• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.23 no.1
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• pp.34-40
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• 2013

The 1st assessment(performance test) was applied to assure the floor impact sound performance for developing the dry double-floor with the change of rubber hardness of the upper panel's support and the ceiling structure of the sub-floor. Depends on the change of the rubber hardness in sub-structure, the heavy-weight sound impact value is improved up to 3 dB, and the light-weight sound impact value is moved up to 21 dB, comparing with the bare-slab. Also, the improved value for the floor impact sound conjugating with the sub-floor's ceiling was 5 dB. Based on this result, the 2nd assessment(performance test) was made the state that the rubber hardness of the sub-floor support was ranged between 50 and 70 for considering the stability of walking patients. In addition to this process, the assessment was carried out with a variety of ceiling structure applied to the dry double-floor structure with the air flow system on the sub-floor's ceiling. The result for the 2nd assessment proved that TYPEII-3 had the better sound reduction performance in the heavy-weight impact sound test than other types, and also for the light-weight impact sound TYPEII-3 had the 29 dB sound reduction performance overall. Henceforth, based on the result the research for the sound reduction performance from the floor impact sound shall be ongoing process as well as the development of a double-dry floor and a sound reduction ceiling to suitable on the field.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2012.10a
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• pp.280-285
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• 2012

The 1st assessment (performance test) was applied to assure the floor impact sound performance for developing the dry double- floor with the change of rubber hardness of the upper panel's support and the ceiling structure of the sub-floor. Depends on the change of the rubber hardness in substructure, the heavy-weight sound impact value is improved up to 3 dB, and the light-weight sound impact value is moved up to 21 dB, comparing with the bare-slab. Also, the improved value for the floor impact sound conjugating with the sub-floor's ceiling was 5dB. Based on this result, the 2nd assessment (performance test) was made the state that the rubber hardness of the sub-floor support was ranged between 50 and 70 for considering the stability of walking patients. In addition to this process, the assessment was carried out with a variety of ceiling structure applied to the dry doublefloor structure with the air flow system on the sub-floor's ceiling. The result for the 2nd assessment proved that TYPE-11 had the better sound reduction performance in the heavy-weight impact sound test than other types, and also for the light-weight impact sound TYPE-11 had the 29 dB sound reduction performance overall. Henceforth, based on the result the research for the sound reduction performance from the floor impact sound shall be ongoing process as well as the development of a double-dry floor and a sound reduction ceiling to suitable on the field.

• Korean Journal of Materials Research
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• v.13 no.4
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• pp.266-270
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• 2003

We studied BCl$_3$ dry etching of GaAs in a planar inductively coupled plasma system. The investigated process parameters were planar ICP source power, chamber pressure, RIE chuck power and gas flow rate. The ICP source power was varied from 0 to 500 W. Chamber pressure, RIE chuck power and gas flow rate were controlled from 5 to 15 mTorr, 0 to 150 W and 10 to 40 sccm, respectively. We found that a process condition at 20 sccm $BCl_3$ 300 W ICP, 100 W RIE and 7.5 mTorr chamber pressure gave an excellent etch result. The etched GaAs feature depicted extremely smooth surface (RMS roughness < 1 nm), vertical sidewall, relatively fast etch rate (> $3000\AA$/min) and good selectivity to a photoresist (> 3 : 1). XPS study indicated a very clean surface of the material after dry etching of GaAs. We also noticed that our planar ICP source was successfully ignited both with and without RIE chuck power, which was generally not the case with a typical cylindrical ICP source, where assistance of RIE chuck power was required for turning on a plasma and maintaining it. It demonstrated that the planar ICP source could be a very versatile tool for advanced dry etching of damage-sensitive compound semiconductors.

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.11a
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• pp.89-89
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• 1999

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.05a
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• pp.112-112
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• 2001

• Proceedings of the Korean Nuclear Society Conference
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• 2002.10a
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• pp.61.1-61
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• 2002

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.11a
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• pp.117-117
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• 1998

• Journal of environmental and Sanitary engineering
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• v.14 no.3
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• pp.116-122
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• 1999

The purpose of this study is to develop new process named "hydrogen peroxide dissolution method". This process used hydrogen peroxide, which is harmless to human body and oxidize molybdenum wire selectively.The advantages of hydrogen peroxide dissolution method were no discharge of noxious matter when dissolution of molybdenum wire which used as the center supporter, reactions occur in room temperature and easy to recover dissolved molybdenum. This study was aimed at gathering the basic data of molybdenum wire dissolution-recovery process and proposes the reaction condition of molybdenum wire dissolution-recovery process and the factors influencing those reactions. The results were as follows:1. In the dissolution of molybdenum wire, the early condition of reaction was $15^{\circ}C$, and the temperature condition of state was $32^{\circ}C$. 2. 1) In the GSL-60W type, P.W.(Piece weight) was 11.89mg, C.R. was $65.6\Omega$. 2) In the FL-20W type, P.W. was 11.60mg, C.R. was $4.6\Omega$. 3. The molybdenum of process water was treated of a precipitation after dry and after stagnation in the one day, the molybdenum of upper water was treated of precipitation after dry and after congelation.

• Transactions of the Korean hydrogen and new energy society
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• v.16 no.2
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• pp.150-158
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• 2005

Added ratio of 8YSZ powder and organic compounds (solvent, plasticizer, dispersant, binder) properly. It manufactured electrolysis membrane by wet process that make slurry and dry process that do not use organic compounds. In the case of wet process, harmony combination and method of organic compound are an importance element in slurry manufacture. This slurry did calcine at temperature of 140$^{\circ}C$ in Furnace and manufactured electrolyte disk by Dry pressing method. Like this, manufacturing disk sintered at temperature of $1300^{\circ}C,\;1400^{\circ},\;1500^{\circ}C$ in Furnace and completed electrolysis membrane. Confirmed change of crystal structure and decision form through analysis of density, SEM, XRD according to change of sintering temperature, and considered relation with ion conductivity.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.2
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• pp.330-337
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• 2001

Wire drawing process of the high carbon steel with a high speed is usually conducted at room temperature using a number of passes or reductions through consequently located dies. In multi-stage drawing process, temperature rise in each pass affects the mechanical properties of final product such as bend, twist and tensile strength. Also, this temperature rise during the deformation is the reason that the wire in drawing process is broken by the embrittlement due to rapid strain aging effect. This paper presents the estimation of the wire temperature for the multi-stage wire drawing process. Using the proposed calculation method of wire temperature, temperature rise at deformation zone as well as temperature drop in block considering the heat transfer between the block and wire were calculated. As these calculated wire temperatures were applied to the real industrial fields, it was known that the calculated results were in a good agreement with the measured wire temperature.