• 제목/요약/키워드: Drop ball test

검색결과 36건 처리시간 0.019초

저속충격시 Ball 탄(5.56mm)의 형상변화에 관한 연구 (A Study on the shape deformation of ball projectile(5.56mm) under the low velocity impact)

  • 손세원;이두성;홍성희;김영태
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 춘계학술대회 논문집
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    • pp.865-868
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    • 2002
  • This study investigated the shape deformation of ball projectile(5.56mn) under the low energy impact by the use of the drop weight impact tester. ball projectile(5.56mm) consisted of the copper face with a lead core. The impact conditions were changed with the variations of the mass and the drop height of the impact tup. Shape deformation of ball projectile(5.56mm) after low velocity impact was measured using a video microscope and CCD camera. The test result showed that impact energy by changing of drop height of the impact tup affected shape deformation of ball projectile(5.56mm). So, it is important to study the relativity between shape deformation of ball projectile(5.56mm) and ballistic protection of plate(such as hybrid composite laminates) under the high velocity impact.

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자동차용 강화유리와 그 시험방법에 대한 연구 (A Study on Toughened Glass Used for Vehicles and Its Testing Methods)

  • 안호순;권해붕;이광범;전상우;손영삼
    • 자동차안전학회지
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    • 제7권3호
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    • pp.14-18
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    • 2015
  • Toughened glass is known to have about four times larger external impact resistance than that of original glass. This study is aimed to verify that ceramic-printed toughened glass does not meet of GTR(Global Technical Regulations) No. 6 and its strength is lower than that of original glass through tests. The tests were conducted on the test pieces of original glass, toughened glass, and ceramic-printed toughened glass from five glass manufacturers. In Test 1, a 227g steel ball was dropped from a height of 2 meters, and damage was checked according to the test method of GTR No. 6. In Test 2, a steel ball was freely dropped from different heights and limited damage height was determined. In the result of Test 1 according to the test method of GTR No. 6, while all five test pieces of toughened glasses were not damaged, all the ceramic-printed toughened glass from the five manufacturers were damaged. In the result of Test 2, none of the five test pieces of toughened glass were damaged by a 10m ball drop, meanwhile, the original glasses were damaged by an average of 3m ball drop. And the results of the tests show that the ceramic-printed toughened glass does not have the features of toughened glass due to its very low strength. Therefore, this study contributes to the safety of consumers by considering the GTR No. 6, and by revising the toughened glass test method.

Sn-xAg-0.5Cu 무연 솔더의 파손특성에 관한 실험적 연구 (An Experimental Study on the Failure Characteristics of Sn-xAg-0.5Cu Lead-free Solder)

  • 정종설;이용성;신기훈;정성균;김종형;장동영
    • 한국생산제조학회지
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    • 제18권5호
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    • pp.449-454
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    • 2009
  • This paper presents an experimental study on the failure characteristics of SnAgCu lead-free solder balls. To estimate the effect of Ag, three types of SnAgCu balls are first prepared by varying the weight percent of Ag(1.0, 3.0, 4.0 wt%) and then analyzed by reliability tests such as thermal shock, high speed ball shear, and drop tests. Thermal shock test reveals that the higher the weight percent of Ag is, the longer the fatigue lift becomes. To the contrary, high speed ball-shear test and drop test show that the shear strength and the fracture toughness of solder balls are inversely proportional to the weight percent of Ag, respectively, Reasons for these observations will be further investigated In the future work.

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굴착토를 활용한 속경성 유동성 채움재의 공학적 특성 평가 (Engineering Characteristics Assessment of Rapid Set Controlled Low Strength Material for Sewer Pipe Using Excavated Soil)

  • 김영욱;이봉춘;정상화
    • 한국건설순환자원학회논문집
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    • 제8권4호
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    • pp.450-457
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    • 2020
  • 본 연구에서는 현장 굴착토를 활용한 속경성 유동성 채움재의 배합요인별 유동성, 재료분리 저항성, 재령별 압축강도 등의 공학적 특성을 검토하여 속경성을 발현하는 배합비 및 결합재 조건을 도출하였으며, 이를 토대로 현장 모사 실험을 실시하여 현장에서 적용 가능한 후속공정 개시기 검토 방법의 유효성을 검토하고자 하였다. Kelly ball 낙하시험과 산중식 토양 경도계의 평가결과 유동성 채움재의 후속공정 개시기 확보 가능한 시간은 동일하게 약 3시간으로 나타났으며, 일축압축강도 시험의 결과와 비교하였을 때 Kelly ball 낙하 시험 및 산중식 토양경도계의 현장 적용성에 대한 유효성을 확인할 수 있었다.

