하였다. 합 잉곳트는 4 $\times$ $10^{-4}$ Torr의 진공의 BN을 내벽에 바른 석영관내에서 제조하였다. 제조된 합금을 435$^{\circ}C$에서 8시간 용체화처리한 후 결정립크기와 경도를 측정하였다. 측정결과 Mg-6wt.%Zn합금의 입자미세효과는 Cu가 2wt.%첨가될때, Si은 1.5wt.%가 첨가될 때가 최적의 조건이었다. Mg-6wt.% Zn과 Mg-6wt.%Zn-2wt.%Cu 및 Mg-6wt.%Zn-1.5wt.%Si합금을 시효열처리하여 시효거동을 조사하였다. 입자미세화에 의한 경도증가효과는 Mg-Zn-Cu합금계에서 크게 나타났으며 시효에 의한 경도증가 효과는 Mg-Zn-또합금계에서 크게 나타났다.

• 한국재료학회지
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• 제13권8호
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• pp.503-508
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• 2003

The purpose of this study is to investigate the effect of $V_2$$O_{5}$ addition on the Ag and Cu precipitation in the NiCuZn ferrite layers of 7.7${\times}$4.5${\times}$1.0 mm sized multi-layer chip inductors prepared by the screen printing method using 0∼0.5 wt% $V_2$$O_{5}$ -doped ferrite pastes. With increasing the $V_2$$O_{5}$ content and sintering temperature, Ag and Cu oxide coprecipitated more and more at the polished surface of ferrite layers during re-annealing at $840^{\circ}C$. It was thought that during the sintering process, V dissolved in the NiCuZn ferrite lattice and the Ag-Cu liquid phase of low melting point was formed in the ferrite layers due to the Cu segregation from the ferrite lattice and Ag diffusion from the internal electrode. During re-annealing at $840^{\circ}C$, the Ag-Cu liquid phase came out the polished surface of ferrite layers, and was decomposed into the isolated Ag particles and the Cu oxide phase during the cooling process.

• 한국양식학회지
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• 제11권3호
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• pp.311-317
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• 1998

Estradiol-17${\beta}$($E_2$)에 의한 Vitellogenin (VTG) 함성에 미치는 Cu 및 Zn의 영향을 무지개송어의 배양 간세포를 이용하여 조사하였다. 간세포는 2일간 배양 한 후, E하(2) ($2{\times}10^6$ M)와 동시에 Cu ($2{\times}10^{-5}$~$10^{-4}$M) 또는 Zn ($10^{-5}$~$10^{-3}$M)을 배양액에 첨가하여 5일간 배양하였다. VTG 합성률은 총 단백질에 대한 VTG의 배율로 나타내었다. CU 및 Zn의 첨가는 배양 간세포의 생존율에는 영향을 미치지 않았다. 그러나, Cu의 첨가에 사용된 모든 농도에서, Zn의 첨가에는 농도 의존적으로 감소하여(10^{-3}$M에서 유의하게 감소하였다. 이러한 감소는, Zn의 제거시에는 회복되었으나, Cu에서는 회복되지 않았다. 그리고, Cu (10^{-4}$M의 첨가 시에 Ca (1.8 mM) 농도를 2.5 및 5.0 mM로 증가시켜도 Cu의 작용을 저해하지 못하였다. 이러한 결과로 보아, Cu 및 Zn은 간세포에서 합성되는 다른 단백질 보다 VTG 합성에 더 깊이 관여하는 것으로 추정된다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2008년도 하계종합학술대회
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• pp.495-496
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• 2008

The magnetic characteristics of Mg-Zn ferrite that was fired at $1150^{\circ}C$ for 1hour and sintered at $1250^{\circ}C$ for 3hours was examined. The composition ratio of the ferrite was changed after sintering. In that case the composition ratio of ${Fe_2}{O_3}$ was increased but that of CuO was decreased. When the addition quantity of CuO was 3.8 mole%, it's shrinkage rate had maximum value. Magnetic permeability was decreased as the addition rate of CuO was increased and MgO was decreased. When the composition rate of CuO was 2.3 mol% and MgO was 10.9 mol%, the firing density had maximum value. In case that CuO was 2.8mol% and MgO was 10.4mol%, PL had minimum value.

• 한국재료학회지
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• 제27권3호
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• pp.172-178
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• 2017

The aim of this study is to consider the effect hydrogen on dezincification behavior of Cu-Zn alloys. The investigations include microstructural observations with scanning electron microscope and chemical composition analysis with energy dispersive spectrometer. The dezincification layer was found to occur in high pressure hydrogen atmosphere, not in air atmosphere. In addition, the layers penetrated into the inner side along the grain boundaries in the case of hydrogen condition. The shape of the dezincification layers was porous because of Zn dissolution from the ${\alpha}$ or ${\beta}$ phase. In the case of stress corrosion cracks formed in the Cu-Zn microstructure, the dezincification phenomenon with porous voids was also accompanied by grain boundary cracking.