• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.33-42
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• 2015

오늘날 연성회로기판(FCCL : Flexible Copper Clad Laminate)은 디스플레이, 스마트폰, 자동차, 항공, 의료 기기, 산업용 컨트롤 기기 등 거의 모든 고급 전자 제품들에 사용되고 있다. 특히 디스플레이 분야에서는 뛰어난 연성과 내구성을 바탕으로 경박단소화에 유리할 뿐만 아니라 구동부에 적용이 가능한 장점 등으로 그 적용처가 점점 늘어나고 있는 추세이다. 이 가운데서도 LCD와 OLED의 구동소자(Display Driver IC)를 장착하는 COF(Chip on Film)는 대표적인 연성회로기판(FCCL) 적용 부품으로서, 최근 인기를 끌고 있는 디스플레이의 제로-베젤(Zero-bezel)을 가능케 하는 핵심 부품이다. COF용 연성회로기판(FCCL) 소재로는 우수한 평탄도, 파인피치(Fine-pitch)구현성, 내굴곡성, 광투과성 등을 보유하고 있는 Sputtering Type FCCL이 사용되고 있다. 특히 최근 Display 분야의 화두가 되고 있는 POLED(Plastic-OLED) 패널을 장착한 Flexible Mobile 디스플레이의 경우, 기존의 COG(Chip on Glass) 접합방식이 아닌 COF 접합방식을 채택하고 있으며, 기존의 단면 COF보다 3배의 고해상도 구현이 가능한 양면 COF를 채택하기에 이르렀다. 기존의 COF 제작공정과 달리 Semi Additive 공정으로 제작되는 양면 COF 시장의 태동으로 양면 연성회로기판(FCCL)의 수요 증가가 예상되는 등 최근 디스플레이 기술 발전은 소재 분야에도 큰 변화를 잉태하고 있다. 이러한 최근 디스플레이 업계의 고해상도, 고속 신호 전송, 슬림화, Flexible 추세에 대응 가능한 최적의 특성을 보유하고 있는 Sputtering Type FCCL을 중심으로 디스플레이의 발전에 대응하는 소재의 기술 개발 동향을 살펴보고자 한다.

• Journal of Satellite, Information and Communications
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• v.7 no.2
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• pp.18-24
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• 2012

High current behaviors of the extended drain n-type metal-oxide-semiconductor field effects transistor (EDNMOSFET) for electrostatic discharge (ESD) protection of high voltage operating LDI (LCD Driver IC) chip are analyzed. Both the transmission line pulse (TLP) data and the thermal incorporated 2-dimensional simulation analysis demonstrate a characteristic double snapback phenomenon after triggering of biploar junction transistor (BJT) operation. Also, background doping concentration (BDC) is proven to be a critical factor to affect the high current behavior of the EDNMOS devices. The EDNMOS device with low BDC suffers from strong snapback in the high current region, which results in poor ESD protection performance and high latchup risk. However, the strong snapback can be avoided in the EDNMOS device with high BDC. This implies that both the good ESD protection performance and the latchup immunity can be realized in terms of the EDNMOS by properly controlling its BDC.

• The Transactions of the Korean Institute of Power Electronics
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• v.19 no.4
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• pp.376-382
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• 2014

This paper proposes the pulse width modulation (PWM) control strategy for low-speed operation in the three-level neutral-point-clamped (NPC) inverters based on the bootstrap gate drive circuit. As a purpose of the cost reduction, several papers have paid attention to the bootstrap circuit applied to the three-level NPC inverter. However, the bootstrap gate driver IC cannot generate the gate signal to the IGBT for low-speed operation, because the bootstrap capacitor voltage decreases under the threshold level. For low-speed operation, the dipolar and partial-dipolar modulations can be the effective solution. However, these modulations have drawbacks in terms of the switching loss and THD. Therefore, this paper proposes the PWM control strategy to operate the inverter at low-speed and to minimize the switching loss and harmonics. The experimental results are presented to verify the validity on the proposed method.

