• 한국재료학회지
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• 제15권1호
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• pp.1-5
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• 2005

Copper-based leadframe sheets were immersed in two kinds of hot alkaline solutions to form brown-oxide or black-oxide layer on the surface. The oxide-coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched double-cantilever beam (SDCB) specimens. The SDCB specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under quasi-Mode I loading conditions. Fracture surfaces were analyzed by various equipment to investigate failure path. The present paper deals with the failure path, and the cause of the failure path formation with an adhesion model will be treated in the succeeding paper.

• 한국재료학회지
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• 제15권1호
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• pp.6-13
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• 2005

Copper based leadframe sheets were immersed in two kinds of hot alkaline solutions to form brown-oxide or blackoxide layer on the surface. The oxide-coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched double-cantilever beam (SDCB) specimens. The SDCB specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under quasi-Mode I loading conditions. After fracture toughness testing, the fracture surface were analyzed by various equipment to investigate failure path. An adhesion model was suggested to explain the failure path formation. The adhesion model is based on the strengthening mechanism of fiber-reinforced composite. The present paper deals with the introduction of the adhesion model. The explanation of the failure path with the proposed adhesion model was introduced in the companion paper.

• 유기물자원화
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• 제31권1호
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• pp.5-14
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• 2023

연구에서는 실리카/티타니아 코어/쉘(STCS) 물질을 기반으로 환원 및 에칭을 통해 근적외선 반사율을 향상시킬 수 있는 라이다 반사형 중공구조 검은색(B-HST) 물질을 제조하였다. 또한, 에칭 폐액을 수거 및 재활용하여 합성한 실리카(e-SiO₂) 물질을 반도체 에폭시 몰딩 컴파운드용(EMC) 필러 소재로서 응용하였다. 상세히는, 연속적인 졸-겔법, 환원법 및 초음파법을 통해 제조한 B-HST 물질은 높은 NIR 반사율(31.1%)과 실제 검은색 페인트와 유사한 명도(L^*=13.2)를 나타내었으며, 이를 통해 성공적으로 라이다에 인식될 수 있는 소재가 제조되었음을 확인하였다. 추가적으로, B-HST 물질의 합성 과정에서 코어 실리카를 에칭하여 추출한 실라놀 전구체를 포함하는 에칭 폐액을 수거한 뒤, 졸-겔법을 통해 균일한 필러용 실리카로 합성하였으며, 에폭시 고분자 및 카본블랙과의 혼합을 통해 반도체 패키지용 소재인 EMC로 제조하였다. 실험으로 제조된 EMC는 상용화된 EMC 제품과 유사한 물리적-화학적 특성을 나타냄을 확인할 수 있었다. 본 연구 결과를 통해 물질의 합성과 효과적인 재활용법의 설계를 통하여 4차 산업시대에 부합하는 고부가 가치 소재들인 자율주행차 차량용 검은색 물질과 반도체용 EMC 물질들을 성공적으로 제조하고 미래 산업에서의 응용 가능성에 대해 제시하였다.

• 한국표면공학회지
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• 제34권2호
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• pp.142-150
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• 2001

Due to naturally formed copper oxides, the adhesion strength between copper and epoxy resin is often very poor. To improve the adhesion strength between copper and epoxy resin, Cu-based leadframe sheets were oxidized in a brown-oxide forming solution. Then the effect of brown-oxide formation on the adhesion strength of leadframe to epoxy molding compound (EMC) was studied using pull-out specimens. After the pull-out test, fracture surfaces were analyzed using SEM, AES and EDS to determine failure path. The results showed that the failure path lay over inside the CuO and inside the EMC irrespective of the pull strength.

• 마이크로전자및패키징학회지
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• 제9권4호
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• pp.31-34
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• 2002

For the mold die sticking mechanism, the major explanation is that the silica as a filler in EMC (epoxy molding compound) wears die surface to be roughened, which results in increase of adhesion strength. As the sticking behavior, however, showed strong dependency on the EMC models based on the experimental results from different semiconductor manufacturers, chemisorption or acid-base interaction is apt to be also functioning as major mechanisms. In this investigation, the plasma source ion implantation (PSII) using $O_2, N_2$, and $CF_4$ modifies sample surface to form a new dense layer and improve surface hardness, and change metal surface condition from hydrophilic to hydrophobic or vice versa. Through surface energy quantification by measuring contact angle and surface ion coupling state analysis by Auger, major governing mechanism for sticking issue was figured out to be a complex of mechanical and chemical factors.

