• Title/Summary/Keyword: Dry Film

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Effect of Removing P.E film-Mulch at Budding Stage of Tobacco on the Change of Moisture and Mineral Content in Plow Layer Soil and Nutrient Uptake. (생육중반기 피복제거가 작토층의 수분 및 무기성분 변화와 연초양분흡수에 미치는 영향)

  • 홍순달;이윤환;김재정;육창수
    • Journal of the Korean Society of Tobacco Science
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    • v.8 no.1
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    • pp.69-78
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    • 1986
  • This experiment was carried out to Investigate the environmental changes of rhizosphere, behavior of nutrient components in soul, and nutrients uptake and growth response of the tobacco plant in the condition that mulch as polyethylene film, had been removed on the ridge at the 50th day after transplanting in comparison with continuous mulching condition. The results obtained were as follows; 1. After rainfall, soil moisture content In the plow layer was greatly increased without mulch in comparison with that of the plot with mulch. As a result, leaf water potential of tobacco plant without mulch was higher than that with mulch. 2. Available nutrients such as $NH_4-N, \;NO_3-N$, and total salts in the plow layer of the plot without mulch tended to be Increased, and especially accumulated on the surface layer owing to the redistribution of soil water by rainfall during the latter growth stage after removing mulch. 3. Nutrients uptake by tobacco was much more enhanced in the plot without mulch and resulted in higher contents of total nitrogen, $NO_3-N, \;P_2O_5, \;and K_5O$ in the tobacco leaf Especially higher content of nitrogen caused the delay of maturity resulting In the increased of dry weight of top part of tobacco in the plot without mulch toned to be Increased in comparison with that in mulching condition. Content of total nitrogen, $NO_3-N$, and nicotine in flue-lured leaves was much higher in the plot without. mulch than in mulching condition, but lower content of reducing sugar in the plot without mulch resulted in lower quality of tobacco.

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The Planning of Temporary Housing for Post Application of Mega Sports Facilities - Focused on the 2018 Winter Olympics - (메가스포츠시설의 사후 활용을 위한 임시주거 계획 - 2018평창동계올림픽을 중심으로 -)

  • Lee, Jong-Chan;Kang, Youn-Do;Kim, Byung-Sean
    • KIEAE Journal
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    • v.16 no.4
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    • pp.41-46
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    • 2016
  • Purpose: This is a study on the planning of temporary housing for post application of Mega Sports facilities. The subject of the study is 2018 Pyeongchang Winter Olympics, which is to suggest building an alternative temporary housing using shipping containers(high cube), which solve the lack of accommodations and recycle temporary housing after Olympics, save money and be eco-friendly in Olympics. Method: This study includes this ; research on the a fact-finding survey about Mega sports facilities post application and demand survey on 2018 Pyeongchang Winter Olympics accomodations and an analysis about temporary housing plan. Furthermore we decided temporary housing building plan by analyzing residents' needs and traits of the housing etc. Through this, we made a schematic design for household units. Result: As a result, this study is a plan of making space, forms, and structure. The planned size is $38.4m^2$(L:12m, W:3.2m) except balcony, and indoor height is 2.5m. The space consists of entrance, bathroom, bedroom and living room with folding furniture system. Also there's a detailed floor plan of the ceiling, wall, and floor we drew up. The ceiling and wall consist of dampproof film, noncombustible board, fire proof urethane form, and color-designed sheet. The floor is composed of floor tile, cement mortar, light concrete(with heat coil), insulation, and dampproof film. Additionally, this study is a plan of interior dry wall with detail using modular construction method for work efficiency and quality improvement.

Types & Characteristics of Chemical Substances used in the LCD Panel Manufacturing Process (LCD 제조공정에서 사용되는 화학물질의 종류 및 특성)

  • Park, Seung-Hyun;Park, Hae Dong;Ro, Jiwon
    • Journal of Korean Society of Occupational and Environmental Hygiene
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    • v.29 no.3
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    • pp.310-321
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    • 2019
  • Objectives: The purpose of this study was to investigate types and characteristics of chemical substances used in LCD(Liquid crystal display) panel manufacturing process. Methods: The LCD panel manufacturing process is divided into the fabrication(fab) process and module process. The use of chemical substances by process was investigated at four fab processes and two module processes at two domestic TFT-LCD(Thin film transistor-Liquid crystal display) panel manufacturing sites. Results: LCD panels are manufactured through various unit processes such as sputtering, chemical vapor deposition(CVD), etching, and photolithography, and a range of chemicals are used in each process. Metal target materials including copper, aluminum, and indium tin oxide are used in the sputtering process, and gaseous materials such as phosphine, silane, and chlorine are used in CVD and dry etching processes. Inorganic acids such as hydrofluoric acid, nitric acid and sulfuric acid are used in wet etching process, and photoresist and developer are used in photolithography process. Chemical substances for the alignment of liquid crystal, such as polyimides, liquid crystals, and sealants are used in a liquid crystal process. Adhesives and hardeners for adhesion of driver IC and printed circuit board(PCB) to the LCD panel are used in the module process. Conclusions: LCD panels are produced through dozens of unit processes using various types of chemical substances in clean room facilities. Hazardous substances such as organic solvents, reactive gases, irritants, and toxic substances are used in the manufacturing processes, but periodic workplace monitoring applies only to certain chemical substances by law. Therefore, efforts should be made to minimize worker exposure to chemical substances used in LCD panel manufacturing process.

