• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.77-77
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• 2000

Titanium oxide (TiO2) thin films have valuable properties such as a high refractive index, excellent transmittance in the visible and near-IR frequency, and high chemical stability. Therefore it is extensively used in anti-reflection coating, sensor, and photocatalysis as electrical and optical applications. Specially, TiO2 have a high dielectric constant of 180 along the c axis and 90 along the a axis, so it is highlighted in fabricating dielectric capacitors in micro electronic devices. A variety of methods have been used to produce patterned self-assembled monolayers (SAMs), including microcontact printing ($\mu$CP), UV-photolithotgraphy, e-beam lithography, scanned-probe based micro-machining, and atom-lithography. Above all, thin film fabrication on $\mu$CP modified surface is a potentially low-cost, high-throughput method, because it does not require expensive photolithographic equipment, and it produce micrometer scale patterns in thin film materials. The patterned SAMs were used as thin resists, to transfer patterns onto thin films either by chemical etching or by selective deposition. In this study, we deposited TiO2 thin films on Si (1000 substrateds using titanium (IV) isopropoxide ([Ti(O(C3H7)4)] ; TIP as a single molecular precursor at deposition temperature in the range of 300-$700^{\circ}C$ without any carrier and bubbler gas. Crack-free, highly oriented TiO2 polycrystalline thin films with anatase phase and stoichimetric ratio of Ti and O were successfully deposited on Si(100) at temperature as low as 50$0^{\circ}C$. XRD and TED data showed that below 50$0^{\circ}C$, the TiO2 thin films were dominantly grown on Si(100) surfaces in the [211] direction, whereas with increasing the deposition temperature to $700^{\circ}C$, the main films growth direction was changed to be [200]. Two distinct growth behaviors were observed from the Arhenius plots. In addition to deposition of THe TiO2 thin films on Si(100) substrates, patterning of TiO2 thin films was also performed at grown temperature in the range of 300-50$0^{\circ}C$ by MOCVD onto the Si(100) substrates of which surface was modified by organic thin film template. The organic thin film of SAm is obtained by the $\mu$CP method. Alpha-step profile and optical microscope images showed that the boundaries between SAMs areas and selectively deposited TiO2 thin film areas are very definite and sharp. Capacitance - Voltage measurements made on TiO2 films gave a dielectric constant of 29, suggesting a possibility of electronic material applications.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.169-169
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• 2010

As display industry requires various applications for future display technology, which can guarantees high level of flexibility and transparency on display panel, oxide semiconductor materials are regarded as one of the best candidates. $InGaZnO_4$(IGZO) has gathered much attention as a post-transition metal oxide used in active layer in thin-film transistor. Due to its high mobility fabricated at low temperature fabrication process, which is proper for application to display backplanes and use in flexible and/or transparent electronics. Electrical performance of amorphous oxide semiconductors depends on the resistance of the interface between source/drain metal contact and active layer. It is also affected by sheet resistance on IGZO thin film. Controlling contact/sheet resistance has been a hot issue for improving electrical properties of AOS(Amorphous oxide semiconductor). To overcome this problem, post-annealing has been introduced. In other words, through post-annealing process, saturation mobility, on/off ratio, drain current of the device all increase. In this research, we studied on the relation between device's resistance and post-annealing temperature. So far as many post-annealing effects have been reported, this research especially analyzed the change of electrical properties by increasing post-annealing temperature. We fabricated 6 main samples. After a-IGZO deposition, Samples were post-annealed in 5 different temperatures; as-deposited, $100^{\circ}C$, $200^{\circ}C$, $300^{\circ}C$, $400^{\circ}C$ and $500^{\circ}C$. Metal deposition was done on these samples by using Mo through E-beam evaporation. For analysis, three analysis methods were used; IV-characteristics by probe station, surface roughness by AFM, metal oxidation by FE-SEM. Experimental results say that contact resistance increased because of the metal oxidation on metal contact and rough surface of a-IGZO layer. we can suggest some of the possible solutions to overcome resistance effect for the improvement of TFT electrical performances.

