• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.5
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• pp.601-608
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• 2014

In this study we propose an image denoising algorithm appropriate for mobile smart phone equipped with limited computing ability, which has better performance and at the same time comparable quality comparing with previous studies. The proposed image denoising algorithm for mobile smart phone cameras in low level light environment reduces computational complexity and also prevents edge smoothing by extracting just Gaussian noises from the noisy input image. According to the experiment result, we verified that our algorithm has much better PSNR value than methods applying mean filter or median filter. Also the result image from our algorithm has better clear quality since it preserves edges while smoothing input image. Moreover, the suggested algorithm reduces computational complexity about 52% compared to the method applying original Laplacian mask computation, and we verified that our algorithm has good denoising quality by implementing the algorithm in Android smart phone.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.9
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• pp.1786-1792
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• 2007

In this paper, we proposed a recognition system for resident registration cards using ART-1 and PCA algorithm. To extract registration numbers and issue date, Sobel mask and median filter are applied first and noise removal follows. From the noise-removed image, horizontal smearing is used to extract the regions, which are binarized with recursive binarization algorithm. After that vortical smearing is applied to restore corrupted lesions, which are mainly due to the horizontal smearing. from the restored image, areas of individual codes are extracted using 4-directional edge following algorithm and face area is extracted by the morphologic characteristics of a registration card. Extracted codes are recognized using ART-1 algorithm and PCA algorithm is used to verify the face. When the proposed method was applied to 25 real registration card images, 323 characters from 325 registration numbers and 166 characters from 167 issue date numbers, were correctly recognized. The verification test with 25 forged images showed that the proposed verification algorithm is robust to detect forgery.

• Journal of Platform Technology
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• v.10 no.3
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• pp.44-50
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• 2022

Research on facial age estimation is being actively conducted because it is used in various application fields. Facial images taken in various environments often have occlusions, and there is a problem in that performance of age estimation is degraded. Therefore, we propose age estimation method by creating an occluded part using image extrapolation technology to improve the age estimation performance of an occluded face image. In order to confirm the effect of occlusion in the image on the age estimation performance, an image with occlusion is generated using a mask image. The occluded part of facial image is restored using SpiralNet, which is one of the image extrapolation techniques, and it is a method to create an occluded part while crossing the edge of an image. Experimental results show that age estimation performance of occluded facial image is significantly degraded. It was confirmed that the age estimation performance is improved when using a face image with reconstructed occlusions using SpiralNet by experiments.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2021.05a
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• pp.213-215
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• 2021

With the development of IoT technology, various technologies such as artificial intelligence and automation are being grafted into industrial sites, and accordingly, the importance of data processing is increasing. In particular, a system based on a digital image may cause a malfunction due to noise in the image due to a sensor defect or a communication environment problem. Therefore, research on image processing has been continued as a pre-processing process, and an effective noise reduction technique is required depending on the type of noise and the characteristics of the image. In this paper, we propose a modified spatial weight filter to protect edge components in the impulse noise reduction process. The proposed algorithm divides the filtering mask into four regions and calculates the standard deviation of each region. The final output was filtered by applying a spatial weight to the region with the lowest standard deviation value. Simulation was conducted to evaluate the performance of the proposed algorithm, and it showed superior impulse noise reduction performance compared to the existing method.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.6 no.8
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• pp.1365-1373
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• 2002

In this paper, we present two types of vision algorithm that mobile robot has CCD camera. for obstacle avoidance. This is simple algorithm that compare with grey level from input images. Also, The mobile robot depend on image processing and move command from PC host. we has been studied self controlled mobile robot system with CCD camera. This system consists of digital signal processor, step motor, RF module and CCD camera. we used wireless RF module for movable command transmitting between robot and host PC. This robot go straight until recognize obstacle from input image that preprocessed by edge detection, converting, thresholding. And it could avoid the obstacle when recognize obstacle by line histogram intensity. Host PC measurement wave from various line histogram each 20 pixel. This histogram is (x, y) value of pixel. For example, first line histogram intensity wave from (0, 0) to (0, 197) and last wave from (280, 0) to (2n, 197. So we find uniform wave region and nonuniform wave region. The period of uniform wave is obstacle region. we guess that algorithm is very useful about moving robot for obstacle avoidance.