• 마이크로전자및패키징학회지
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• 제6권2호
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• pp.1-12
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• 1999

Brown oxide and/or black oxide layers were formed on the surface of Cu-based leadframe by chemical oxidation of leadframe in hot alkaline solutions, and their growth characteristics were studied. Then, to measure the adhesion strength between leadframe and epoxy molding compound (EMC), oxidized leadframe samples were molded with EMC and machined to form sandwiched double-cantilever beam (SDCB) specimens and pull-out specimens, respectively. Results showed that the adhesion strength of un-oxidized leadframe/EMC interface was inherently very poor but could be increased drastically with the nucleation of acicular CuO precipitates on the surface of leadframe. The presence of smooth faceted $Cu_2O $ on the surfaces of leadframe gave close to zero interfacial fracture toughness (Gc) and reasonable pull strength (PS). A direct correlation between Gc and PS showed that PS can be a measure of Gc only in a limited range.

• 한국표면공학회지
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• 제56권1호
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• pp.77-83
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• 2023

The reliability of leadframe-based semiconductor package depends on the adhesion between metal and epoxy molding compound (EMC). In this study, the Ag surface was electrochemically treated in a solution containing silanes in order to improve the adhesion between Ag and epoxy substrate. After electrochemical treatment, the thin silane layer was deposited on the Ag surface, whereby the peel strength between Ag and epoxy substrate was clearly improved. The improvement of peel strength depended on the functional group of silane, implying the chemical linkage between Ag and epoxy.

• 마이크로전자및패키징학회지
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• 제26권4호
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• pp.101-105
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• 2019

칩 패키지에는 생산 공정 및 운송, 보관 과정에서 발생하는 외부 환경 변화로부터 인쇄 회로 기판(printed circuit board, PCB)을 보호하기 위해 에폭시 몰딩(epoxy molding compound, EMC)이 사용된다. PCB와 EMC의 접합 신뢰성은 제품의 품질 및 수명에 중요한 요소이며 이를 보증하기 위해 제품 설계 및 생산 단계에서 그 접합 에너지를 정밀하게 측정하고, 이에 영향을 끼치는 요소를 통제하여 공정을 최적화 시켜야 한다. 본 논문은 이중 외팔보(double cantilever beam, DCB) 시험을 이용하여 휨(warpage)이 있는 칩 패키지의 EMC와 PCB의 계면 접합 에너지를 측정하고 보정하는 방법에 대해 소개한다. DCB 시험법은 이종 재료의 계면 접합 에너지를 측정하는 전통적인 방법이며 정밀한 접합 에너지 측정을 위해 평평한 기판이 필수적이다. 그러나 칩 패키지는 내부 구성 요소들의 열팽창 계수 차이로 인해 휨이 발생하기 때문에 평평한 기판을 제작하여 정밀한 접합 에너지를 측정하는데 어려움이 있다. 이를 극복하고자 본 연구에서는 휨이 있는 칩 패키지로 DCB 시험법을 위한 시편을 제작하고, 기판의 복원력을 보정하여 접합 에너지를 계산하였다. 보정된 접합에너지는 동일 조건에서 제작된 칩 패키지 중 휨이 없는 시편을 선별하여 측정한 접합 에너지와 비교, 검증하였다.

• E2M - 전기 전자와 첨단 소재
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• 제10권6호
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• 마이크로전자및패키징학회지
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• 제22권2호
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• pp.61-68
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• 2015

박형 package-on-package의 상부 패키지와 하부 패키지에 대하여 에폭시 몰딩 컴파운드(EMC)에 따른 warpage 특성을 분석하였다. 또한 동일한 EMC로 몰딩한 패키지들의 warpage 편차를 측정하고 박형 상부 기판과 하부 기판 자체의 warpage 편차를 측정함으로서, 박형 패키지에서 warpage 편차를 유발하는 원인을 분석하였다. 박형 기판을 사용한 상부 및 하부 패키지에서는 기판 자체의 큰 warpage 편차에 기인하여 EMC의 물성이 패키지의 warpage에 미치는 영향을 규명하는 것이 어려웠다. EMC의 몰딩 면적이 $13mm{\times}13mm$로 기판($14mm{\times}14mm$)의 대부분을 차지하는 상부 패키지에서는 온도에 따른 warpage의 변화 거동이 유사하였다. 반면에 EMC의 몰딩 면적이 $8mm{\times}8mm$인 하부 패키지의 경우에는 (+) warpage와 (-) warpage가 한 시편에 모두 존재하는 복합적인 warpage 거동에 기인하여 동일한 EMC로 몰딩한 패키지들에서도 상이한 온도-warpage 거동이 측정되었다.