• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.33-37
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• 2008

A noticeable amount of Kirkendall voids formed at the Sn-3.5Ag solder joint with electroplated Cu, and that became even more significant when an additive was added to Cu electroplating bath. With SPS, a large amount of voids formed at the $Cu/Cu_3Sn$ interface of the solder joint during thermal aging at $150^{\circ}C$. The in-situ AES analysis of fractured joints revealed S segregation on the void surface. Only Cu, Sn, and S peaks were detected at the fractured $Cu/Cu_3Sn$ interfaces, and the S peak decreased rapidly with AES depth profiling. The segregation of S at the $Cu/Cu_3Sn$ interface lowered interface energy and thereby reduced the free energy barrier for the Kirkendall void nucleation. The drop impact test revealed that the electrodeposited Cu film with SPS degraded drastically with aging time. Fracture occurred at the $Cu/Cu_3Sn$ interface where a lot of voids existed. Therefore, voids occupied at the $Cu/Cu_3Sn$ interface are shown to seriously degrade drop reliability of solder joints.

• Journal of the Korean Institute of Gas
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• v.15 no.5
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• pp.1-6
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• 2011

It is required to construct the pipelines to eliminate pressure drop at the end of transmission line under limitation of maximum operation pressure of 6.86 MPa, however, it highly costs to build the pipelines and takes time-consuming job. Higher operation pressure compared to current operating pressure has been considered to resolve the problem of pressure drop without modification of the existing pipelines and facilities. As a result of the integrity evaluation, the existing pipelines can be operated up to 7.85 MPa in terms of wall thickness and have higher Charpy impact energy than required value in the ASME B31.8. However, Increment of operation pressure gives rise to increase potential impact area if the pipelines burst due to third party damages.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.77-86
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• 2008

The reliability of leaded and lead-free solders of BGA type packages on a printed circuit board was investigated by employing the standard drop test and 4-point bending test. Tested solder joints were examined by optical microscopy to identify associated failure mode. Three-dimensional finite element analysis(FEM) with ANSYS Workbench v.11 was carried out to understand the mechanical behavior of solder joints under the influence of bending or drop impact. The results of numerical analysis are in good agreement with those obtained by experiments. Packages in the center of the PCB experienced higher stress than those in the perimeter of the PCB. The solder joints located in the outermost comer of the package suffered from higher stress than those located in center region. In both drop and bending impact tests, the lead-free solder showed better performances than the leaded solders. The numerical analysis results indicated that stress and strain behavior of solder joint were dependent on various effective parameters.

• Applied Chemistry for Engineering
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• v.20 no.5
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• pp.511-516
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• 2009

Photodegradation characteristics of polyolefin composites were studied. Thermogravimetric analysis results suggest that the polyolefin blends used in this study have different amounts of talc. The mechanical behaviors of polyolefin blends, which experienced UV-irradiation in accordance with SAE J1960, are investigated using tensile and Izod impact tests. These results show that as the UV-exposure time increases, a significant drop in the elongation at break and impact strength at a low temperature are observed. This may be explained by the decreases in elastic energy derived from the scission of polymer molecular chains and the low density of entanglement after UV- photodegradation. Scanning electron microscopy observations indicate that no crack and surface damage are observed, while the additional talc particles are exposed, on the UV-exposed surfaces. The exposure of talc particles may be responsible for the discoloration of UV-exposed polyolefin blend surface. Observation using Fourier transform infrared spectroscopy (FT-IR) confirms the presence of photodegradation on the surface of UV-exposed polyolefin blend.

• Journal of the Korean Society for Nondestructive Testing
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• v.28 no.2
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• pp.191-198
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• 2008

Flow accelerated corrosion (FAC) phenomenon of low alloy carbon steels in nuclear power plant has been known as one of major degradation mechanisms. It has a potential to cause nuclear pipe rupture accident which may directly impact on the plant reliability and safety. Recently, the equipotential switching direct current potential drop (ES-DCPD) method has been developed, by the present authors, as a method to monitor wall loss in a piping. This method can rapidly monitor the thinning of piping, utilizing either the wide range monitoring (WiRM) or the narrow range monitoring (NaRM) technique. WiRM is a method to monitor wide range of straight piping, whereas NaRM focuses significantly on a narrow range such as an elbow. WiRM and NaRM can improve the reliability of the current FAC screening method that is based on computer modeling on fluid flow conditions. In this paper, the measurements by ES-DCPD are performed with signal sensitivity analyses in the laboratory environment for extended period and showed the viability of ES-DCPD for real plant applications.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.63-71
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• 2022