• Korean Journal of Remote Sensing
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• v.31 no.2
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• pp.85-99
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• 2015

TDI CCD sensors are being used for most of the electro-optical camera mounted on the low earth orbit satellite to meet high performance requirements such as SNR and MTF. However, the CMOS sensors which have a lot of implementation advantages over the CCD, are being upgraded to have the TDI function. A few methods for improving the issue of motion blur which is apparent in the CMOS sensor than the CCD sensor, are being introduced. Each pixel can be divided into a few sub-pixels to be read more than once as is the same case with three or four phased CCDs. The fill factor can be reduced intentionally or even a kind of mask can also be implemented at the edge of pixels to reduce the blur. The motion blur can also be reduced in the TDI CMOS sensor by reducing the integration time from the full line scan time. Because the integration time can be controlled easily by the versatile control electronics, one of two performance parameters, MTF and SNR, can be concentrated dynamically depending on the aim of target imaging. MATLAB simulation has been performed and the results are presented in this paper. The goal of the simulation is to compare dynamic MTFs affected by the different methods for reducing the motion blur in the TDI CMOS sensor.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.81.2-81.2
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• 2012

To fabricate a metal mold for injection molding, hot-embossing and imprinting process, mechanical machining, electro discharge machining (EDM), electrochemical machining (ECM), laser process and wet etching ($FeCl_3$ process) have been widely used. However it is hard to get precise structure with these processes. Electrochemical etching has been also employed to fabricate a micro structure in metal mold. A through mask electrochemical micro machining (TMEMM) is one of the electrochemical etching processes which can obtain finely precise structure. In this process, many parameters such as current density, process time, temperature of electrolyte and distance between electrodes should be controlled. Therefore, it is difficult to predict the result because it has low reliability and reproducibility. To improve it, we investigated this process numerically and experimentally. To search the relation between processing parameters and the results, we used finite element simulation and the commercial finite element method (FEM) software ANSYS was used to analyze the electric field. In this study, it was supposed that the anodic dissolution process is predicted depending on the current density which is one of major parameters with finite element method. In experiment, we used stainless steel (SS304) substrate with various sized square and circular array patterns as an anode and copper (Cu) plate as a cathode. A mixture of $H_2SO_4$, $H_3PO_4$ and DIW was used as an electrolyte. After electrochemical etching process, we compared the results of experiment and simulation. As a result, we got the current distribution in the electrolyte and line profile of current density of the patterns from simulation. And etching profile and surface morphologies were characterized by 3D-profiler(${\mu}$-surf, Nanofocus, Germany) and FE-SEM(S-4800, Hitachi, Japan) measurement. From comparison of these data, it was confirmed that current distribution and line profile of the patterns from simulation are similar to surface morphology and etching profile of the sample from the process, respectively. Then we concluded that current density is more concentrated at the edge of pattern and the depth of etched area is proportional to current density.

• Journal of the korean academy of Pediatric Dentistry
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• v.46 no.2
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• pp.209-218
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• 2019

This study was aimed to evaluate orofacial morphologies on the cases of developmental disorders of maxillary first molars. Panoramic radiographs, lateral cephalographs, and clinical photos of 2983 children who attended the Pediatric Dental Clinic of Pusan National University Dental Hospital from 2006 to August 2017 were assessed retrospectively. 34 patients were selected whose maxillary first molars were missed or developmentally delayed unilaterally or bilaterally. Demirjian's method was used for estimating dental age, then which was compared to chronologic age of children. Parameters expressing skeletal and dentoalveolar disharmony were checked and compared with control. Additionally, occlusion relationship was evaluated. Maxillary dental age was significantly delayed compared to chronologic age. Several parameters which show skeletal open-bite tendency and skeletal class III malocclusion with maxillary retrusion were statistically significant. Anterior crossbite and edge-bite were expected in most of these cases, but compensation by occlusion and soft tissue was also verified which might mask skeletal class III tendency. Congenital missed or developmentally delayed maxillary first molars might be related with declined growth of maxilla. If developmental disorders of maxillary first molars were verified during clinical examination, careful monitoring of orofacial growth was necessary during puberty and timed orthopedic and orthodontic intervention were considered.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.19-27
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• 2003

Surface finishes of PCB laminates are important in the solder joint reliability of flip chip package because the types and thicknesses of intermetallic compound(IMC), and compositions and hardness of solders are affected by them. In this study, effects of surface finishes of PCB on the low cycle fatigue resistance of Sn-based lead-free solders; Sn-3.5Ag, Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag-XBi(X=2.5, 7.5) and Sn-0.7Cu were investigated for the Cu and Au/Ni surface finish treatments. Displacement controlled room temperature lap shear fatigue tests showed that fatigue resistance of Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag and Sn-0.7Cu alloys were more or less the same each other but much better than that of Bi containing alloys regardless of the surface finish layer used. In general, solder joints on the Au/Ni finish showed better fatigue resistance than those on the Cu finish. Cross-sectional fractography revealed microcracks nucleation inside of the interfacial IMC near the solder mask edge, more frequently on the Cu than the Au/Ni surface finish. Macro cracks followed the solder/IMC interface in the Bi containing alloys, while they propagated in the solder matrix in other alloys. It was ascribed to the Bi segregation at the solder/IMC interface and the solid solution hardening effect of Bi in the $\beta-Sn$ matrix.