• Journal of Advanced Information Technology and Convergence
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• v.10 no.2
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• pp.153-166
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• 2020

DDI(Display Driver IC) are used to drive numerous pixels that make up display. For stable driving of DDI, it is necessary to attach a protective film to shield electromagnetic waves. When the protective film is attached, defects often occur if the film is inclined or the center point is not aligned. In order to minimize such defects, an algorithm for correcting the center point and the inclined angle using camera image information is required. This technology detects the corner coordinates of the protective film by image processing in order to correct the positional defects where the protective film is attached. Corner point coordinates are detected using an algorithm, and center point position finds and correction values are calculated using the detected coordinates. LUT (Lookup Table) is used to quickly find out whether the angle is inclined or not. These algorithms were described by Verilog HDL. The method using the existing software requires a memory to store the entire image after processing one image. Since the method proposed in this paper is a method of scanning by adding a line buffer in one scan, it is possible to scan even if only a part of the image is saved after processing one image. Compared to those written in software language, the execution time is shortened, the speed is very fast, and the error is relatively small.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.5 s.335
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• pp.31-38
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• 2005

The architecture and the implementation details of a UTMI(USB2.0 Transceiver Macrocell Interface) compatible USB2.0 transceiver chip were presented. To confirm the validation of the incoming data in noisy channel environment, a squelch state detector and a current mode Schmitt-trigger circuit were proposed. A current mode output driver to transmit 480Mbps data on the USB cable was designed and an on-die termination(ODT) which is controlled by a replica bias circuit was presented. In the USB system using plesiochronous clocking, to compensate for the frequency difference between a transmitter and a receiver, a synchronizer using clock data recovery circuit and FIFO was designed. The USB cable was modeled as the lossy transmission line model(W model) for circuit simulation by using a network analyzer measurements. The USB2.0 PHY chip was implemented by using 0.25um CMOS process and test results were presented. The core area excluding the IO pads was $0.91{\times}1.82mm^2$. The power consumptions at the supply voltage of 2.5V were 245mW and 150mW for high-speed and full-speed operations, respectively.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.47 no.1
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• pp.17-28
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• 2010

This paper presents a new automatic TFT-LCD image quality optimization system using DSP for the first time. Since conventional manual method depends on experiences of LCD module developers, it is highly labor-intensive and requires several correction steps providing large gamma correction error. The proposed system optimizes automatically gamma adjustment and power setting registers in mobile TFT-LCD driver IC to reduce gamma correction error, adjusting time, and flicker. It contains module-under-test (MUT, TFT-LCD module), PC installed with program, multimedia display tester for measuring luminance and flicker, and control board for interface between PC and TFT-LCD module. We have developed a new algorithm using 6-point programmable matching technique with reference gamma curve and applying automatic power setting sequence. Developed algorithm and program are generally applicable for most of the TFT-LCD modules. It is realized to calibrate gamma values of 1.8, 2.0, 2.2 and 3.0, and reduce flicker level. The control board is designed with DSP and FPGA, and it supports various interfaces such as RGB and CPU. Developed automatic image quality optimization system showed significantly reduced gamma adjusting time, reduced flicker, and much less average gamma error than conventional manual method. We believe that the proposed system is very useful to provide high-quality TFT-LCD and to improve developing process using optimized gamma-curve setting and automatic power setting.

• International Journal of Highway Engineering
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• v.7 no.4 s.26
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• pp.173-184
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• 2005

Pavement markings delineate driver's sight and attentions at day and night. Retroreflectivities of the pavement markings are known to be affected by some factors such as geometrical characteristics of road sections, marking materials, traffic volumes, weather, and so on. Therefore, pavement markings would have different retroreflectivities place by place. The objective of this paper is to contend that there are rises and falls of retroreflectivity of specific geometrical characteristics of road section based on observed field data. For this purpose, retroreflectivities of yellow continued lines and white skip lines were measured on the freeway sections from Hanam to Nami interchanges. And then, the sections are categorized based on road geometric or facility types. From this study, it may be concluded that there exist considerably lower retroreflectivity trends of pavement markings at sharply curved sections, climbing lane sections, ramp sections, and tunnel sections than averaged retroreflectivity trends on freeway sections. This may leads to the necessity of differential pavement marking managements.