Characterizations of a Cold Trap System for the Process Stabilization of Al2O3 by ALD Equipment (ALD 장비의 Al2O3 공정 안정화를 위한 저온 트랩 장치의 특성 평가)

  • Yong Hyeok Seo;Won Woo Lee;In Hwan Kim;Ji Eun Han;Yeon Ju Lee;Che Hoo Cho;Yongmin Jeon;Eou-Sik Cho;Sang Jik Kwon
    • Journal of the Semiconductor & Display Technology
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    • v.23 no.1
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    • pp.92-96
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    • 2024
  • The application of the technology for forming Al2O3 thin films using ALD(atomic layer deposition) method is rapidly increasing in the semiconductor and display fields. In order to increase the efficiency of the ALD process in a mass production line, metallic by-products generated from the ALD process chamber must be effectively collected. By collecting by-products flowing out of the chamber with a cold trap device before they go to the vacuum pump, damage to the vacuum pump can be prevented and the work room can be maintained stably, resulting in increased process flow rate. In this study, a cold trap was installed between the ALD process chamber and the dry pump to measure and analyze by-products generated during the Al2O3 thin film deposition process. As a result, it was confirmed that Al and O elements were discharged, and the collection forms were two types: bulk and powder. And the binding energy peaked at 73.7 ~ 74.3 eV, the binding energy of Al 2p, and 530.7 eV, the binding energy of O 1s, indicating that the binding structure was Al-O.

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Growth and Yield of Sedum sarmentosum as Affected by Planting Density in Cultivation System Using a Rice Nursery Tray (벼 육묘상자를 이용한 돌나물 재배에서 삽식밀도에 따른 생육 및 수량)

  • Kim, Hyo-Jin;Lee, Seung-Yeob
    • KOREAN JOURNAL OF CROP SCIENCE
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    • v.53 no.2
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    • pp.196-202
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    • 2008
  • To establish a cultivation system of Sedum sarmentosum using a rice nursery tray ($30{\times}60{\times}3\;cm$) in non-heating plastic film house, cuttings of two local strains (Wanju and Keumsan) were prepared and planted at different planting densities (40, 60 and 80 cuttings per tray) on September 7th, and subsequent growth and yield at pre- and post-winter season were investigated. When pre-wintering growth were measured at 60 days after planting, high planting density (80 cuttings/tray) decreased leaf length and lateral shoot number per plant compared to 40 cuttings/tray. When post-wintering growth were measured on April 20th, no significant growth differences as affected by planting density were observed in Keumsan strain, while decreased stem diameter, node number and leaf number were observed in Wanju strain planted at 80 cuttings/tray compared to 40 cuttings/tray. Fresh and dry weights were not significantly different as affected by planting density, but those were significantly increased in Wanju strain compared to Keumsan strain. When regrowth characteristics followed by the first harvest were measured on June 5th, significantly increased stem number was observed at 80 cuttings/tray compared to 40 cuttings/ tray. Fresh and dry weight were significantly increased in Keumsan strain planted at 80 cuttings/tray compared to 40 cuttings/tray, and dry weight were increased in Wanju strain compared to Keumsan strain. Wanju strain showed higher shoot yield, thicker stem, shorter node and larger leaf, and non-succulent stem under high planting density compared to Keumsan strain. Accordingly, the optimum density was 40 cuttings per tray, and Wanju strain was adequate for the cultivation system using a rice nursery tray.

Effect of Alloy Addition (Ta, Nb) on Oxidation Behavior of cp-Ti for Biomaterials (생체용 Ti합금의 산화거동에 미치는 Ta 및 Nb 첨가의 영향)

  • Lee Doh-Jae;Oh Tae-Wook;Park Bum-Su;Kim Soo-Hak;Jun Choong-Geug;Yoon Kye-Lim
    • Korean Journal of Materials Research
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    • v.14 no.3
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    • pp.211-217
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    • 2004
  • The oxidation behaviors of Ti-10Ta-10Nb alloy and Ti-6Al-4V alloy were studied in dry air atmosphere. Specimens were melted in consumable vacuum arc furnace and homogenized at $1050^{\circ}C$ for 24 h. Hot rolling was performed at $1000^{\circ}C$. Specimens of the alloys were oxidized as the temperature range $400~650^{\circ}C$ for 30 min. The oxidation behavior of the alloys was analysed by optical microscope, SEM/EDX, XRD, XPS and TGA. Immersion test was performed in 1% Lactic acid. In the microscope observation, oxide layer of Ti-10Ta-10Nb alloy was denser and thinner than Ti-6Al-4V's. The weight gains during the oxidation rapidly increased at the temperature above $600^{\circ}C$ in Ti-6Al-4V's alloy and$ 700^{\circ}C$ in Ti-10Ta-10Nb alloy. According to XRD results, oxide layers were composed of mostly $TiO_2$(rutile) phase. It was analysed that the passive film of the Ti alloys consisted of $TiO_2$ through X-ray photoelectron spectroscopy(XPS) analysis.