In this study, the interfacial reaction and drop impact reliability of Sn-Ag-Cu (SAC) solder and electroless nickel autocatalytic gold (ENAG) were studied. In addition, the solder joint properties with the ENAG surface finish was compared with electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG). The IMC thickness of SAC/ENAG and SAC/ENEPIG were 1.15 and 1.12 ㎛, respectively, which were similar each other. The IMC thickness of the SAC/ENIG was 2.99 ㎛, which was about two times higher than that of SAC/ENAG. Moreover, it was found that the IMC thickness of the solder joint was affected by the metal turnover (MTO) condition of the electroless Ni(P) plating solution, and it was found that the IMC thickness increased when the MTO increased from 0 to 3. The shear strength of SAC/ENEPIG was the highest, followed by SAC/ENAG and SAC/ENIG. It was found that when the MTO increased, the shear strength was lowered. In terms of brittle fracture, SAC/ENEPIG was the lowest among the three joints, followed by SAC/ENAG and SAC/ENIG. Likewise, it was found that as MTO increased, brittle fracture increased. In the drop impact test, it was confirmed that the 0 MTO condition had a higher average number of failures than the 3 MTO condition, and the average number of failures was also higher in the order of SAC/ENEIG, SAC/ENAG, and SAC/ENIG. As a result of observing the fracture surface after the drop impact, it was found that the fracture was between the IMC and the Ni(P) layer.

• Journal of Electrical Engineering and Technology
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• v.13 no.6
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• pp.2456-2467
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• 2018

Wireless multimedia sensor networks (WMSNs) require real-time quality-of-service (QoS) guarantees to be provided by the network. The end-to-end delay is very critical metric for QoS guarantees in WMSNs. In WMSNs, due to the transmission errors incurred over wireless channels, it is difficult to obtain reliable delivery of data in conjunction with low end-to-end delay. In order to improve the end-to-end delay performance, the system has to drop few packets during network congestion. In this article, our proposal is based on optimization of end-to end delay for WMSNs. We optimize end-to-end delay constraint by assuming that each packet is allowed fixed number of retransmissions. To optimize the end-to-end delay, first, we compute the performance measures of the system, such as end-to-end delay and reliability for different network topologies (e.g., linear topology, tree topology) and against different choices of system parameters (e.g., data rate, number of nodes, number of retransmissions). Second, we study the impact of the end-to-end delay and packet delivery ratio on indoor and outdoor environments in WMSNs. All scenarios are simulated with multiple run-times by using network simulator-2 (NS-2) and results are evaluated and discussed.

• Journal of Korean Institute of Industrial Engineers
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• v.5 no.1
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• pp.67-82
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• 1979

For many capacity expansion problems, distinct capacity types must be specified to identify capacity at different locations or capacities with different costs and operating characteristics. In this study, a project-sequencing model is developed that allows operating costs to influence the timing decisions for project establishment. Under certain conditions, the power expansion formulation is derived that may be solved through the dynamic programming approach, and its first application to planning in electric power systems is selected to investigate an optimal policy and to show the impact of requiring system to service more than one type of demand. Several sample testing results indicate that in some systems the efficiency of the large nuclear plants is higher than that of smell ones that it may overcome the effects of the drop in reliability.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.7 s.184
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• pp.130-137
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• 2006

TFT-LCD(Thin Film Transistor Liquid Crystal Display) module is representative commercial product of FPD(Flat Panel Display). Thickness of TFT-LCD module is very thin. It is adopted for major display unit for IT devices such as Cellular Phone, Camcorder, Digital camera and etc. Due to the harsh user environment of mobile IT devices, it requires complicated structure and tight assembly. And user requirements for the mechanical functionalities of TFT-LCD module become more strict. However, TFT-LCD module is normally weak to high level transient mechanical shock. Since it uses thin crystallized panel. Therefore, anti-shock performance is classified as one of the most important design specifications. Traditionally, the product reliability against mechanical shock is confirmed by empirical method in the design-prototype-drop/impact test-redesign paradigm. The method is time-consuming and expensive process. It lacks scientific insight and quantitative evaluation. In this article, a systematic design evaluation of TFT-LCD module for mobile IT devices is presented with combinations of FEA and testing to support the optimal shock proof display design procedure.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.51-56
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• 2015

It has been used various pad finish materials to enhance the reliability of solder joint and recently Electroless Ni Electroless Pd Immersion Gold (the following : ENEPIG) pad has been used more than others. This study is about reliability according to being used in commercial Electrolytic Ni pad and ENEPIG pad, and was observed behavior of various Cu contents. After reflow, the inter-metallic compound (IMC) between solder and pad is composed of $Cu_6Sn_5$ (Ni substituted) by using EDS, and in case of ENEPIG, between IMC and Ni layer was observed the dark layer ($Ni_3P$ layer). Additional, it could be controlled the thickness of dark layer according to Cu contents. Investigated the different fracture mode between electrolytic Ni and ENEPIG pad after drop shock test, in case of soft Ni, accelerated stress propagated along the interface between $1^{st}$ IMC and $2^{nd}$ IMC, and in case of ENEPIG pad, accelerated stress propagated along the weaken surface such as dark layer. The unstable interface exists through IMC, pad material and solder bulk by the lattice mismatch, so that the thermal and physical stress due to the continuous exterior impact is transferred to the IMC interface. Therefore, it is strongly requested to control solder morphology, IMC shape and thickness to improve the solder reliability.