• 산업식품공학
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• 제14권1호
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• pp.49-53
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• 2010

표면 플라즈몬 공명을 이용한 센서는 굴절계 기기의 일종으로서 높은 감도를 가질 뿐만 아니라 비표지 방식이라는 장점을 가지고 있다. 본 연구에서는 재래식 SPR 칩을 이용하여 시판 술 4종의 알코올 함량을 측정하였다. 또한, 재래식 SPR 칩의 감도를 개선하기 위하여 금 박막 위에 금으로 나노형상을 구축하여 나노형상 SPR 칩을 제조하여 모형 술에 대한 감도 개선 효과를 분석하였다. 재래식 SPR 칩을 이용하여 시판 술의 알코올 함량을 측정하기 위한 검량선을 개발하였을 때 시료를 전처리 하지 않고 그대로 측정하였을 때 가장 좋은 검량선을 얻을 수 있었다. 소주, 청주, 이과두주, 탁주 등 시판 술 4종에 대한 1차 회귀식의 검량식에서 결정계수는 각각 0.992, 0.933, 0.918, 그리고 0.984로 나타났다. 한편, 재래식 SPR 칩의 감도를 개선하기 위해 나노형상 SPR 칩을 제조하기 위하여 Langmuir-Blodgett(LB) 방법을 활용하였다. 본 연구에서는 수십 nm 두께의 금 박막을 바닥층으로 하여 그 위에 나노 크기의 실리카 입자를 단분자 층으로 덮어 형틀을 제조하고 다시 그 위에 금을 증착한 후 실리카 입자를 제거하는 방법으로 나노형상을 갖는 SPR 칩을 제조하였다. 나노형상 SPR 칩의 성능을 평가하였을 때 20% 알코올 함량을 가지는 모형 술에 대해서 바닥층의 두께가 50 nm, 나노형상에서 골의 깊이가 20 nm, 나노형상의 배열주기가 300 nm일 때 SPR의 감도가 가장 좋아서 95%의 감도 향상을 얻을 수 있었다. SPR의 감도는 칩과 관련된 인자, 시료의 종류 및 상태에 따라 다르게 나타날 수 있으므로 측정 목적에 알맞은 칩의 설계와 선택이 요구된다.

• 한국전산구조공학회논문집
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• 제32권2호
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• pp.103-108
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• 2019

본 논문에서는 비평형 분자동역학 시뮬레이션 기법을 사용하여 알루미늄 박막과 실리콘 웨이퍼 간 열경계저항을 예측하였다. 실리콘의 끝 단 고온부에 열을 공급하고, 같은 양의 열을 알루미늄 끝 단 저온부에서 제거하여 경계면을 통한 열전달이 일어나도록 하였으며, 실리콘 내부와 알루미늄 내부의 선형 온도 변화를 계산함으로써 경계면에서의 온도 차이에 따른 열저항 값을 구하였다. 300K 온도에서 $5.13{\pm}0.17m^2{\cdot}K/GW$의 결과를 얻었으며, 이는 열유속 조건의 변화와 무관함을 확인하였다. 아울러, 펨토초 레이저 기반의 시간영역 열반사율 기법을 사용하여 열경계저항 값을 실험적으로 구하였으며, 시뮬레이션 결과와 비교 검증하였다. 전자빔 증착기를 사용하여 90nm 두께의 알루미늄 박막을 실리콘(100) 웨이퍼 표면에 증착하였으며, 유한차분법을 이용한 수치해석을 통해 열전도 방정식의 해를 구해 실험결과와 곡선맞춤 함으로써 열경계저항을 정량적으로 평가하고 나노스케일에서의 열전달 현상에 관한 특징을 살펴보았다.