부적합 엽맥편이 궐련의 연소중 물리적 특성에 미치는 영향 (Influence of the Objectionable Stems on the Physical Characteristics during the Cigarette Combustion)

  • 김수호;박진원;김종열;이문수
    • 한국연초학회지
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    • 제28권1호
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    • pp.23-30
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    • 2006
  • In order to improve the final product quality, tobacco industry has gradually decreased the size and number of steams in the cigarette. Especially, steams bigger than $3{\times}3$ mm($length{\times}thickness$) and $2{\times}10$ mm($width{\times}length$) are not acceptable in the process as objectionable stems. A total number of 12 samples where the $length{\times}tickness$ samples were prepared by decreasing the present sample ($3{\times}3$ mm) with 1 mm up to $1{\times}1$ mm, and the $width{\times}length$ samples were prepared by decreasing the present sample ($2{\times}10$ mm) with 2 mm up to $2{\times}6$ mm for the stems in leaf and stems in expanded cut-tobacco were prepared to apply a fire ball drop test using stems. In addition, cigarettes were produced for these stems in order to analyze the forced fire ball drop including the burning, encapsulation and unencapsulation pressure drop and a single or unspecified direction combustion. Based on the results of the test, it was evident that the fire ball drop in the stems in expanded cut-tobacco presented a lower level than that of the stems in leaf. Also, the stems in expanded cut-tobacco presented a larger swelling and higher burning for a single direction than that of the stem in leaf. In addition, it was considered that the management criteria for objectionable stems should be changed as $3{\times}3$ mm and $2{\times}8$ mm for the $length{\times}thickness$ and $width{\times}length$ sample, respectively, in both steams in leaf and expanded cut-tobacco.

일체형원자로 제어봉구동장치의 낙하 및 완충특성 (Drop and Damping Characteristics of the CEDM for the Integral Reactor)

  • 최명환;김지호;허형;유제용
    • 한국소음진동공학회논문집
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    • 제20권7호
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    • pp.658-664
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    • 2010
  • A control element drive mechanism(CEDM) is a reactor regulating system, which inserts, withdraws or maintains a control rod containing a neutron absorbing material within a reactor core to control the reactivity of the core. The ball-screw type CEDM for the integral reactor has a spring-damper system to reduce the impact force due to the scram of the CEDM. This paper describes the experimental results to obtain the drop and damping characteristics of the CEDM. The drop tests are performed by using a drop test rig and a facility. A drop time and a displacement after an impact are measured using a LVDT. The influences of the rod weight, the drop height and the flow area of hydraulic damper on the drop and damping behavior are also estimated on the basis of test results. The drop time of the control element is within 4.5s to meet the design requirement, and the maximum displacement is measured as 15.6 mm. It is also found that the damping system using a spring-hydraulic damper plays a good damper role in the CEDM.

극한지 자원이송망 볼밸브 수치모델 및 성능평가장치 개발 (Development of Numerical Model and Experimental Apparatus for Analyzing the Performance of a Ball Valve used for Gas Pipeline in Permafrost Area)

  • 이상문;장춘만
    • 한국수소및신에너지학회논문집
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    • 제25권5호
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    • pp.550-559
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    • 2014
  • Hydraulic performance of the 1 inch ball valve have been analyzed based on the three-dimensional Reynolds-averaged Navier-Stokes analysis and an experiment. The experimental test rig of the 1 inch ball valve has been developed to investigate pressure drop for the 1 inch ball valve. The numerical model, which has reliability and effectiveness, has been constructed through the grid dependency test and validation with the results of the experiment. Shear stress transport turbulence model has been used to enhance an accuracy of the turbulence prediction in the pipeline and ball valve, respectively. Effects of the ball valve angle on the flow characteristics and friction performance have been evaluated.

A Study on the/ Correlation Between Board Level Drop Test Experiment and Simulation

  • Kang, Tae-Min;Lee, Dae-Woong;Hwang, You-Kyung;Chung, Qwan-Ho;Yoo, Byun-Kwang
    • 마이크로전자및패키징학회지
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    • 제18권2호
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    • pp.35-41
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    • 2011
  • Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.

이온강화법을 이용한 소다라임 글라스 강화에 관한 연구 (A study on the strengthening of Sodalime glass using ion exchange method)

  • 안해원;오재호;권수근;최성대
    • 한국기계가공학회지
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    • 제13권6호
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    • pp.145-151
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    • 2014
  • The glass used for mobile display windows is required to have high strength. Chemical strengthening by means of ion exchange is widely used glass. The depth of the layer and the compressed stress are affected by tempering temperature and time. The purpose of this study is to investigate the range of DOL and CS, which to less breakage during reliability tests such as the ball drop test, hole drop test, 3-point bending test, drop test, and tumble test with Soda-lime Glass.

Sn-3.0Ag-0.5Cu 및 Sn-1.0Ag-0.5Cu 조성의 솔더 볼을 갖는 플립칩에서의 보드레벨 낙하 해석 (Board-Level Drop Analyses having the Flip Chips with Solder balls of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu)

  • 김성걸
    • 한국생산제조학회지
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    • 제20권2호
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    • pp.193-201
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    • 2011
  • Recently, mechanical reliabilities including a drop test have been a hot issue. In this paper, solder balls with new components which are Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu-0.05N are introduced, and board level drop test for them are conducted under JEDEC standard in which the board with 15 flip chips is dropped as 1,500g acceleration during 0.5ms. The drop simulations are studied by using a implicit method in the ANSYS LS-DYNA, and modal analysis is made. Through both analyses, the solder balls with new components are evaluated under the drop. It is found that the maximum stress of each chip is occurred between the solder ball and the PCB, and the highest value among the maximum stresses in the chips is occurred on the chip nearest to fixed holes on the board in the drop tests and simulations.