Study on Thermal Conductive PV(PhotoVoltaic) Backsheet using MgO Masterbatch with High Thermal Conductivity (고열전도도 MgO를 이용한 열전도성 PV(PhotoVoltaic) 백시트의 연구)

  • Kim, Chang-Hee;Jang, Hyun-Tae;Park, Jong-Se;Yoon, Jong-Kuk;Noh, Eun-Seob;Park, Ji-Soo;Koo, Kyung-Wan
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.67 no.3
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    • pp.448-453
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    • 2018
  • PV module protective film plays an important role in protecting the solar cell from external environment by anti-hydrolysis polyester, UV resistance and mechanical properties. The backsheet was manufactured by using Roll-to-Roll dry laminating process. The backsheet structure is composed of 3 layers, which are PE, PET, and Fluorine polymer films. In this study, we have experimented the variation of thermal conductivities depending on MgO inputs 10% to 25% in order to confirm the dependence of the module efficiencies. High thermal conductive backsheet can increase the module output power efficiency because the heat is dissipated by spreading out the internal heat. Long-term environment weatherability tests were conducted for confirming 25 year reliability in the field such as PCT, UV, and power efficiency degradations. As the evaluation result, high thermal conductivity can be effective for increase of power efficiency of solar panel by using thermal conductive MgO masterbatch.

Effect of Desmear Treatment on the Interfacial Bonding Mechanism of Electroless-Plated Cu film on FR-4 Substrate (Desmear 습식 표면 전처리가 무전해 도금된 Cu 박막과 FR-4 기판 사이의 계면 접착 기구에 미치는 영향)

  • Min, Kyoung-Jin;Park, Young-Bae
    • Korean Journal of Materials Research
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    • v.19 no.11
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    • pp.625-630
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    • 2009
  • Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

A comparative study of the quantitative assessment on the panoramic and intraoral radiographs (파노라마 방사선사진과 구내 방사선사진에서 골조직 정량평가의 비교연구)

  • Kim Jae-Duk
    • Imaging Science in Dentistry
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    • v.31 no.3
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    • pp.129-133
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    • 2001
  • Purpose: To compare the copper equivalent values measured at premolar and molar areas in the copper equivalent images of panoramic and intraoral radiographs and to evaluate the possibility of the copper equivalent images of panorama for the assessment the bone density. Materials and Methods : Intraoral radiograms at mandibular premolar and molar area and panoramas of 6 human dry skulls were taken with copper-step wedge by Heliodent MD (Siemens Co., Germany) and by Planmeca (PM 2002 CC, Planmeca, Helsinki, Finland) were used for experiment. The copper equivalent values measured at premolar and molar areas in the copper equivalent im ages of panorama and intraoral film were compared. Results: The copper equivalent values were ranged 0.20 mmCu-0.44 mmCu at the molar areas, 0.05 mmCu-0.31 mmCu at the premolar areas on panoramic images. There were no significant differences (p>0.5) between the copper equivalent values on intraoral images and those on panoramic images measured at premolar areas and molar areas respectively. The correlation coefficient between the copper equivalent values on intraoral images and those on panoramic images was respectively 0.8495 at molar areas and 0.6184 at premolar areas. Conclusions : The copper equivalent images of panorama for the assessment the bone density appeared to be significant at molar area compared with the one of intraoral radiograph.

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A Study on the Structural Stiffness and Coulomb Damping of Air Foil Bearing Considering the Interaction among Bumps (범프들의 상호작용을 고려한 공기 포일 베어링의 구조적 강성 및 쿨롱 감쇠에 대한 연구)

  • Lee, Yong-Bok;Park, Dong-Jin;Kim, Chang-Ho
    • Tribology and Lubricants
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    • v.22 no.5
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    • pp.252-259
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    • 2006
  • Air foil bearing supports the rotating journal using hydrodynamic force generated at thin air film. The bearing performances, stiffness, damping coefficient and load capacity, depend on the rotating speed and the performance of the elastic foundation, bump foil. The main focus of this study is to decide the dynamic performance of corrugated bump foil, structural stiffness and Coulomb damping caused by friction between bump foil and top foil/bump foil and housing. Structural stiffness is determined by the bump shape (bump height, pitch and bump thickness), dry-friction, and interacting force filed up to fixed end. So, the change of the characteristics was considered as the parameters change. The air foil bearing specification for analysis follows the general size; diameter 38.1 mm and length 38.1 mm (L/D=1.0). The results show that the stiffness at the fixed end is more than the stiffness at the free end, Coulomb damping is more at the fixed end due to the small displacement, and two dynamic characteristics are dependent on each other.