• 대한금속재료학회지
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• 제46권11호
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• pp.762-769
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• 2008

Hydrogenated amorphous silicon(a-Si : H) layers, 120 nm and 50 nm in thickness, were deposited on 200 $nm-SiO_2$/single-Si substrates by inductively coupled plasma chemical vapor deposition(ICP-CVD). Subsequently, 30 nm-Ni layers were deposited by E-beam evaporation. Finally, 30 nm-Ni/120 nm a-Si : H/200 $nm-SiO_2$/single-Si and 30 nm-Ni/50 nm a-Si:H/200 $nm-SiO_2$/single-Si were prepared. The prepared samples were annealed by rapid thermal annealing(RTA) from $200^{\circ}C$ to $500^{\circ}C$ in $50^{\circ}C$ increments for 30 minute. A four-point tester, high resolution X-ray diffraction(HRXRD), field emission scanning electron microscopy (FE-SEM), transmission electron microscopy (TEM), and scanning probe microscopy(SPM) were used to examine the sheet resistance, phase transformation, in-plane microstructure, cross-sectional microstructure, and surface roughness, respectively. The nickel silicide on the 120 nm a-Si:H substrate showed high sheet resistance($470{\Omega}/{\Box}$) at T(temperature) < $450^{\circ}C$ and low sheet resistance ($70{\Omega}/{\Box}$) at T > $450^{\circ}C$. The high and low resistive regions contained ${\zeta}-Ni_2Si$ and NiSi, respectively. In case of microstructure showed mixed phase of nickel silicide and a-Si:H on the residual a-Si:H layer at T < $450^{\circ}C$ but no mixed phase and a residual a-Si:H layer at T > $450^{\circ}C$. The surface roughness matched the phase transformation according to the silicidation temperature. The nickel silicide on the 50 nm a-Si:H substrate had high sheet resistance(${\sim}1k{\Omega}/{\Box}$) at T < $400^{\circ}C$ and low sheet resistance ($100{\Omega}/{\Box}$) at T > $400^{\circ}C$. This was attributed to the formation of ${\delta}-Ni_2Si$ at T > $400^{\circ}C$ regardless of the siliciation temperature. An examination of the microstructure showed a region of nickel silicide at T < $400^{\circ}C$ that consisted of a mixed phase of nickel silicide and a-Si:H without a residual a-Si:H layer. The region at T > $400^{\circ}C$ showed crystalline nickel silicide without a mixed phase. The surface roughness remained constant regardless of the silicidation temperature. Our results suggest that a 50 nm a-Si:H nickel silicide layer is advantageous of the active layer of a thin film transistor(TFT) when applying a nano-thick layer with a constant sheet resistance, surface roughness, and ${\delta}-Ni_2Si$ temperatures > $400^{\circ}C$.

• 대한금속재료학회지
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• 제47권5호
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• pp.322-329
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• 2009

60 nm- and 20 nm-thick hydrogenated amorphous silicon (a-Si:H) layers were deposited on 200 nm $SiO_2/Si$ substrates using ICP-CVD (inductively coupled plasma chemical vapor deposition). A 10 nm-Ni layer was then deposited by e-beam evaporation. Finally, 10 nm-Ni/60 nm a-Si:H/200 nm-$SiO_2/Si$ and 10 nm-Ni/20 nm a-Si:H/200 nm-$SiO_2/Si$ structures were prepared. The samples were annealed by rapid thermal annealing for 40 seconds at $200{\sim}500^{\circ}C$ to produce $NiSi_x$. The resulting changes in sheet resistance, microstructure, phase, chemical composition and surface roughness were examined. The nickel silicide on a 60 nm a-Si:H substrate showed a low sheet resistance at T (temperatures) >$450^{\circ}C$. The nickel silicide on the 20 nm a-Si:H substrate showed a low sheet resistance at T > $300^{\circ}C$. HRXRD analysis revealed a phase transformation of the nickel silicide on a 60 nm a-Si:H substrate (${\delta}-Ni_2Si{\rightarrow}{\zeta}-Ni_2Si{\rightarrow}(NiSi+{\zeta}-Ni_2Si)$) at annealing temperatures of $300^{\circ}C{\rightarrow}400^{\circ}C{\rightarrow}500^{\circ}C$. The nickel silicide on the 20 nm a-Si:H substrate had a composition of ${\delta}-Ni_2Si$ with no secondary phases. Through FE-SEM and TEM analysis, the nickel silicide layer on the 60 nm a-Si:H substrate showed a 60 nm-thick silicide layer with a columnar shape, which contained both residual a-Si:H and $Ni_2Si$ layers, regardless of annealing temperatures. The nickel silicide on the 20 nm a-Si:H substrate had a uniform thickness of 40 nm with a columnar shape and no residual silicon. SPM analysis shows that the surface roughness was < 1.8 nm regardless of the a-Si:H-thickness. It was confirmed that the low temperature silicide process using a 20 nm a-Si:H substrate is more suitable for thin film transistor (TFT) active layer applications.

