• 한국기계가공학회지
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• 제11권5호
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• pp.99-103
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• 2012

Presently, A glass is widely used in telecommunication system, optoelectronic devices and micro electro mechanical systems. Micro drilling of glass using the laser can save processing cost and improve the accuracy. This paper experiments micro drilling using KrF excimer laser on the pyrex glass of $500{\mu}m$ thickness. We have experiment to find out optimum laser machining conditions of micro drilling of glass and ablation depth and influence by processing parameter suc'h pulse repetition rate, energy density and number of pulses. Pulse repetition rate don't influence ablation depth at the micro drilling of pyrex glass. Energy density influence micro drilling of parallelism and maximum thickness that can be drilled. Ablation depth is most influenced by number of pulses.

• 한국레이저가공학회지
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• 제10권3호
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• pp.11-14
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• 2007

A trepanning optics is the optical system which makes focus laser beam rotate and incline to the material processing surface. The trepanning optics is used in order to improve the quality of laser drilling process and control the taper of drilling diameter. In order to make trepanning optics, we can use the eccentricity of lens, scanner using two mirror, dove prism, or wedge. Among these method, in this paper wedge is used for trepanning optics. The wedge trepanning optics has advantage on the high speed of rotation. In this paper, we design the wedge trepanning optics using ray tracing. ements and engine design variables of system to satisfy the customer's requirements.

• 한국정밀공학회지
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• 제27권10호
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• pp.40-44
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• 2010

Laser drilling is an enabling technology for Through Silicon Via (TSV) interconnect applications. Recent advances in picoseconds laser drilling of blind, micron sized vias in silicon is presented here highlighting some of the attractive features of this approach such as excellent sidewall quality. In this study, we dealt with comparison of heat affection around drilled hole between a picosecond laser and a nanosecond laser process under the UV wavelength. Points which special attention should be paid are that picosecond laser process lowered experimentally recast layer, surface debris and micro-crack around hole in comparison with nanosecond laser process. These finding suggests that laser TSV process has possibility to drill under $10{\mu}m$ via. Finally, the laser drilling platform was constructed successfully.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.269-270
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• 2013

• 한국정밀공학회지
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• 제26권12호
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• pp.41-46
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• 2009

• 한국정밀공학회지
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• 제15권6호
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• pp.40-47
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• 1998

Drilling is an indispensable process in manufacturing of the die and mould and the other mechanical parts which needs high dimensional and surface accuracy. In this paper, a new type of drilling method was proposed in order to improve both processing efficiency and accuracy. Specifically, the helical motion using ball end mill tools, instead of normal drilling method, was applied to perform an effective hole machining. In this paper, an theoretical background of the new type of drilling method was established, and the feasibility of the proposed theory was proved by experiments, where proposed drilling process in the paper gave a different machining specification than general method did.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 추계학술대회 논문집
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• pp.131-132
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• 2010

• Structural Engineering and Mechanics
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• 제80권5호
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• pp.503-522
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• 2021

This paper investigates experimentally and numerically the influence of drilling process on the mechanical and thermomechanical behaviors of woven glass fiber reinforced polymer (GFRP) composite plate. Through the experimental analysis, a CNC machine with cemented carbide drill (point angles 𝜙=118° and 6 mm diameter) was used to drill a woven GFRP laminated squared plate with a length of 36.6 mm and different thicknesses. A produced temperature during drilling "heat affected zone (HAZ)" was measured by two different procedures using thermal IR camera and thermocouples. A thrust force and cutting torque were measured by a Kistler 9272 dynamometer. The delamination factors were evaluated by the image processing technique. Finite element model (FEM) has been developed by using LS-Dyna to simulate the drilling processing and validate the thrust force and torque with those obtained by experimental technique. It is found that, the present finite element model has the capability to predict the force and torque efficiently at various drilling conditions. Numerical parametric analysis is presented to illustrate the influences of the speeding up, coefficient of friction, element type, and mass scaling effects on the calculated thrust force, torque and calculation's cost. It is found that, the cutting time can be adjusted by drilling parameters (feed, speed, and specimen thickness) to control the induced temperature and thus, the force, torque and delamination factor in drilling GFRP composites. The delamination of woven GFRP is accompanied with edge chipping, spalling, and uncut fibers.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2023년도 가을학술발표대회논문집
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• pp.15-16
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• 2023

In this paper, we aimed to develop a new method for diagnosing the depth of neutralization in architectural and civil engineering structures using the core drilling method, which combines the speed of drilling with the accuracy of core ringing. When compared to the drilling method, the core drilling method showed a lower measurement deviation of 1-2mm (7.6%) in confirming the depth of neutralization. This is believed to be a result of potential interference during the sample collection process in the drilling method, where the drill may pass through aggregates, leading to overestimation, as indicated in previous studies. The rapid evaluation of neutralization using the core drilling method serves as an alternative to address the issues associated with both drilling and core ringing methods in diagnosing the depth of neutralization. It offers a solution to the inaccuracy caused by coarse aggregates and the cumbersome post-processing steps required for neutralization diagnosis. Our proposed technique aims to provide an accurate and expedited diagnosis of neutralization depth without the need for additional processes.

• 한국태양에너지학회 논문집
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• 제31권4호
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• pp.103-111
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• 2011

Laser drilling of vias is the one of key technologies in developing Emitter-Wrap Through(EWT) solar cell which is particularly attractive due to the use of industrial processing and common solar grade p-type silicon materials. While alternative economically feasible drilling process is not available to date, the processing time and laser induced damage should be as small as possible in this process. This paper provides an overview on various factors that should be considered in using the laser via drilling technology for developing highly efficient and industrially applicable EWT solar cells.