• International Journal of Highway Engineering
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• v.14 no.3
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• pp.87-96
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• 2012

This research overcomes limit of prevention of disasters connection manual that was stopping in existing administrative formality presentation, and allowed purpose in substantial prevention of disasters countermeasure presentation through powerful engineering access. Did operation plan manual Tuesday in contiguity crossing that can reduce confusion by vehicleses that detour by contiguity IC of disaster point to do unusualness ashes in freeway section for this and solve jam-up phenomenon that occur by processing way insufficiency for roundabout way vehicles when happen. Metropolitan areas to target type classification in the highway along the highway adjacent to the intersection at Main Line Blocking optimum operating point analysis and an analysis of countermeasures in case of disaster, the lower the road entering the highway depending on the type of operating at the intersection were different. Depending on the results of analysis, while each point of a disaster, according to the characteristics of geometric conditions, traffic conditions, identify and determine the operating room and the adjacent intersection of media, and building systems to promote the driver if the quick initial response from the impending disaster situations and the safety of drivers can be considered secure.

• Journal of the Korean Institute of Telematics and Electronics T
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• v.35T no.1
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• pp.67-74
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• 1998

The primary cause of air pollution by vehicles is imperfect combustion of fuel. One of the most usual causes of this imperfect combustion is the misfire in IC engins. The U.S. EPA(Environment Protection Agency) and the CARB(California air Resources Board) have imposed regulations for the detection of misfiring in automotive engines. The OBD-II regulations require that misfire should be monitored by the engine diagnostic system, and that the goal of OBD-II is to alert the driver to the presence of a malfunction of the emission control system. Several solutions to the misfire detection problem have been proposed for the detection of misfires. However, the performance of these methods in the presence of misfire is not altogether clear. This paper presents a precise method and system for internal combustion engine misfire. Present invention based upon measurements of engine roughness as derived from crankshaft angular velocity measurements with special signal processing method. Crankshaft angular velocity signals are processed by WDPT, so that the more reliable misfire detection than the time domain analysis. Experimental work confirms that it is possible to apply the WDFT for the detection of misfires in no-load idle and road testing.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.29 no.3
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• pp.310-321
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• 2019

Objectives: The purpose of this study was to investigate types and characteristics of chemical substances used in LCD(Liquid crystal display) panel manufacturing process. Methods: The LCD panel manufacturing process is divided into the fabrication(fab) process and module process. The use of chemical substances by process was investigated at four fab processes and two module processes at two domestic TFT-LCD(Thin film transistor-Liquid crystal display) panel manufacturing sites. Results: LCD panels are manufactured through various unit processes such as sputtering, chemical vapor deposition(CVD), etching, and photolithography, and a range of chemicals are used in each process. Metal target materials including copper, aluminum, and indium tin oxide are used in the sputtering process, and gaseous materials such as phosphine, silane, and chlorine are used in CVD and dry etching processes. Inorganic acids such as hydrofluoric acid, nitric acid and sulfuric acid are used in wet etching process, and photoresist and developer are used in photolithography process. Chemical substances for the alignment of liquid crystal, such as polyimides, liquid crystals, and sealants are used in a liquid crystal process. Adhesives and hardeners for adhesion of driver IC and printed circuit board(PCB) to the LCD panel are used in the module process. Conclusions: LCD panels are produced through dozens of unit processes using various types of chemical substances in clean room facilities. Hazardous substances such as organic solvents, reactive gases, irritants, and toxic substances are used in the manufacturing processes, but periodic workplace monitoring applies only to certain chemical substances by law. Therefore, efforts should be made to minimize worker exposure to chemical substances used in LCD panel manufacturing process.