• 한국산학기술학회논문지
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• 제21권12호
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• pp.10-15
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• 2020

파장 400 nm 이하의 자외선은 눈 건강에 매우 해롭다. 또한 고에너지 가시광도 망막 세포에 영향을 줄 수 있음이 최근에 밝혀졌다. 따라서 자외선 및 고에너지 가시광 차단 기능의 안경렌즈 개발이 시대적으로 요청되고 있다. 본 연구에서는 m-자일릴렌 디이소시아네이트 모노머와 2,3-bis((2-mercaptoethyl)thio)-1-propanethiol 모노머 및 벤트리아졸 UV 흡수제, 알킬인산에스터 이형제, 안료혼합물(CI solvent violet 13), 이염화부틸주석 촉매제 등의 혼합물을 인젝션 몰드 방법으로 열중합 공정을 적용하여, 굴절률 1.67의 고굴절률 폴리머 안경렌즈를 제조하였다. 제조된 폴리머 안경렌즈의 양면에 전자빔 진공증착 시스템으로 다층 반사방지 코팅을 하였다. 제조된 안경렌즈의 자외선 및 고에너지 가시광 차단 기능을 UV-visible spectrophotometer로 분석하였다. 그 결과 UV 흡수제를 0.5wt% 첨가한 폴리머 안경렌즈가 411 nm 파장 이하의 자외선 및 고에너지 가시광을 99 % 이상 차단하였다. 또한 460 ~ 660 nm 파장의 명소시 시각 민감도 10% 이상의 영역에서 평균 투과율이 97.9%를 나타내어 명소시에서 선명한 상을 얻을 수 있었다.

• Nuclear Engineering and Technology
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• 제54권1호
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• pp.318-325
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• 2022

In this study, composites containing undoped and barium-doped Bi₂WO₆:Ba²⁺were investigated for their shielding against diagnostic X-ray. At first, Bi₂WO₆ and barium-doped Bi₂WO₆ were synthesized with different weight percentages of barium oxide through a hydrothermal process. The as-synthesized nanostructures were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDS) and Raman spectroscopy (RS). After that, some shields were generated with undoped and barium-doped Bi₂WO₆:Ba²⁺ nanostructure particles incorporated into polyvinyl chloride (PVC) polymer with different thicknesses and 15% weight of the nanostructure. Finally, the prepared samples were exposed to an X-ray tube at 40, 80, and 120 kV voltages, 10 mAs and, 44.5 cm SID (i.e. the distance from the X-ray beam source to the specimen). Linear and mass attenuation coefficients were also calculated for different samples. The results indicated that, among the samples, the one with 7.5 mmol barium-doped Bi₂WO₆ had the most attenuation at the voltage of 40kV, and the attenuation coefficients would increase with an increase in the amount of barium. The samples with 15 and 17.5 mmol barium-doped Bi₂WO₆ had higher attenuation than the others at 80 and 120 kV. Moreover, the half-value layer (HVL), tenth-value layer (TVL) and 0.25 mm lead equivalent thickness were calculated for all the samples. The lowest HVL value was for the sample with 7.5 mmol barium-doped Bi₂WO₆. As the result clearly show, an increment in the barium-doping content leads to a decrease in both HVL and TVL. In every three voltages, 0.25 mm lead equivalent thickness of the barium-doped composites (7.5 mmol and 15 mmol) had less than the other composites. The lowest value of 0.25 mm lead equivalent thickness was 7.5 barium-doped in 40 kV voltage and 15 mmol barium-doped in 80 kV and 120 kV voltages. These results were obtained only for 15% weight of the nanostructure.

• Nuclear Engineering and Technology
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• 제54권2호
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• pp.479-485
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• 2022

At the Korea Institute of Radiological and Medical Sciences, physical human phantoms were developed to evaluate various radiation protection quantities, based on the mesh-type reference computational phantoms of the International Commission on Radiological Protection. The physical human phantoms were fabricated such that a radiophotoluminescent glass dosimeter (RPLGD) with a Tin filter, namely GD-352M, could be inserted into them. A Tin filter is used to eliminate the overestimated signals in low-energy photons below 100 keV. The measurement uncertainty of the RPLGD reader system based on GD-352M should be analyzed for obtaining reliable protection quantities before using it for practical applications. Generally, the measurement uncertainty of RPLGD systems without Tin filters is analyzed for quality assurance of radiotherapy units using a high-energy photon beam. However, in this study, the measurement uncertainty of GD-352M was analyzed for evaluating the protection quantities. The measurement uncertainty factors in the RPLGD include the reference irradiation, regression curve, reproducibility, uniformity, energy dependence, and angular dependence, as described by the International Organization for Standardization (ISO). These factors were calculated using the Guide to the Expression of Uncertainty in Measurement method, applying ISO/ASTM standards 51261(2013), 51707(2015), and SS-ISO 22127(2019). The measurement uncertainties of the RPLGD reader system with a coverage factor of k = 2 were calculated to be 9.26% from 0.005 to 1 Gy and 8.16% from 1 to 10 Gy. A blind test was conducted to validate the RPLGD reader system, which demonstrated that the readout doses included blind doses of 0.1, 1, 2, and 5 Gy. Overall, the E_n values were considered satisfactory.

• 한국광학회지
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• 제34권2호
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• pp.53-60
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• 2023

193 nm에서 반도체 전공정 검사 장치에 적용될 수 있는 반사 굴절 혼합 형식(카타디옵트릭)의 수치 구경(numerical aperture, NA) 0.6 대물렌즈를 설계하였다. 200 nm 공간 분해능 및 0.15 mm 이상의 시야를 확보하기 위하여, 먼저 렌즈 전체 배치를 포커싱 렌즈 그룹, 필드 렌즈 그룹 및 NA 변환 그룹으로 구성하였으며, 선행 그룹에 포커싱된 빔의 수치 구경 값을 필요 값, 즉 0.6으로 변환하는 기능을 수행한다. 총 11매의 광학 소자로 구성된 최종 설계는 모든 관측 시야에 대하여 λ/80 이하의 RMS 파면 수차를 만족하였다. 또한 고분해능 대물렌즈의 높은 환경 민감도로 인한 온도 변화에 따른 광학계 성능 해석 결과, ±0.1 ℃의 온도 변화에서도 목표 성능 이하로의 성능 저하가 확인되어 온도 변화에 따른 광학 보상이 반드시 필요하였다. 이에 초점면 이동을 보상자로 적용할 경우, 20 ± 1.2 ℃까지 RMS 파면 수차 변화량이 λ/30 이하로 목표 성능을 만족하여 실제 반도체 공정 환경에서도 이용이 가능함을 확인하였다.